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The Use of Silicon Nitride Ceramic

Silicon nitride ceramic is composed of silicon and nitrogen atoms. Its volume density is around 3.26g/cm and its hardness is more than 1600MPa.

Here is the material properties :

With the material properties above, it possesses a range of characteristics that make it valuable in various applications:

1. Lightweight: Compared to steel materials silicon nitride ceramics are relatively lightweight about 60%. This characteristic is beneficial in applications where weight reduction is important.

2. High-Temperature Stability: Silicon nitride ceramics can endure high temperatures without losing their mechanical properties. They can retain strength and integrity even at temperatures exceeding 1000°C, with a max working temperature of 1650 °.

3. Mechanical Strength: Silicon Nitride Tube has excellent mechanical properties, including high hardness, strength, and toughness. It can endure heavy loads and resist fracture, suitable for structural components in demanding applications like valves.

4. Electrical Insulation: Silicon nitride ceramics is an excellent electrical insulator, with high dielectric strength and low electrical conductivity.

With characteristics of lightweight, high-temperature stability, mechanical strength, and electrical insulation on chemical inertness, it has many applications:

*Ball Bearings and Rolling Elements: Silicon nitride balls and rollers are used in bearings where high-speed rotation, high temperature, and corrosion resistance are required. Compared to traditional steel bearings, it has superior hardness and low friction.

*Gas Turbines and Aerospace Components: Silicon nitride components are used in gas turbines and aerospace due to their excellent thermal shock resistance, high-temperature strength, and lightweight properties.

*Electronics and Semiconductor Industry: Silicon nitride is used as an insulating material in electronic devices and semiconductor manufacturing. It is employed in components such as insulating layers and substrates due to its excellent electrical insulator, high-temperature stability, and chemical inertness.

*High-Temperature Furnace Components: Silicon nitride components such as thermocouple protection tubes, radiant tubes, and heating elements are used in the construction of high-temperature furnaces, kilns, and heating elements due to their ability to withstand extreme temperatures and thermal cycling without degradation.

Silicon nitride ceramic has been used in the above industries.

Its exceptional properties high strength, toughness, thermal shock resistance, and corrosion resistance, make it a good choice for demanding applications. From the semiconductor industry to aerospace components, silicon nitride ceramics offer reliability and longevity, contributing to performance and efficiency. However, high processing costs and difficulty in machining limit its widespread adoption. Nonetheless, our engineering team keeps ongoing research and development aim to solve these hurdles, unlocking further potential for silicon nitride ceramic in diverse fields.

Advantages of Aluminum Nitride Ceramics in Wafer Cover Plate Heater Applications

In the semiconductor manufacturing process, the aluminum nitride ceramic wafer cover plate is a key component for carrying wafers, and its performance directly affects the quality and processing efficiency of the wafers.

Aluminum nitride ceramics (Aluminum Nitride Ceramic) is a new type of ceramic material with excellent thermal conductivity, electrical insulation, and mechanical properties. Its thermal conductivity can reach 320W/m·K, which is more than 10 times that of alumina ceramics, its electrical insulation can reach more than 10^13Ω·cm, and its bending strength can reach more than 350MPa. These excellent properties make aluminum nitride ceramics have a wide range of application prospects in the field of semiconductor manufacturing.

Advantages of aluminum nitride ceramics in wafer cover plate applications

High thermal conductivity

In the semiconductor manufacturing process, wafers need to be processed in a high-temperature environment, such as photolithography, etching, ion implantation, etc. The high thermal conductivity of aluminum nitride ceramics can ensure that the wafer reaches the temperature required by the process in a short time, improving production efficiency; at the same time, high thermal conductivity also helps to uniform the temperature of the wafer, reduce thermal stress, and improve the quality of the wafer.

Excellent heat dissipation performance

During the wafer processing process, some processes will generate a lot of heat, such as laser etching, plasma etching, etc. The excellent heat dissipation performance of aluminum nitride ceramics can quickly transfer heat to the environment, prevent the wafer temperature from being too high, reduce the risk of thermal damage, and improve the quality of wafer processing.

High electrical insulation

During the semiconductor manufacturing process, the surface of the wafer will be coated with conductive materials such as photoresist and anti-reflection layer. The high electrical insulation of aluminum nitride ceramics can effectively prevent the accumulation of charge between the wafer surface and the tray, avoid discharge, and improve the quality of wafer processing.

Good mechanical properties

Aluminum nitride ceramics have high bending strength and hardness, which can ensure that the wafer plate is not easy to wear and crack during transportation and loading and improve the service life of the wafer plate. In addition, the linear expansion coefficient of aluminum nitride ceramics is similar to that of silicon wafers, which is conducive to reducing thermal stress and reducing the risk of wafer warping.

Corrosion resistance

During the semiconductor manufacturing process, the wafer cover plate will be exposed to various chemical reagents, such as photoresist, etching solution, etc. Aluminum nitride ceramics have good corrosion resistance and can resist the erosion of these chemical reagents, ensuring the stability and service life of the wafer plate.

No pollution

Aluminum nitride ceramics have good chemical stability and will not react with the materials on the surface of the wafer, avoiding the generation of impurities and ensuring the quality of wafer processing. At the same time, the production process of aluminum nitride ceramics is more environmentally friendly, which is conducive to reducing the overall carbon emissions of the semiconductor manufacturing industry.

As a wafer cover plate material, aluminum nitride ceramics have the advantages of high thermal conductivity, excellent heat dissipation performance, high electrical insulation, good mechanical properties, corrosion resistance, and no pollution. In the field of semiconductor manufacturing, the application of aluminum nitride ceramic wafer cover plates can improve production efficiency, reduce costs, and improve water quality, which has important practical significance. Innovacera could offer two types of aluminum nitride ceramics, one is aluminum nitride and another is hot pressed aluminum nitride, the main difference is the purity, hot pressed ALN purity is higher than ALN, and thermal conductivity is also different.

If you have any questions about the aluminum nitride ceramic, welcome to contact us at sales@innovacera.com.

What’s Difference Of Horizontal and Planetary Ball Mills Equipment

The Zirconia Ceramic Ball mill jar is one part of all kinds of grinding and mixing materials equipment. During the various types of ball mill jars, horizontal and planetary ball mill equipment are mostly used. Now let’s explore the differences between these two types of ball mill equipment so that you can select the right equipment for related application.

Planetary sand mill equipment

A planetary ball mill is an efficient ball mill equipment, its grinding principle is the grinding tank as a planet, through the interaction of the planet and the grinding ball, the grinding ball in the tank’s high-speed movement, and friction and collision with the sample or abrasive, to achieve the purpose of grinding. Planetary ball mill is suitable for the preparation of high-purity materials cell crushing and other fields, its biggest advantage is that the grinding efficiency is high, and the grinding particle size is adjustable.

Horizontal sand mill equipment

Horizontal sand mill equipment is a roller sand mill, it is a common grinding equipment, the grinding principle is to put the abrasive and sample into the sander tank, and then through the rotation of the grinding disk will be abrasive and sample mixed grinding, to achieve the purpose of sanding. Horizontal sand mill is suitable for pigment, paint, paint, pharmaceutical, food, and other fields. Compared with the planetary ball mill, the horizontal sand mill can grind harder materials, but the grinding efficiency is lower, and the grinding size is not easy to adjust.

The difference between Horizontal and Planetary Ball Mills Equipment

Working principle: The planetary ball mill is grinding through the interaction between the planet and the grinding ball, while the horizontal sander is grinding through the rotation of the grinding disk.

Application field: The planetary ball mill is suitable for the preparation of high-purity materials and cell crushing and other fields; The horizontal sand mill is suitable for pigments, coatings, paints, pharmaceuticals, food, and other fields.

Grinding efficiency: The grinding efficiency of the planetary ball mill is high, and the grinding size can be adjusted; The grinding efficiency of the horizontal sand mill is low, and the grinding particle size is not easy to adjust.

In summary, the application fields, working principles, and grinding efficiency of the planetary ball mill and the horizontal sand mill are very different. When selecting grinding equipment, it should be selected according to the specific grinding needs. For more details about the ceramic milling ball jar, welcome to contact us at sales@innovacera.com.

MCH Heater With PT1000 Temperature Sensor Integrated for Soldering Iron Tool

In the world of soldering, the tools we use are crucial to achieving precise and efficient results. One key component that contributes significantly to the performance of soldering irons is the heating element. Modern soldering irons often use advanced heating technologies like MCH (Metal Ceramic Heaters.) to ensure quick heat-up times, temperature stability, and energy efficiency. Let’s explore what MCH heaters are and how they enhance soldering iron tools.

What is an MCH Heater?

MCH heaters are a type of ceramic heating element used in various applications, including soldering irons. It refers to a ceramic heating element in which a meta tungsten or molybdenum manganese paste is printed on a ceramic casting body and laminated by hot pressing and then co-fired at 1600°C, in a hydrogen atmosphere to co-sinter ceramic and metal. This ceramic composition allows MCH heaters to exhibit exceptional thermal properties and durability.

The key advantage of MCH heaters lies in their rapid response to changes in electrical input, enabling precise control over the temperature of the soldering iron tip. Unlike traditional heating elements such as copper or nickel-based coils, MCH heaters distribute heat more uniformly and efficiently, resulting in improved thermal conductivity and energy conservation.

Benefits of MCH Heaters for Soldering Irons

Fast Heat-Up Time: MCH heaters heat up quickly due to their low thermal mass, reducing the wait time before you can start soldering.

Temperature Stability: These heaters offer excellent temperature control and stability, maintaining consistent heat levels even during prolonged use.

Energy Efficiency: MCH heaters are highly efficient in converting electrical energy into heat, minimizing energy wastage, and reducing operational costs.

Uniform Heating: The uniform heat distribution across the ceramic surface ensures that the soldering tip reaches and maintains the desired temperature evenly.

Compact Design: MCH heaters are compact and lightweight, contributing to the overall ergonomic design of modern soldering irons.

How MCH Heaters Work in Soldering Iron Tools

In a soldering iron equipped with an MCH heater, electrical current flows through the ceramic heating element. The ceramic material rapidly heats up and transfers this heat to the soldering tip, typically made of copper or another conductive material. The MCH heater’s efficient heat transfer mechanism ensures that the soldering tip reaches the desired temperature swiftly and maintains it consistently.

The temperature of the MCH heater can be controlled using a thermostat or electronic control system integrated into the soldering iron. This allows users to set precise temperature levels suitable for different soldering tasks, from delicate electronics work to heavy-duty soldering jobs.

A PT1000 temperature sensor could also be integrated into the MCH heater to help test the temperature and make the design more compact. See below the drawing and picture of the heater.

Conclusion

MCH heaters have revolutionized the performance of soldering irons by offering rapid heating, precise temperature control, and energy efficiency. These advanced heating elements enable soldering professionals and hobbyists to work more accurately and effectively. As technology continues to evolve, we can expect further enhancements in soldering tools driven by innovations in heating technologies like MCH.

If you have any questions about the MCH heater, welcome to contact us at sales@innovacera.com.

Innovacera is on attending the foreign exhibition

Innovacera a leading supplier of advanced ceramic components and solutions for the semiconductor and electronics industry, is excited to announce its participation in a foreign exhibition, one of the important events in the semiconductor and microelectronics industry.

Innovacera is showcasing its latest advancements in technical ceramic solutions in the semiconductor industry. Attendees can visit us at Booth 3928, where we are presenting:

Ceramic to Metal Sealing Product: Including the metalized ceramics, AMB, DPC, and DBC substrates which are widely used for electrical packaging processes, high-power semiconductor packaging, semiconductor cooling, and UPS uninterruptible power supply, photovoltaics, high-speed railway, new energy vehicle, high voltage network, and communication.

Boron Nitride components: essential for various high-tech applications, including electrode insulation for vacuum high-temperature equipment, PVD/CVD vacuum coating equipment insulation accessories, ion coating machines, sputtering coating, semiconductor MOCVD equipment for insulation and heat dissipation, ion implanter insulation accessories, PBN VGF crucibles, LEC crucibles, MBE crucibles, and PBN ceramic boats. These BN ceramics offer significant advantages such as high-temperature resistance up to 2000℃, thermal shock resistance, high electrical breakdown strength (3-4 times that of alumina), and superior carbon atmosphere corrosion resistance compared to alumina. Additionally, they exhibit large resistance, high-temperature resistance, high electrical breakdown resistance, no pollution, corrosion resistance, and machinability, making them ideal for demanding industrial environments.

High Purity Alumina Ceramic Part: Such as alumina polishing plates and turn tables which are polished surfaces and high precision flatness, high rigidity, high chemical durability, and ultra-large size are some of our advantages.

INNOVACERA ATTEND THE SEMICON SEA 2024 EXHIBITION

Engineered technical ceramics are widely used in the semiconductor manufacturing process due to their high-temperature stability, electrical insulation, corrosion resistance, and excellent mechanical properties. INNOVACERA ultra-pure ceramics are used in the whole-cycle semiconductor manufacturing process including wafer manufacturing, device manufacturing, and packaging.

As the semiconductor industry continues to evolve rapidly, the exhibition provides an essential chance for industry stakeholders to stay ahead of technological advancements and market trends. Whether you’re an industry veteran or a newcomer, the event offers unparalleled opportunities to gain insights, network with peers, and explore the future of the semiconductor landscape. This event is essential for driving the growth and development of the semiconductor ecosystem.

For more information about Innovacera products and exhibitions arranged, welcome to contact us at sales@innovacera.com.

Boron Nitride Ceramic Revolutionizing PVD Coating Technology

Boron Nitride ceramic (BN) with various applications, stands out as a versatile and high-performance compound in advanced materials. From its low thermal expansion excellent heat resistance outstanding electrical insulation and high wet resistance to molten metals, boron nitride has found its way into various industries, including electronics, high-temperature furnace construction, ceramic manufacturing, semiconductor industry, aerospace, and now the realm of Physical Vapor Deposition (PVD) coating technology.

PVD coating is a process used to produce thin films or coatings on various substrates by evaporating and condensing a material in a vacuum environment. This technique is widely employed in automotive and optics industries, where thin films of metals, ceramics, or other materials are deposited onto surfaces to enhance their properties such as wear resistance, corrosion resistance, or aesthetic appeal.

Boron Nitride Ceramic has emerged as a game-changer in the realm of PVD coating, offering several advantages over traditional coating materials:
High Thermal Stability
Chemical Inertness
Excellent Lubricating Properties
Uniform Coating Deposition

Enhanced Safety and Environmental Sustainability: Unlike some traditional coating materials that may pose health or environmental risks, BN ceramic is non-toxic and environmentally friendly. Its use in PVD coating machines contributes to safer working environments for operators and reduces the environmental impact of coating processes. Furthermore, the durability and longevity of BN ceramic components reduce the frequency of maintenance and replacement, further enhancing the sustainability of PVD coating operations.

Boron Nitride Ceramic represents a significant advancement in the field of PVD coating technology, offering unparalleled thermal stability, chemical inertness, lubricating properties, and coating uniformity. By using boron nitride ceramic components in PVD coating machines, manufacturers can enhance operational efficiency, improve coating quality, and ensure the safety and sustainability of their processes. As demand for high-performance thin films continues to grow across various industries, boron nitride ceramic is poised to play a pivotal role in shaping the future of PVD coating technology.

Metalized Terminal Bushing Ceramics

By applying Mo/Mn metallization on high-quality ceramic insulators, and doing the plating process, after applying metallization, Tin coating will be applied on the surface, it provides the more wettable ability for easy adhesion to a metal component by brazing or soldering.

This metalized terminal bushing can be widely used in ceramic to metal joining processes on the applications:

High-voltage vacuum devices

Semiconductor manufacturing devices

Electric power devices

Medical analysis devices

Space and nuclear power devices

Hermetically Sealed Terminal bushing or customized metalized ceramic, can be applied on ceramic-to-metal sealing along with brazing or soldering.

In most electric and electronic devices, high-frequency electromagnetic noise will be generated unavoidably, it degrades the quality of signal and power transmissions in critical operations. So EMI filter has been developed to mitigate the effect of electromagnetic noise on power and signal lines.

What are the EMI filters?

EMI filters are high-quality microwave frequency filters used in electronic devices. They aim to reduce electromagnetic interference (EMI) generated by any flux-inducing equipment or any other rational- sources including mobile phones, Wi-Fi routers or base stations, and other radio equipment. Its purpose is to prevent these noise signals from entering any device, preventing any damages caused by interference with sensitive circuitry inside the product. At the same time, it’s also helpful in protecting high-voltage equipment.

What’s the function of the terminal bushing?

The ceramic terminal bushing has good radiation resistance, high-frequency resistance, high voltage resistance, insulation, and other excellent electrical properties, this makes it an optimized material for High voltage applications. The metal layer will be applied on the ceramic surface to seal it with an EMI filter, so it can be adhesive to the metal.

INNOVACERA provides a series of terminal bushings and custom metalized shapes, we provide our customer solutions to ceramic-to-metal solutions by applying metallization and via brazing/soldering operation.

Boron Nitride Ceramic Nozzle Metal atomization powder nozzle for 3D printing

In recent years, the rapid development of powder metallurgy (MIM) and 3D printing (AM) has gained more and more applications in producing complex parts. The raw material of metal 3D printing technology is a metal powder with high sphericity and narrow particle size distribution. This powder production method melts the metal alloy and leaks it through the boron nitride nozzle. At the nozzle outlet, high-pressure airflow is used to atomize the metal liquid, while cooling it into spherical particles.

The difference between 3D printing and injection molding is that 3D printing doesn’t require molds and is more conducive to the production of complex parts. At the same time, due to the lack of restrictions and auxiliary functions of molds, the production process relies more on the performance of printing equipment and powder raw materials. The bn nozzle is a key component that determines the quality of the finished product. Compared with traditional brass nozzles, boron nitride’s high-temperature resistance, thermal shock resistance, finishing ability and resistance to metal liquid corrosion enable it to withstand high thermal gradients and promote rapid solidification of metal. In addition, composite boron nitride ceramics with different formulas can provide various properties such as high-temperature durability, impact resistance, conductivity, and resistance, providing customers with customized solutions.

In summary, Boron Nitride’s stability, high-temperature resistance, and precision machining capabilities make it ideal for producing high-quality metal powders and achieving precise printing.

What’s the breakthrough on technology of Ceramic to Metal

The Molybdenum/Manganese metallization developed the technology on Ceramic-to-metal brazed assembly, it provides high mechanical strength and good electrical insulation. At the very beginning, it’s used in vacuum electronic devices, gradually applied to semiconductors, integrated circuits, electric light sources, high-energy physics, aerospace, chemical industry, metallurgy, instrumentation and machinery manufacturing and other industrial fields.

So how to choose a material become more and more critical for a good vacuum brazing. Here we’re mainly discussing about 3 different types of materials that will be used for ceramic-to-metal.

Ceramic

Al2O3
BeO
BN
AlN

Metala

Kovar alloy
OFC
Stainless steel
Mild steel

Solder

Ag
Ag-Cu
Cu
AU-Cu
Au-Ni

The Ceramic materials are required to be high-temperature stabilized and good thermal expansion of coefficient, INNOVACERA apply mostly the Al2O3. Since ceramics will not be directly wetted, which impedes the adherence of molten metal layers and adhesives, added that the different coefficients of thermal expansion (CTE) between Ceramic and Metal. Breakthrough on such difficulties is with a soldering or brazing process.

Metal layer applied on ceramic components via Mo/Mn metallization and Plating or Active brazing, after that, the ceramic and metal components are joined by the melting and subsequent solidification of a filler metal-Solder, with different solders for different applications in different working temperatures.

What’s the advantages of Ceramic-to-Metal?

Advanced ceramic materials has the excellent properties of high melting point, high temperature resistance, corrosion resistance, abrasion resistance and other special properties, but also has radiation resistance, high frequency resistance, high voltage resistance, insulation and other excellent electrical properties, with the rapid development of science and technology, the application of the field of engineering structures often need to combine advanced ceramic materials with metal materials, so that the advantages of the two materials complement each other, giving the best performance of ceramics. By realizing the combination of ceramic and metal brazing, improve the performance of its welded joints, can make it work in higher temperatures and harsh environments, to achieve a wider range of application prospects!

What are the applications of boron nitride in the field of electronic engineering?

High-temperature electronic packaging

Boron nitride has excellent thermal conductivity and electrical insulation properties, and can work stably in high temperature environments, so it is widely used in the field of high temperature electronic packaging. Boron nitride can be used as encapsulation material for ceramic substrate, chip carrier, heat sink and other devices, which improves the reliability and stability of electronic devices.

Power electronics heat dissipation

In the field of power electronics, high power density power electronic devices generate a large amount of heat, requiring effective heat dissipation solutions to ensure the reliability of the device. Boron nitride has high thermal conductivity and excellent thermal stability, is used as a power electronic device heat dissipation materials, can effectively transfer and disseminate heat, improve the reliability and life of the device.

Microwave dielectric ceramics：

Boron nitride ceramic has excellent dielectric properties and high temperature stability, can be used as microwave dielectric ceramic materials. This material can be used to manufacture high-frequency microwave devices, such as filters, resonators, antennas, etc., which have a wide range of applications in the fields of communications, radar and navigation.

Lightweight composite materials

Boron nitride parts has a lightweight, high strength and excellent corrosion resistance, can be compounded with other materials to make lightweight composite materials. This material can be used in the manufacture of aerospace, automotive, marine and other fields of structural and functional parts, with excellent mechanical properties and lightweight effect.

Insulating material in electronic equipment

Boron nitride has high electrical insulation properties and stable chemical properties, and can be used as an insulating material in electronic equipment. For example, it can be used in the manufacture of high-voltage capacitors, insulators, wires and cables and other products to improve the electrical performance and reliability of the equipment.

High-energy ray detectors

Boron nitride has a high density of energy absorption and good detection performance, can be used for high-energy ray detector manufacturing. This detector can be used in nuclear physics experiments, medical imaging diagnostics and other fields, providing high precision and high sensitivity measurements.

Semiconductor manufacturing

In the field of semiconductor manufacturing, boron nitride ceramic can be used as an etchant and a raw material for thin film deposition. In the semiconductor device manufacturing process, boron nitride can play the role of a protective layer to prevent damage or contamination of the device. In addition, boron nitride can be used as an electron beam evaporation source material for the preparation of various thin film materials.

Nanoelectronics

In the field of nanoelectronics, boron nitride has good nanoscale processing performance and stable physicochemical properties, which can be used to fabricate various nanoelectronic devices. For example, boron nitride can be used as the channel material of field effect transistors and the interconnect line material of nano integrated circuits to improve the performance and reliability of devices.