Compared with traditional DBC substrates, ceramic substrates prepared by AMB process not only have higher thermal conductivity and better copper layer bonding, but also have advantages such as lower thermal resistance and higher reliability. In addition, because its processing process can be completed in one heating, it is easy to operate, has a short time cycle, good sealing performance and a wide range of applications for ceramics, so this process has developed rapidly at home and abroad and has become a commonly used method in electronic devices.

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