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An Introduction to Through Ceramic Via (TCV) interconnection technology Company
The Through Ceramic Via (TCV) interconnection technology is an innovative approach for high-density three-dimensional packaging. Traditional ceramic substrate metallization schemes often encounter challenges such as residual liquid inside the holes,…
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What Are The Advantages Of Metallized Ceramic Substrates In LED Packaging? Company
The ceramic-based metalized substrate has good thermal and electrical properties. It is an excellent material for power LED packaging, purple light, and ultraviolet light. It is especially suitable for multi-chip packaging (MCM) and substrate direct …
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Advantages Of AlN Ceramic Materials Used As Copper Clad Substrate Materials Company
At present, high-performance aluminum nitride ceramic plates are used as thermal conductive substrates in advanced packaging processes, and copper is directly bonded on aluminum nitride to further design circuits, surface mount transistors, and power…
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Process Comparison of the Ceramic Substrate Company
The metallized ceramic substrate is a kind of circuit board. It has a thermal expansion coefficient close to that of semiconductors and high heat resistance. It is suitable for products with high heat generation (high-brightness LED, solar energy…
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Direct Bond Copper/DBC Ceramic Substrate For Electronics Company
DBC Ceramic Substrate Specifications: Material: 96% Alumina + Cu/Ag Coating. Max Size: 138*188mm Thickness: 0.25-1.0mm (0.25, 0.38, 0.5, 0.63, 0.76, 1.0mm). General Size: 2"*2"(50.8*50.8mm) 3"*3"(76.2*76.2mm) 4"*4"(101.6*101.…
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