technical ceramic solutions

Uses and Characteristics of Ceramic Substrate

Ceramic substrate refers to copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sided) at high temperature on a special process plate. The ultrathin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing and high adhesion strength, and can be etched into a variety of graphics like PCB board, with great current-carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology.

High-power semiconductor module; Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit.
Intelligent power module; High frequency switching power supply, solid state relay.
Automotive electronics, aerospace and military electronics components.
Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics.

Strong mechanical stress, stable shape; High strength, high thermal conductivity, high insulation; Strong binding force, anti-corrosion.
Excellent thermal cycle performance, cycle times up to 50,000, high reliability.
And PCB board (or IMS substrate) can be etched out of a variety of graphic structure; No pollution, no pollution.
Ceramic Substrate Use temperature range -55℃ ~ 850℃; Thermal expansion coefficient is close to silicon, simplifying the production process of power module.

Aluminum Nitride Ceramic Substrate

Aluminum Nitride Ceramic Substrate