technical ceramic solutions

High Thermal Conductivity AlN DPC Ceramic Substrate for Power Modules, LED & RF Packaging

The ceramic-based metalized substrate has good thermal and electrical properties. It is an excellent material for power LED packaging, purple light, and ultraviolet light. It is especially suitable for multi-chip packaging (MCM) and substrate direct bonding chip (COB), etc. package structures.

Click Here for more information:https://www.innovacera.com/news/what-are-the-advantages-of-metallized-ceramic-substrates-in-led-packaging.html

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