The Through Ceramic Via (TCV) interconnection technology is an innovative approach for high-density three-dimensional packaging. Traditional ceramic substrate metallization schemes often encounter ch…
INNOVACERA
DBC
The ceramic-based metalized substrate has good thermal and electrical properties. It is an excellent material for power LED packaging, purple light, and ultraviolet light. It is especially suitable fo…
At present, high-performance aluminum nitride ceramic plates are used as thermal conductive substrates in advanced packaging processes, and copper is directly bonded on aluminum nitride to further des…
The metallized ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat…
DBC Ceramic Substrate Specifications:Material: 96% Alumina + Cu/Ag Coating.Max Size: 138*188mmThickness: 0.25-1.0mm (0.25, 0.38, 0.5, 0.63, 0.76, 1.0mm).General Size:2″*2″(50.8*50.8mm)3…