Direct bonded copper (DBC) ceramic substrates create robust thermal and electrical interconnection platforms by bonding oxygen-free copper layers (0.1-0.6mm thick) to ceramic substrates like alumina or aluminum nitride through high-temperature oxidation processes. These substrates handle extreme current loads (300A+) and power densities exceeding 500W/cm² in IGBT modules, MOSFET arrays, and thyristor packages. Innovacera's DBC process achieves exceptional bond strength (>20 N/cm² peel strength) and thermal cycling reliability, making them ideal for automotive traction inverters, industrial motor drives, and renewable energy systems. The copper layers can be pre-patterned or chemically etched to create complex circuit geometries with minimal undercut and excellent edge definition. With thermal conductivity up to 200 W/mK (for AlN DBC) and dielectric strength >15 kV/mm, our DBC substrates outperform conventional PCB materials in high-voltage, high-frequency applications. Innovacera provides complete DBC solutions including design support, prototyping, and volume production for power electronic assemblies requiring superior thermal management and electrical performance.