Metallization of Ceramics for Electronic Packaging

Ceramic metallization is the process of applying a thin, adherent metal layer onto a ceramic surface, enabling it to be brazed to other components. This is fundamental for electronic packaging, creating hermetic seals for sensors, RF packages, and power modules that require both electrical conductivity and insulation. Innovacera offers various metallization services, including Mo-Mn and thick-film techniques, to create reliable, high-performance ceramic-to-metal assemblies for the electronics industry.