technical ceramic solutions

Ceramic Substrate

  • Uses and Characteristics of Ceramic Substrate Company

    Ceramic substrate refers to copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sided) at high temperature on a special process plate. The ultrathin composite substrate has excellent el…

  • Active Metal Brazed (AMB) Ceramic Substrate Company

    AMB (Active Metal Brazing) is for joining ceramics that are not wetted by 'conventional' brazes. Applying active metal like titanium is added to the braze alloy, to achieve a chemically reacts with the surface of the parent ceramic. Due to the …

  • Global Active Metal Brazed (AMB) Ceramic Substrate Market Company

    Global Active Metal Brazed (AMB) Ceramic Substrate Market to reach USD 1.52 billion by 2027. The global Active Metal Brazed (AMB) Ceramic Substrate Market is valued at approximately USD 1.07 billion in 2020 and is anticipated to grow with a healthy g…

  • Alumina (Al2O3) Ceramic Substrates for Resistors Company

    Alumina is the most commonly used technical ceramic material. Thanks to its very good electrical insulation, dielectric strength, and high-temperature resistance up to 1500 °C, Alumina Ceramic is ideal for electrical applications and high-tempera…

  • AIN Wafer – One Of The Most Popular Ceramic Substrate Company

    INNOVACERA provides AlN ceramic substrate. AlN substrate is one of the most popular ceramic substrates which has excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss. The surface of the AlN substrate…

  • Alumina ceramic substrates for the automotive industry Company

    Alumina ceramics is a ceramic material with a-Al2O3 as the main crystalline phase. Because of its high melting point, high hardness, heat resistance, corrosion resistance, and electrical insulation characteristics, it can be used under harsher …

  • Performance required for ceramic substrates and packages Company

    Ceramic substrates and packages are used for semiconductor packages and electronic modules, of which the speedy operation and high integration are advancing, and sensor modules, of which the high precision and high sensitivity are advancing. T…

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