DBC Substrates | Project Tags

High Performance Ceramic Substrates

Innovacera's High Performance Ceramic Substrates provide superior thermal management, electrical insulation, and mechanical stability. Made from Al2O3, AlN, Si3N4, or ZTA, they withstand -55°C to 850°C thermal cycling while maintaining dimensional and electrical integrity. Ideal for power modules, LEDs, RF/microwave circuits, and semiconductors, with precise flatness, smooth surface, and customizable metallization for automotive, aerospace, telecom, and industrial applications.

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) Substrates

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) substrates are key technologies in power electronics. They involve bonding a pure copper layer to a ceramic base, typically Alumina or Aluminum Nitride, providing excellent thermal dissipation and electrical insulation. These substrates are crucial for IGBT modules, power LEDs, and automotive electronics. Innovacera offers high-quality DBC and DPC substrates, enabling superior performance and reliability in high-power applications.

Semiconductor Ceramic Substrates

Innovacera provides advanced semiconductor ceramic substrates critical for high-power and high-frequency electronics, including Direct Bonded Copper (DBC) substrates offering robust copper-ceramic bonding for superior thermal management and power cycling, Direct Plated Copper (DPC) substrates enabling ultra-fine circuit patterns and high-precision interconnections through laser drilling and copper plating, and Aluminum Nitride (AlN) wafer substrates renowned for their exceptional thermal conductivity and low expansion coefficient, ideal for demanding semiconductor applications requiring efficient heat dissipation.