Semiconductor Ceramic Substrates

Innovacera provides advanced semiconductor ceramic substrates critical for high-power and high-frequency electronics, including Direct Bonded Copper (DBC) substrates offering robust copper-ceramic bonding for superior thermal management and power cycling, Direct Plated Copper (DPC) substrates enabling ultra-fine circuit patterns and high-precision interconnections through laser drilling and copper plating, and Aluminum Nitride (AlN) wafer substrates renowned for their exceptional thermal conductivity and low expansion coefficient, ideal for demanding semiconductor applications requiring efficient heat dissipation.

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Direct Bonded Copper Substrates

Direct Bonded Copper Substrates|DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a …

Direct Plated Copper Substrate

Direct Plated Copper Substrate|Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of t…

Aluminum Nitride Wafer Substrates

Aluminum Nitride Wafer Substrates|Innovacera standard aluminum nitride wafer diameters are from 50.8 mm (2 inch) to 200 mm (8 inch) ; mostly use are 6” aluminum nitride wafers and 8” AlN wafer substrates . AlN Wafers can be produced i…