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What Materials are Used for High Temperature Ceramic Tubes

There are many types of high-temperature ceramics materials which is widely used for high temperature ceramic tubes. Innovacera would like to introduce some kinds of commonly used material for ultra high temperature ceramics tubes and its properties and application for you.

Alumina ceramics: Alumina ceramic tube have excellent properties such as high hardness, wear resistance, high temperature resistance, and corrosion resistance. It plays an important role in electronics, machinery, metallurgy, chemical industry and other fields. Typically application is as ceramic insulator and protector tube for high temperature kilns.

Silicon nitride ceramics: Silicon nitride ceramic tube has excellent high-temperature insulation properties, wear resistance and thermal shock resistance, and has been widely used in many fields, such as In the aerospace field, due to its high temperature resistance and wear resistance, it can be used to manufacture engine nozzles, gas servos and other components in high temperature environments. In the chemical industry, due to its corrosion resistance and wear resistance, it can be used to manufacture acid and alkali liquid transportation pipelines, catalyst carriers, etc. In the metallurgical field, due to its high temperature stability and excellent mechanical properties, it can be used to manufacture piping systems for high temperature furnaces. In the electric field, due to its excellent insulation properties and mechanical strength, it can be used to manufacture protective tubes for high-voltage power cables, etc.

Silicon carbide ceramics: Silicon carbide ceramic high-temperature sleeving has good high-temperature strength, oxidation resistance and wear resistance, and can be used to manufacture high-temperature kiln tubes, thermocouple protection tubes and other equipment.

Zirconia ceramics: Zirconia ceramic tubes has high strength, corrosion resistance, high temperature resistance and other properties, and can be used to manufacture high-temperature furnace tubes, reactors, heat exchangers and other equipment.

When selecting high-temperature ceramics materials, comprehensive considerations need to be made based on specific usage scenarios and requirements to ensure that the performance of the material meets the requirements.

In short, choosing a suitable high-temperature ceramics material requires considering factors such as application scenarios, temperature range, physical properties, and cost. It is recommended to consult a professional ceramic material supplier sucha as Innovacera for more accurate advice before selecting high-temperature ceramic pipe materials.

Innovacera main ceramic material is Aluminum Oxide, Zirconium Oxide, Boron Nitride, Aluminum Nitride, Silicon Nitride, Machinable Glass Ceramic and other advanced materials. Through different manufacturing processes, Innovacera supply metallized ceramic components, ceramic brazing part, ceramic heater, ceramic reflector, ceramic pump components and other ceramic components.

Know More About Ceramic Metallization When Ceramic Perfectly Bond With Metal

Ceramic materials, which have excellent properties such as high hardness, high abrasion resistance and high corrosion resistance, but with poor electrical conductivity and weldability to limit their application. While metallization is a process of coating metal on the surface of ceramics, which can improve the conductivity and weldability of ceramics, thus expanding their range of applications. Ceramic after metallization has high thermal conductivity, insulation, heat resistance, strength and coefficient of thermal expansion that matched with the chip, and gradually developed into the ideal packaging substrate for new generation of integrated circuits, as well as power electronic modules.

The common ceramic substrate materials can be metallized include Al2O3, SiC, AlN and Si3N4.

1. Thick Film Metallization

Thick film metallization is a metal paste coated on the ceramic surface through the screen-printing method, and then after high temperature drying and heat treatment to form a metalized ceramic substrate technology. The advantage of this technology is that the process is simple and cost-effective cost, while the disadvantage is that the electrical performance of the conductive line is poor, can only be used for lower power and size requirements of the electronic devices.

2. Direct Bonded Copper

DBC (Direct Bonded Copper, DBC) is a copper foil (thickness greater than 0.1 mm) directly bonding to the surface of the Al2O3 ceramic substrate, in the N2 protection and temperature range of 1065 ℃ -1083 ℃. Pure copper in the molten state do not need to wet Al2O3, it needs to bring in oxygen elements in the reaction process, Cu-Cu2O eutectic liquid generated at high temperature has a good wettability on Al2O3, through the generation of CuAlO2 as a transition layer, you can be directly laying the copper foil on the Al2O3 ceramic substrate.

3. Thin Film Metallization

Thin film metallization is carried out in high vacuum conditions, with physical methods of solid material surface ionization for ions, followed by low-pressure gas in the ceramic substrate surface deposition of the required film process, that is, the physical vapor deposition technology ( PVD ), mainly including magnetron sputtering coating, deposition of a thin layer of Cu layer as a seed layer in the ceramic surface, so that the subsequent plating process to carry out. Electroplate is then performed to thicken (protect) the seed Cu. Then through the film, exposure, development and other processes to complete the transfer of graphics, and then plating so that the Cu layer grows to the required thickness, and finally through the film, etching process to complete the production of conductive lines.

Such ceramic substrate using thin-film process has shown great competitiveness in power LED packaging in recent years.

In summary, ceramic metallization can ensure the ceramic materials own the electrical and thermal conductivity of metal, thus expanding their applications including electronics, automotive sensors, optical devices, medical devices, and aerospace etc.

What Do You Know About Heating Elements Used In 3D Printing Pen

3D printing pen is a more convenient 3D printing product. You only need to write on any surface, even in the air. It can be produced directly without the support of a computer or other electronic products. The size of the 3D printing pen is the same as the ordinary pen. The material is generally made of aluminum. Generally, when the material is heated when drawing, the temperature of the pen tip will be as high as 80 degrees Celsius. When using the 3D printing pen, try to use it under the care of an adult, and do not burn your fingers.

What is a 3D Printing Pen?

A 3D printing pen is like a handheld 3D printer. It uses the same kind of heating element and extruder that you would find on a desktop 3D printer. But instead of being controlled with computer software and motors, you guide the printer head by hand.

How Does it Work?

Like all 3D printing devices, a 3D printing pen works by heating a plastic filament to its melting point and forcing it through an extruder tip. This is very similar to how a hot glue gun works; the melted plastic is very soft and can be fused onto a surface or worked into any shape that you want. Once the melted plastic leaves the tip, it cools quickly. After a few seconds, the plastic hardens and holds whatever shape you have worked it into.

What Can You Do With a 3D pen?

These pens effectively allow you to draw with plastic. You can work the plastic into just about any shape and apply it to most surfaces. You can use it to add raised decorative designs to everyday objects. With practice, you can even make 3D drawings in empty space. These pens can also be used to modify and repair other 3D printed objects.

What Are The Heating Elements Used In 3D Pen?

The heating element in a 3D pen is an important component that heats up the pen’s build platform or extruder nozzle. This heat is necessary to melt and fuse the material being used for printing, such as plastic filaments or resins.
There are different types of heating elements used in 3D pen, including:Cartridge heaters,Heater blocks,Flexible heaters and ceramic heaters.
Regardless of the type of heating element used, it is important to use a high-quality component that can withstand the high temperatures required for 3D printing. It is also important to ensure that the heating element is properly installed and wired to the controller board to prevent any safety hazards.

What is the Difference Between using Traditional Heating and Ceramic Heating Cores?

First, the traditional hot end is large and heavy, which affects printing accuracy and speed. If it is a direct extrusion system, the frequency of motor vibration will also be increased, further reducing accuracy and speed.
Second, there is an air gap between the heater block and the thermistor and heating tube, so effective heat transfer and accurate temperature control are not possible. This leads to the problem of being unable to print at different speeds and extrusion volumes without being able to quickly change the nozzle temperature to accommodate changing filament feed rates. This is something that all consumer printers have not yet solved.

What is the Advantage of Using Ceramic Heater?

First, it is more lighter and smaller in size. In other words, the replacement of traditional heating tubes by ceramic heating allows the hot end to be designed to be lighter and more compact than traditional ones, thereby improving printing accuracy and speed.
Secondly, ceramic heating has a positive temperature coefficient (PTC), specifically, it can reduce power when the temperature rises, thereby reducing the risk associated with temperature runaway when reaching the maximum temperature. At the same time, because ceramic heating can be integrated with the thermistor, precise temperature control can be achieved.
Finally, the ceramic heating core has more uniform heating performance and thermal efficiency. To achieve the same heating performance as traditional heating tubes, ceramic heating cores may only require lower power.

Summary

The iteration from single-head tube to ceramic heating embodies the charm of technological innovation. Ceramic heating can indeed bring many benefits to 3D printings. Technological innovation is generally led by industry leaders, and then subsequent followers expand the market. Therefore more and more 3D printing pen using ceramic heating will be used in the future.

Ceramic Metalized Thin Film Pads: The Perfect Solution for High-Performance Applications

As demand for high-performance electronics continues to grow, the need for reliable and efficient thermal management solutions has never been greater. That’s why we’re excited to introduce our new line of Ceramic Metalized Thin Film Pads, the perfect solution for a wide range of demanding applications.

Our Ceramic Metalized Thin Film Pads are made from high-quality ceramic materials that offer superior thermal conductivity, excellent mechanical strength, and outstanding electrical insulation properties. These materials are combined with a layer of metal that provides excellent thermal dissipation and electrical grounding capabilities, making them ideal for use in high-performance electronic devices.

With our Ceramic Metalized Thin Film Pads, you can enjoy a number of key benefits, including:
1. Excellent Thermal Conductivity: Our pads are designed to provide excellent thermal conductivity, ensuring that heat is efficiently dissipated away from critical components.
2. Superior Mechanical Strength: Thanks to their high-quality ceramic materials, our pads offer superior mechanical strength, making them resistant to damage from impact and vibration.
3. Outstanding Electrical Insulation: The ceramic materials used in our pads provide excellent electrical insulation, helping to protect your electronic devices from damage caused by electrical interference.
4. Versatile Applications: Our Ceramic Metalized Thin Film Pads are suitable for a wide range of applications, from consumer electronics to industrial machinery and beyond.

If you’re looking for a reliable and efficient thermal management solution for your high-performance electronic devices, look no further than our Ceramic Metalized Thin Film Pads. Contact us today to learn more about our full range of products and how we can help you meet your thermal management needs.

Silicon Nitride Ceramic Feature And Application

There are many types of special ceramics and structural ceramics, silicon nitride ceramic is known as the “King of Structural Ceramics” due to its balanced performance in all aspects. It is suitable for applications with large mechanical vibration, large thermal shock, high current impact, and require high reliability and stability. The purity, particle size, and crystal form of silicon nitride ceramic powder have a significant impact on the substrate molding process, sintering process, and final product performance. Therefore, the preparation process of silicon nitride powder is particularly important.

Silicon nitride ceramic components have excellent mechanical properties, thermal properties, electrical properties and chemical properties, and is widely used in various fields. Such as Si3N4 ceramics is an excellent material for preparing ceramic substrates in various applications. Here are some common application for reference:

1. Refractory material: Silicon nitride has the characteristics of high melting point, high hardness, low expansion coefficient, etc., and is an excellent refractory material. It can be used to make refractory bricks, refractory castables, refractory coatings, etc., and is used in high-temperature kilns and equipment in steel, nonferrous metals, glass and other industries.

2. Electronic materials: Silicon nitride can be used to manufacture packaging materials, heat sinks, insulating materials, etc. for semiconductor chips, as well as microwave communication devices, optoelectronic devices, etc.

3. Abrasive part: Silicon nitride can be used to make abrasives part, such as grinding wheels, grinding heads, grinding discs, etc., for grinding hard materials such as steel, non-ferrous metals, glass, etc.

4. Bicycle industry: Excellent high-temperature mechanical properties, wear resistance and corrosion resistance feature let SI3N4 parts can be used to manufacture ceramic engine parts, ceramic cutting tools, ceramic bearings, ceramic molds, etc. High-end bicycle accessories products use silicon nitride bearings and rear derailleur guide systems using mold injection carbon fiber technology.

5. Aerospace materials: Silicon nitride has excellent mechanical properties and corrosion resistance. It can be used to manufacture engine parts, wings, fuselages, etc. of aerospace vehicles, as well as solar panels, antennas, etc. for satellites.

6. Automobile industry: Silicon nitride can be used to manufacture automobile engine parts, brake pads, clutch plates, etc., as well as automobile tires, wheel hubs, etc.

In short, silicon nitride is an inorganic non-metallic material with widely application. With the continuous development of science and technology, its application fields will continue to expand.

Finally, we would like to thank all Innovacera customers to support our ceramic products. We are honored to be your supplier and hope to continue working together in the future to help to develop the advanced ceramics industry.

The Special Characteristics of Hot Pressed Aluminum Nitride

Common Sintering Methods for Aluminum Nitride Ceramics

To prepare AlN ceramics with high thermal conductivity, two problems must be solved in the sintering process: the first one is to improve the densification of the material, and the second one is to try to avoid the lattice of oxygen atoms dissolved in the high-temperature sintering. Common sintering methods are as follows:
1. atmospheric pressure sintering
2. hot pressure sintering
3. high pressure sintering
4. atmosphere sintering
5. discharge ion sintering
6. microwave sintering

This Time, We Focus on Hot-pressing Aluminum Nitride:

In order to reduce the sintering temperature of aluminum nitride ceramics and promote the densification of ceramics, aluminum nitride ceramics can be prepared by using hot-pressure sintering, which is one of the main process methods for the preparation of high-thermal conductivity densified AlN ceramics. The so-called hot pressure sintering, i.e., sintering ceramics under a certain pressure, can make the heating sintering and pressurized molding at the same time. The AlN ceramic sintered body with a density of 3.26 g/cm3 and a thermal conductivity of 200 W/(m.K) was produced by sintering at a high pressure of 25 MPa and 1700°C for 4 h. The AlN lattice oxygen content was 0.49 wt%, which is more than 60% lower than that of the AlN sintered body obtained by sintering at 1800°C for 8 h (1.25 wt%), and the thermal conductivity was improved.

Xiamen Innovacera Advanced Materials CO., LTD

Has advanced production lines for aluminum nitride ceramic materials and high precision machining capabilities. We are currently able to produce Aluminum Nitride ceramic wafer in different sizes from 6-12 inches, as well as large Aluminum Nitride ceramic plates with a diameter of up to 320mm and a thickness of over 26mm. These large size ALN ceramic wafers can be used to produce high thermal conductivity aluminum nitride heating pads.

Table of Properties of Hot Pressed Aluminum Nitride:

Hot Pressed Aluminium Nitride Material Properties – SU0023
Properties		Units	Value
Color		–	Black
Bulk Density		g/cm3	–
Compressive Strength		MPa	3416
Flexural Strength		MPa	337
Modulus of Elasticity		GPa	331
Fracture Toughness		MPa·m1/2	4.93
Coefficient Linear Thermal Expansion	RT-500℃	10-6/k	5.0732
	RT-800℃		5.3463
Volume Resistivity		Ω.cm	7.0×1012
Remark: The value is just for review, different using conditions will have a little difference.

New 3D Printer Hot End – Ceramic Heating Core

What is the Difference Between the New Hot End and the Traditional Hot End?

1. The new hot end consists of the nozzle, heating element, cold end (other parts of the extruder), and integrates the heater and thermistor. This design effectively solves the problems of traditional hot ends that cannot accurately control temperature and have low thermal efficiency.

2. Due to the ability to quickly replace the nozzle, when the nozzle is clogged or stuck, just replace it with a new nozzle. Each nozzle change reconnects with the filament, so printing can be resumed in minimal time. And since the nozzle and throat are integrated into one unit, there’s also no chance of material leakage.

3. The weight and volume are reduced, so the print head takes up less space, thereby improving printing accuracy and speed.

4. Use a new heater. The heating element is smaller and faster than traditional heating blocks, and has a positive temperature coefficient (PTC) that reduces power as heat increases, preventing overheating and burning, which can cause fires.

What is a Ceramic Heating Core? What is the Difference From Traditional Heating Tubes?

Let’s first introduce the traditional hot end.

A traditional hot end consists of a nozzle screwed into an aluminum heating block that is heated by an inserted cylindrical single-head heating tube. The module also houses a removable thermistor for temperature measurement. Finally, a separate throat thermally isolates the hot end from the wire feed path, preventing it from melting on its way to the hot end. This method of heating is very inefficient and has many problems.

First, the traditional hot end is large and heavy, which affects printing accuracy and speed. If it is a direct extrusion system, the frequency of motor vibration will also be increased, further reducing accuracy and speed.

Second, there is an air gap between the heater block and the thermistor and heating tube, so effective heat transfer and accurate temperature control are not possible. This leads to the problem of being unable to print at different speeds and extrusion volumes without being able to quickly change the nozzle temperature to accommodate changing filament feed rates. This is something that all consumer printers have not yet solved.

What about the ceramic heating core?

First of all, the application of ceramic heating core makes the hot end half lighter and smaller than traditional models. In other words, the ceramic heating core replaces the traditional heating tube, allowing the hot end to be designed to be lighter and more compact than the traditional one, thereby improving printing accuracy and speed.

Secondly, the ceramic heating core has a positive temperature coefficient (PTC), specifically, it reduces power when the temperature rises, thereby reducing the risk associated with temperature runaway when the maximum temperature is reached. At the same time, because the ceramic heating core can be integrated with the thermistor, precise temperature control can be achieved.

Finally, the ceramic heating core has more uniform heating performance and thermal efficiency. To achieve the same heating performance as traditional heating tubes, ceramic heating cores may only require lower power.

What is a Ceramic Heating Core?

Ceramic heating core is a tubular ceramic heating element. It is a heating element made of alumina ceramics and metal heating resistor slurry sintered together.

Main process: Print a circuit made of metal heating paste on an alumina ceramic green body with a composition of 92-96%. After hot pressing and lamination, it is jointly sintered in a reducing atmosphere at 1500-1600°C, so it is also called alumina ceramics. fever. Heating resistor slurry is made of tungsten and some precious metals, and its composition ratio affects the heating rate.

Features of ceramic heating:

1. Heating speed is fast. Several types of heating resistor slurries developed by our company can meet the requirements of heating up to 800°C in the fastest 10 seconds.

2. The heating temperature is high, and long-term use below 450°C does not affect the service life.

3. The heat is uniform and consistent, and the temperature difference at different locations in the heating area is small.

4. Thermal efficiency is high. On the premise of ensuring the heating speed, the power can be reduced to achieve the purpose of low energy consumption.

5. The surface insulation is uncharged and can be in direct contact with water.

6. The power density is high, so the volume can be reduced to less than 1cm³ without affecting the heating performance.

7. Safe and reliable, does not contain harmful heavy metals, and has passed RoHS, CE, FDA, ISO9001 and other qualification standards.

Applications of Aluminum Nitride Ceramic Substrates for Integrated Circuits and Semiconductor Chip Mounts

Aluminum nitride is a non-natural existence of man-made crystals, with a hexagonal crystal system of fibrous zincite crystal structure, for the covalent bond is very strong compounds, lightweight, high strength, high heat resistance, corrosion resistance, has been used as a crucible for melting aluminum, but also an excellent performance of electronic ceramic materials.

Aluminum nitride ceramics with high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, low dielectric loss, is the ideal large-scale integrated circuit heat dissipation substrate and packaging materials, the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate.

Aluminum Nitride Ceramic Substrate Advantages:

1. Excellent thermal conductivity
2. Low dielectric constant
3. Low dielectric loss
4. Reliable insulation properties
5. Excellent mechanical properties non-toxic
6. High temperature resistance and chemical corrosion resistance;

Due to the above performance, with the rapid development of microelectronic devices, high thermal conductivity aluminum nitride substrate, can be widely used in communication devices, high brightness LED, power electronics.

The thermal conductivity of aluminum nitride single crystal is about 250W, theoretically speaking, the thermal conductivity of aluminum nitride single crystal at room temperature can reach 320W, so the aluminum nitride material is very suitable for the manufacture of high heat dissipation substrate. Aluminum nitride ceramic substrate is a new type to solve the problem of high heat dissipation density, the most suitable for high integration, high heat dissipation hybrid integrated circuits with ceramic substrate and semiconductor chip mounting ceramic substrate.

Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact.

The pads are made by ceramic material such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance.

Applications of Aluminum Nitride Ceramic Substrates:

Power Devices
MOSFET Transistor
Heat Sink Interface
Integrated Circuit (IC) Chip
Packaging Heat Conduction
LED Board Thermal Interface Material (TIM)
MOS Transistor
Chip ON Film (COF) Heat Conduction
IGBT Transistor Heat Sink

Classification and Characteristics of Ceramic Substrates Commonly Used in Electronic Packaging

There are many kinds of electronic packaging substrates, and the commonly used substrates are mainly divided into plastic packaging substrates, metal packaging substrates and ceramic packaging substrates. Plastic packaging materials usually have low thermal conductivity, poor reliability, and are not suitable for high requirements. Metal packaging materials have a high thermal conductivity, but the general thermal expansion coefficient does not match, and the price is expensive.

Ceramic substrates are commonly used for electronic packaging. Compared with plastic and metal substrates, ceramic substrates have the following advantages:

1. Good insulation performance, high reliability;
2. Low dielectric coefficient, high frequency performance;
3. Low expansion coefficient, high thermal conductivity;
4. Good air tightness, stable chemical properties, and a strong protective effect on electronic systems.

Therefore, it is suitable for aviation, aerospace, military and other high reliability, high frequency, high temperature resistance, good air tightness product packaging. Ultra-small chip electronic components are widely used in mobile communications, computers, household appliances, automotive electronics and other fields, and their carrier materials are usually packaged with ceramic substrates.

At present, the commonly used ceramic substrate materials for electronic packaging are alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), silicon carbide (SiC), boron nitride (BN), beryllium oxide (BeO).

The Following are the Application Areas of Various Material Substrates:

1. Alumina Ceramic Substrate

Although the Al2O3 ceramic substrate has a large output and a wide range of applications, its thermal conductivity is higher than that of silicon single crystals, which limits its application in high-frequency, high-power and ultra-large scale integrated circuits.

2. Aluminum Nitride Ceramic Substrate

The preparation process of AlN powder, the core raw material of AlN ceramics, is complicated, has high energy consumption, long cycle and high price. The high cost limits the wide application of AlN ceramics, so AlN ceramic substrates are mainly used in high-end industries.

3. Silicon Nitride Ceramic Substrate

The dielectric properties of Si3N4 ceramics are poor (dielectric constant is 8.3, dielectric loss is 0.001 ~ 0.1), and the production cost is high, which limits its application as an electronic packaging ceramic substrate.

4. Silicon Carbide Ceramic Substrate

The dielectric constant of SiC is too high, 4 times that of AlN, and its compressive strength is low, which is only suitable for low-density packaging, but not for high-density packaging. In addition to integrated circuit components, array components, laser diodes, etc., it is also used for conductive structural components.

5. Beryllium Oxide Ceramic Substrate

Its use is limited to the following aspects: heat sink of high-power transistors, heat sink of high-frequency high-power semiconductor devices, emission tube, traveling wave tube, laser tube, klystron, BeO ceramic substrate because of its high thermal conductivity and ideal high-frequency characteristics, sometimes used in avionics and satellite communications.

6. Boron Nitride Ceramic Substrate

BN has the advantages of high thermal conductivity, thermal conductivity almost does not change with temperature, small dielectric constant, good insulation performance, etc., and is widely used in radar window, high-power transistor tube base, tube shell, heat sink and microwave output window and other fields.

Performance of Ceramic Substrates of Various Materials:

Performance	Performance	Unit	ALN	AI2O3		BeO	SiC	BN	Si3N4
	Content	%	95	96.0	99.5	99.0	/	99-997	/
	Density	g/cm3	≥3.32	3.72	3.90	2.52	≥3.03	1.6-2.0	3.26±0.05
Thermal Performance	Maximum service temperature	℃	800	1700	1750	/	1300	900-2100	/
	Thermal conductivity	（W/m·K）20℃	/	24.70	30.00	230	90-110	35-85	/
	Thermal conductivity	（W/m·K）100℃	170	/	/	/	/	/	/
	Thermal Expansion	×10-6℃(25~400℃)	4.4	/	/	/	4.0	0.7~7.5	3.0-3.2
		×10-6℃(25~800℃)	/	8.2	8.2	7.0-8.5	/	/	/
		×10-6℃(20~100℃)	/	/	/	/	/	1.5-2.8	/
Electrical performance	Electrical resistivity(Ω*cm)	Ω·cm (25℃)	＞1014	＞1015	>1015	≥1014	/	＞1014-＞1013	>1018
	Electrical resistivity(Ω*cm)	Ω·cm (300℃)	/	/	/	≥1011	/	/	/
	Dielectric constant	1MHz(10±0.5)GHz	8.9	8.3	8.7	6.9±0.4	40	4.0	9.4
	Dielectric loss	(×10-4)(1Hz)	3~10	0.0002	0.0001	/	/	/	/
	Withstand voltage	(kV*mm-1)	15	10	10	10	0.07	300～400	100
Mechanical property	Hardness(HV)	MPa	1000	25		12	91-93(HRA)	/	160-1800
	Bending strength	MPa	≥410	300～350		200	≥350	40～80	700-800
	Elastic modulus	GPa	320	370		350	350	/	320
Toxicity	/	（W/m·K）20℃	No	No		Yes	No	No	No

Characteristics and Applications of Aluminum Nitride Ceramics

Aluminum nitride ceramics have excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, non-toxic and matched with the coefficient of thermal expansion of silicon, a new generation of highly integrated semiconductor substrate and the ideal packaging material for electronic devices, but also can be used for heat exchangers, piezoelectric ceramics and thin films, thermally conductive filler.

AlN ceramics are used as copper-clad substrates, electronic packaging materials, ultra-high-temperature device packaging materials, high-power device platform materials, high-frequency device materials, thin-film materials for sensors, materials for optical electronics, coatings and functional enhancement materials.

Application:

1. Heat dissipation substrate and electronic device packaging

Ideal for packaging hybrid power switches and microwave vacuum tube housings, as well as substrates for large-scale integrated circuits.

2. Structural Ceramics

AIN ceramics are heat and erosion resistant and can be used to make crucibles, Al evaporation dishes, semiconductor electrostatic chucks, and other high temperature corrosion resistant parts.

3. Functional Materials

Aluminum nitride can be used to make high-frequency, high-power devices that can be used at high temperatures or in the presence of radiation, such as high-power electronics and high-density solid-state memory.
High-purity AlN ceramics are transparent and have excellent optical properties, which, combined with their electrical properties, can be used to create functional devices such as infrared deflectors and sensors.

4. Inert heat-resistant materials

AlN as a heat-resistant material can be used as crucibles, protective tubes, casting molds and so on. Aluminum nitride can be in 2000 ℃ non-oxygenated atmosphere, still has a stable performance, is an excellent high-temperature refractory materials, resistance to molten metal erosion ability.

5. Heat exchanger parts

Aluminum nitride ceramics with high thermal conductivity, low coefficient of thermal expansion, excellent thermal conductivity and thermal shock resistance can be used as ideal heat-resistant impulse and heat exchanger materials, for example, aluminum nitride ceramics can be used as heat exchanger materials for marine gas turbines and heat-resistant parts for internal combustion engines.

6. Filler material

Aluminum nitride has excellent electrical insulation, high thermal conductivity, good dielectric properties, good compatibility with polymer materials, is an excellent additive for polymer materials for electronic products, can be used for TIM filler, FCCL thermal conductivity dielectric layer filler, widely used in electronic devices, heat transfer medium, and thus improve efficiency, such as the CPU and the heatsink to fill in the gap, the high-power transistor and silicon components and the substrate in contact with the slit place Thermally Conductive Fillers.

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