Ceramic Substrate

The Through Ceramic Via (TCV) interconnection technology is an innovative approach for high-density three-dimensional packaging. Traditional ceramic substrate metallization schemes often encounter challenges such as residual liquid inside the holes,…

With the continuous development and advancement of electronic devices, high power density and high temperature have become one of the important challenges faced by modern electronic systems. Thermal management is a key factor in maintaining the relia…

Ceramic substrate refers to copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double sided) at high temperature on a special process plate. The ultrathin composite substrate has excellent el…

AMB (Active Metal Brazing) is for joining ceramics that are not wetted by 'conventional' brazes. Applying active metal like titanium is added to the braze alloy, to achieve a chemically reacts with the surface of the parent ceramic. Due to the …

Global Active Metal Brazed (AMB) Ceramic Substrate Market to reach USD 1.52 billion by 2027. The global Active Metal Brazed (AMB) Ceramic Substrate Market is valued at approximately USD 1.07 billion in 2020 and is anticipated to grow with a healthy g…

Aluminum Nitride Ceramic (AlN) is a special ceramic material that combines high thermal conductivity with high electrical resistivity. Only a few ceramics possess high thermal conductivity: Such as Beryllium Oxide (BeO) and cubic Boron Nitride (c…

Alumina is the most commonly used technical ceramic material. Thanks to its very good electrical insulation, dielectric strength, and high-temperature resistance up to 1500 °C, Alumina Ceramic is ideal for electrical applications and high-tempera…

INNOVACERA provides AlN ceramic substrate. AlN substrate is one of the most popular ceramic substrates which has excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss. The surface of the AlN substrate…

Alumina ceramics is a ceramic material with a-Al2O3 as the main crystalline phase. Because of its high melting point, high hardness, heat resistance, corrosion resistance, and electrical insulation characteristics, it can be used under harsher …

Ceramic substrates and packages are used for semiconductor packages and electronic modules, of which the speedy operation and high integration are advancing, and sensor modules, of which the high precision and high sensitivity are advancing. T…