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Cooling in Power Electronics Company
Power electronics devices such as MOSFETs, GTOs, IGBTs, IGCTs etc. are now widely used to efficiently deliver electrical power in home electronics, industrial drives, telecommunication, transport, electric grid and numerous other applications. [ca…
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What Is Ceramic Heat Sink? Company
Components of modern technology products, such as computer chips or light-emitting diodes, generate more and more waste heat during operation, and generally existing heat dissipation devices used to assist heat dissipation components usually include …
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TO-3P/220/247/254/257/258/264 Aluminum Nitride Ceramic Thermal Pads For MOSFET Transistor IGBT Transistor Heat Sink Company
Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat …
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Why Aluminum Nitride (AlN) ceramic is a preferred choice for substrate and thermal management applications? Company
Aluminum Nitride Ceramic (AlN) is a special ceramic material that combines high thermal conductivity with high electrical resistivity. Only a few ceramics possess high thermal conductivity: Such as Beryllium Oxide (BeO) and cubic Boron Nitride (c…
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The Ideal Material of Thermal Management – Aluminum Nitride Ceramic Components Company
Aluminum Nitride Ceramic (AlN) is an ideal material widely used in situations that demand both high thermal conductivity and electrical insulation. This unique ability makes AIN ideal for managing rapid heating and removal of heat from other componen…