Global Active Metal Brazed (AMB) Ceramic Substrate Market to reach USD 1.52 billion by 2027. The global Active Metal Brazed (AMB) Ceramic Substrate Market is valued at approximately USD 1.07 billion in 2020 and is anticipated to grow with a healthy growth rate of more than 5.45% over the forecast period 2021-2027.
AMB Ceramic Substrate is a type of soldering in which metal is brazed to ceramic without metallization. increasing government initiatives in the automotive sector, increasing demand for medium and high voltage systems, and Increasing demand for home and electronic appliances are factors contributing to the market growth.
Aluminum Nitride AMB Substrate Advantage:
The combination is achieved by a chemical reaction between ceramic and active metal solder paste at high temperatures, so its bonding strength is higher and reliability is better contributing to the market growth.
The reliability of the AMB process depends largely on the composition of active filler metal, the brazing process, the brazing layer structure, and many other key factors
AMB Substrate Application:
Ceramic coppered substrate for packaging IGBT modules for electric vehicles and motor vehicles