Ceramic substrates and packages are used for semiconductor packages and electronic modules, of which the speedy operation and high integration are advancing, and sensor modules, of which the high precision and high sensitivity are advancing. T…

What is a VCSEL? VCSEL stands for Vertical Cavity Surface Emitting Laser, in this case, the laser resonator is aligned to the orthogonal direction with respect to the plane of the semiconductor substrate to allow vertical emission of light. It…

The metallized ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat generation (high-brightness LED, solar energy…

DPC (Direct Plated Copper) Metallized Ceramic Substrate Smaller, Thinner Thin Film, Thick Film Design. Better Heat Dissipation; Longer Lifetime DPC Substrate Why DPC Metallized Substrate? DPC is created for better electrical performance and…

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high-temperature eutectic melting process and thus tightly and firmly joined to the ceramic. DBC Ceramic Substrate …