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Ideal Ceramic Components for the Molten Metal Industry to Improve Energy Efficiency and Metal Cleanliness

Innovacera manufactures ceramic components for the Molten Metal industry, including the Metal Atomization, Steel and Non-ferrous alloys production markets. Here are some highly successful components which are received our customers’ excellent feedback.

Atomizer Nozzles for Powder Metal Atomization:

Innovacera’s Boron Nitride Nozzles and Zirconia Ceramic Nozzles are processed using high-precision equipment, which ensures tight tolerance control and thorough edge cleanliness, so as to minimize clogging and metal creep, reducing the frequency of nozzle replacement. We offer a variety of materials to match different application scenarios, such as common alloys and superalloys of nickel, copper, and aluminum.

Side Dams for Thin Strip Casting:

The side dam is an important part of the thin strip continuous casting, whose material is one of the key bottlenecks for thin strip continuous casting. And the success of continuous casting depends on effectively controlling molten steel between rotating twin rolls, which requires the use of refractory components called side baffles. The uniformity of strip thickness and the resulting high yield depend on the refractory material’s resistance to erosion from the moving rolls and corrosion from the molten steel. Innovacera has been researching this extensively and offers grade BMZ in this application. BMZ’s addition of zirconia to boron nitride adds the desired wear resistance and high corrosion resistance at operating temperatures upwards of 1800°C.

Crucibles and a flow channel for molten metal:

BN’s ability to withstand extreme temperatures without significant deformation makes it an ideal material for molten metals that are processed at elevated temperatures. The non-wetting property of boron nitride ensures that molten metals do not adhere to the crucible walls and tube, allowing for cleaner and more efficient processing. Innovacera’s pure boron nitride and composite boron nitride use contributes to improved metal quality and reduced contamination.

Innovacera can provide customized solutions for molten metal industry. For more selecting guides, welcome to contact our sales engineers at sales@innovacera.com

Piezoelectric Ceramics Expand Applications in Ultrasonic Measurement and High-Precision Sensing Systems

With the rapid development of ultrasonic technology, industrial automation and high-end medical equipment, piezoelectric ceramics, as a key functional material, is gradually evolving from traditional sensing components to the core driving units in multiple industries. Its applications in energy measurement, industrial inspection, medical imaging and environmental detection have been continuously deepening.

I. Material Basis: Ferroelectric structure endows high sensitivity piezoelectric properties

Piezoelectric ceramics are a type of typical ferroelectric functional ceramic material. They are composed of a large number of grains inside. In the un-polarized state, due to the random distribution of the spontaneous polarization direction, the material as a whole does not exhibit a macroscopic piezoelectric effect.

Through high-temperature sintering, electrode preparation, and direct current field polarization treatment, the polarization directions of the crystal grains were rearranged and became consistent, thereby enabling the material to acquire stable piezoelectric properties and achieving efficient conversion between mechanical energy and electrical signals.

Compared with single-crystal materials such as piezoelectric quartz, piezoelectric ceramics have greater design flexibility and stronger engineering adaptability, making them suitable for complex structures and large-scale manufacturing requirements.

II. Energy Measurement Field: The Core Sensing Foundation of Ultrasonic Measurement System

In the modern energy measurement system, piezoelectric ceramics have become the core execution unit of ultrasonic measurement technology, and are widely used in various fluid and medium detection devices, including:

• Ultrasonic water meters and heat meters

• Gas ultrasonic flow meters

• Orifice flow meters and vortex flow meters

• Ultrasonic level meters and tuning fork level systems

• Ultrasonic density and level detection equipment

In various application scenarios, piezoelectric ceramics are mainly responsible for the transmission and reception of ultrasonic signals, helping the entire system achieve non-contact high-precision detection and measurement.

Thanks to its outstanding stability and excellent anti-interference performance, piezoelectric ceramics can effectively adapt to complex working conditions, significantly enhancing the stability and service life of the equipment during long-term continuous operation.

III. Industrial Inspection Field: Promoting the “Visualization” Upgrade of Equipment Status

In the field of industrial inspection and condition monitoring, piezoelectric ceramics are widely used in vibration analysis and structural health monitoring systems, including:

• Non-destructive testing (NDT) system

• Vibration and acceleration sensor

• Dynamic balance testing equipment

• Fastener tightening force monitoring system

By highly sensitively capturing weak mechanical vibrations, piezoelectric ceramics can convert the operating status of equipment into analyzable data, providing an important foundation for predictive maintenance and fault diagnosis.

Especially in high-end equipment manufacturing and automated production lines, these types of sensors are gradually becoming standard equipment.

IV. Ultrasonic Drive and Medical Applications: Core Materials for High-Frequency Energy Conversion

In the ultrasonic driving system, piezoelectric ceramics are the key components for achieving high-frequency mechanical vibrations and are widely used in:

• Ultrasonic welding equipment

• Ultrasonic cleaning system

Its high-efficiency energy conversion capability directly affects the stability of equipment output and processing quality. It has been widely applied in the fields of electronic manufacturing, semiconductor packaging, and precision cleaning.

In the medical field, piezoelectric ceramics also hold a central position. Typical applications include:

• Type B ultrasound diagnostic system (B ultrasound)

• Fetal heart monitoring equipment

• Ultrasound dental cleaning and beautification instrument

• Ultrasound surgical knife

• Infusion bubble detection system

Among these devices, their main function lies in generating high-frequency ultrasound signals and maintaining stable output, which is an essential foundation for medical imaging and minimally invasive treatment technologies.

V. Ocean and Environmental Exploration: Highly Sensitive Sensing in Complex Media

In the field of underwater sound and environmental monitoring, piezoelectric ceramics are used to construct highly sensitive detection systems, including:

• Sonar detection and underwater target identification system

• Underwater acoustic communication and signal transmission equipment

• Ultrasonic wind speed and direction measuring instrument

Its advantage lies in the ability to maintain stable response in complex media with high noise and strong attenuation, enabling long-distance and high-precision acquisition of environmental information.

VI. Communication and Electronic Systems: The Key Guarantee for Frequency Stability

In communication and electronic systems, piezoelectric ceramics are widely used in resonators, filters and frequency control components.

Its main advantages are as follows:

• High frequency stability

• Strong anti-electromagnetic interference capability

• Small in size, easy to integrate

• Long-term reliability is excellent

These characteristics make them important basic components in multi-channel communication systems and high-density electronic devices.

From functional materials to system-level core components

With the continuous development of high-end manufacturing, intelligent sensing and ultrasonic technology, piezoelectric ceramics are gradually evolving from single-function components to cross-industry system-level core materials, and their role in the precision sensing and energy conversion system is continuously strengthening.

Its application scope is still continuously expanding, and it has established a stable foundational support position in multiple high-tech fields.

Innovacera supplies a wide portfolio of piezoelectric ceramic products and supports customized development for diverse applications. Welcome to contact us at sales@innovacera.com, for inquiries and cooperation.

Innovacera Advances ESG Commitment Through Tree Care Activity at Xiamen Botanical Garden

From claiming to safeguarding: Making ESG a Participatory Daily Action

Today, as the concept of sustainable development in enterprises continues to deepen, ESG(Environmental, Social and Governance) is no longer merely an indicator in reports, but a real practice integrated into daily operations and the actions of employees.

In March 2026, Innovacera claimed 50 trees in Xiamen Botanical Garden, initiating a green campaign centered on “companionship and guardianship”. This is not only a participation in public welfare but also a long-term commitment to environmental responsibility.

A follow-up visit enables responsibility to “take root and grow”

On Sunday, April 26, 2026, the company organized its employees, along with their families and children, to come to the area where the trees were located. They carried out a meaningful ESG activity.

Everyone worked together in teams, doing tasks such as loosening the soil, watering the trees, and providing simple maintenance.

The children, led by their parents, participated actively in these activities. Starting from the most basic task of “watering the trees”, they truly understood the meanings of “green” and “responsibility” for the first time.

This is not merely a simple outdoor activity; rather, it is a process of translating environmental protection concepts into practical actions.

ESG is not just a concept; it is a continuous action

Unlike one-time charitable donations, tree planting is more like a “long-term relationship”.

Each tree has its own unique number and identification. From the process of claiming it, to regular follow-up visits and maintenance, a continuous connection is established between the company and nature. Just as the company had previously advocated –

This approach embodies a “continuous attention and responsibility”, rather than a brief participation.

From an ESG perspective, this precisely represents the “E (Environmental Responsibility)” aspect:

— Participate in urban greening and ecological maintenance

— Establish a long-term sustainable public welfare mechanism

— Encourage employees to deeply engage in environmental protection practices

From corporate actions to family involvement

The special feature of this event lies in “family participation”.

Employees are not only members of the company, but also part of the family. When children participate together in planting and maintenance, ESG is no longer just an enterprise behavior, but has extended into a way of life:

— Children understand nature and ecology through practice

— Families build environmental consensus through interaction

— Corporate culture conveys it in an imperceptible way

This extension from “enterprise” to “individual” has made ESG more comprehensive and more dynamic.

From advanced materials to ecological responsibility

As an enterprise specializing in advanced ceramic materials, we are committed to providing high-performance solutions for semiconductors, vacuum systems and high-end equipment.

It may seem that industry and nature are far apart, but their underlying logic is actually highly consistent:

— The materials need to be stable and precise.

— The ecology requires balance and patience.

Whether it is technological innovation or environmental protection, fundamentally, they all involve the pursuit of “long-term value”.

Make it sustainable, visible and tangible

ESG is not necessarily a grand project. It can also be:

A claimed tree
A weekend maintenance activity
A continuous connection between humans and nature

From claiming to follow-up visits, from responsibility to participation, Innovacera is making “sustainable development” a reality through a series of specific small actions. It ensures that greenery not only exists in theory but also continuously thrives in every day.

Zirconia Blades: The “Invisible Sharp Tool” for Film Cutting, Unlocking the Secret to Precise and Seamless Cuts

Films are everywhere in our lives. They include screen protectors for mobile phones, sealing films for food packaging, separators for lithium batteries, sterile films in the medical field and even flexible electronic films in industrial production. Most of these films are thin and fragile. Some are only a few micrometers thick which is equivalent to one hundredth of a human hair. A slight mistake during cutting can lead to burrs, tears, curling and other issues that directly affect product quality. Zirconia blades however are the “invisible sharp tool” that solves this problem and silently guards every precise cut.

The core material of a zirconia blade is “zirconia ceramic” a new type of inorganic non-metallic material with ultra-high hardness and toughness. It is not the ordinary ceramic we see in daily life which is brittle and fragile. Zirconia blades made through special sintering and grinding processes have a white and delicate appearance with edges as sharp as hair strands. They also have many advantages such as wear resistance, corrosion resistance, non-magnetism and rust resistance that perfectly meet the strict requirements of film cutting.

Simply put it is like a “gentle yet sharp” knife. It is sharp enough to easily cut through thin films and gentle enough not to cause any additional damage to the films. This is the core reason it has become the preferred tool for film cutting.

The core pain points of film cutting are “precision, seamless cutting and efficiency”. Ordinary metal blades such as stainless steel blades and carbon steel blades can hardly meet these needs. In contrast zirconia blades precisely address all pain points with outstanding advantages.

Zirconia blades have edges sharp enough to ensure burr-free and tear-free cutting. Films are usually between a few micrometers and tens of micrometers thick and have a fragile texture. Even a slight unevenness on the edge of an ordinary blade will pull the film during cutting which results in frayed edges, tears or irregular cuts. Zirconia blades however undergo precision grinding with edge accuracy reaching the micrometer level. They are sharp and smooth and cut as easily as “slitting paper” leaving flat and smooth cuts without any burrs or tears that perfectly preserve the integrity of the film. This advantage is particularly irreplaceable for flexible films such as PET, PE and PP as well as lithium battery separators that require extremely high cutting precision. Even ultra-thin separators with a thickness of only 5μm can be cut precisely without affecting subsequent lamination and packaging processes.

They are also wear-resistant and durable with strong cutting stability to reduce costs. Film cutting is mostly mass production which has high requirements for the wear resistance of blades. After cutting for a period of time the edges of ordinary metal blades will wear and become blunt requiring frequent replacement. This not only affects production efficiency but also increases consumable costs. Zirconia ceramic however has a hardness second only to diamond and its wear resistance is 10-20 times that of stainless steel blades. The service life of one zirconia blade is equivalent to that of dozens of ordinary metal blades. More importantly during long-term use the edges of zirconia blades wear evenly and will not become blunt suddenly. The cutting precision remains consistent at all times avoiding cutting deviations caused by blade wear. This effectively ensures the consistency of products in mass production and indirectly reduces the scrap rate and production costs.

Zirconia blades are non-magnetic and rust-proof making them suitable for special film scenarios. Many film products such as electronic films and medical films have strict requirements for “non-magnetism” and “no metal contamination”. Most ordinary metal blades are magnetic and will rust after long-term use. Rusty blades will contaminate the film leading to product scrapping. Zirconia blades on the other hand are non-magnetic, rust-proof and non-oxidizing. Even when used in humid and corrosive environments they can remain clean without causing any contamination to the film which perfectly adapts to the cutting needs of high-end films in electronics, medical care and other fields.

They also have good toughness so they are not easy to break and safer to use. Many people mistakenly believe that ceramic materials are “brittle” but after special modification zirconia ceramic has toughness far exceeding that of ordinary ceramic and even better than some metal materials. During the cutting process even if a zirconia blade is slightly impacted it is not easy to break or chip which makes it safer to use and avoids production interruptions and safety hazards caused by blade breakage.

With their unique advantages zirconia blades have been widely used in various film cutting scenarios covering electronics, packaging, medical care, new energy and many other industries and have become an indispensable core tool in mass production.

In the electronics industry they are used for cutting flexible electronic films and screen protectors. The cutting of flexible printed circuit films, screen protectors such as tempered film substrates and PET protectors in mobile phones, tablets, smart watches and other electronic products as well as the films of OLED flexible screens cannot do without zirconia blades. Such films have extremely high requirements for cutting precision and cleanliness. Zirconia blades can achieve seamless cutting avoiding the impact of cutting problems on the lamination and use of electronic components.

In the new energy industry they are applied to lithium battery separators. Lithium battery separators are the “safety guards” of lithium batteries. They are usually 10-20μm thick and require high temperature resistance, puncture resistance and flat cutting edges. The precise cutting of zirconia blades ensures that the separators have no burrs or tears which effectively prevents short circuits, fires and other safety hazards caused by separator damage during the charging and discharging of lithium batteries. They are one of the core consumables in lithium battery production.

In the packaging industry zirconia blades are used for cutting food packaging films and plastic films. PE, PP, PVC films commonly used in food packaging as well as packaging films for daily chemical products require both efficiency and aesthetics during cutting. Zirconia blades are wear-resistant and durable enabling high-speed mass cutting with flat edges without curling or burrs. They not only ensure the sealing of the packaging but also improve the appearance quality of the products.

In the medical industry they are suitable for cutting sterile films and medical dressing films. Sterile medical films and films for medical dressings such as band-aids and sterile dressings have extremely high requirements for cleanliness and no contamination. Zirconia blades are non-magnetic, rust-proof and do not shed debris. They will not contaminate the film during cutting which ensures the sterility and safety of medical products and meets the strict standards of the medical industry.

For film cutting the core value of zirconia blades is to “solve the pain points of film cutting with precision and durability”. They not only make up for the shortcomings of ordinary metal blades such as easy wear and poor cutting quality but also solve the problems of ordinary ceramic blades such as brittleness and poor toughness which makes them the “preferred tool” for high-end film cutting.

From the mobile phone screen protectors we come into contact with daily to the lithium batteries of new energy vehicles and even to sterile medical dressings zirconia blades though unseen by us are always working silently behind the scenes. With every precise and seamless cut they guard product quality and promote the efficient development of industries such as electronics, new energy and medical care.

Microporous vs. Porous Ceramics: Key Differences and Industrial Applications

Advanced ceramic materials have become an indispensable foundation support in modern industry, and are widely applied in key fields such as semiconductor manufacturing, environmental engineering, new energy, and high-end equipment. Although microporous ceramics and porous ceramics have similar names and are often confused in practical applications, they have significant differences in their microstructure and applicable scenarios, and their functional focuses are also different.

For engineers and purchasing personnel, accurately identifying the differences between the two is an important basis for meeting the working conditions and achieving scientific material selection.

I. The Difference Between Micro-porous Ceramics and Porous Ceramics

The core differences between the two mainly lie in aspects such as aperture range, controllability of pore structure, and performance emphasis.

1. Microporous ceramics

The pore diameters of microporous ceramics usually fall within the range of micrometers to sub-micrometers (referred to as “microporous structure” in engineering applications). This type of material relies on precise formulation design and sintering processes to achieve highly uniform and controllable pore structure distribution.

Its main features include:

Uniform pore size distribution and regular structure
Strong controllability of pore structure
Suitable for functional scenarios such as precision filtration, gas diffusion, and capillary action

Furthermore, micro-porous ceramics with controllable surface roughness (such as Ra 0.4) have particularly outstanding performance in high cleanliness and precise fluid control applications.

2. Porous ceramics

Porous ceramics generally refer to ceramic materials with relatively large pore diameters (mostly macroscopic pore structures), whose pore structure is relatively irregular and the overall porosity is high.

Its main features include:

The aperture range is wide, and the pore distribution is irregular.
The porosity is high, and the permeability is strong.
It places greater emphasis on mechanical strength and high-temperature resistance.

Compared with microporous ceramics, porous ceramics place more emphasis on overall flux and structural performance rather than precise control of pore size.

3. Differences in Preparation Process

From a manufacturing perspective, there are significant differences in the process routes for these two types of materials:

Microporous ceramics: Usually require more precise control of molding and sintering to achieve strict pore size distribution and consistency.

Porous ceramics: Typically are prepared using methods such as foaming, pore-forming agent method, or partial sintering method. The process is mature and the cost is relatively low.

II. Differences in Application Scenarios

Due to the differences in structural characteristics, there are significant distinctions in the application directions of microporous ceramics and porous ceramics in industry.

1. Typical applications of microporous ceramics

Microporous ceramics are suitable for scenarios that require high precision and stability. They mainly include:

Precise filtration systems (for liquids and gases)
Key functional components in semiconductor equipment
Fuel cells and gas diffusion layers
Medical filtration and sterilization devices

These applications typically emphasize filtration accuracy, fluid control capabilities, and long-term stability.

2. Typical Applications of Porous Ceramics

Porous ceramics are more suitable for high-temperature environments and high-flow conditions, such as:

High-temperature insulation and heat preservation materials (e.g., industrial furnace linings)
Catalyst carriers in the chemical and environmental protection fields
Melt metal filtration
Sound absorption and noise reduction, as well as lightweight structural components

These applications place greater emphasis on the structural stability, heat resistance, and overall permeability of the material.

III. Suggestions for Selecting Materials

In actual engineering applications, the corresponding materials can be selected according to the requirements:

When there are demands for precise filtration, controllable permeation and high-precision fluid management, it is recommended to preferentially use microporous ceramics;

For scenarios that mainly require heat insulation, structural support or large flow rate circulation, porous ceramics have a higher cost-performance ratio and are more durable.

IV. Summary

Although both microporous ceramics and porous ceramics belong to the category of porous structure ceramics, the differences in pore structure, performance characteristics and practical application directions are quite obvious.

A thorough understanding of these differences will enable more precise material selection, which not only improves the operational efficiency of the entire system but also helps to better control costs and ensure the usage effect over the long term.

If you need customized solutions for microporous ceramics or porous ceramics, please feel free to contact us via email: sales@innovacera.com.

Why Use Ceramic-to-Metal Sealing? Advanced Solutions for Glass Substrate Chips

You hear a lot of noise lately about glass substrates taking over the advanced semiconductor packaging industry, which makes perfect sense when you consider how incredibly flat they are for routing those impossibly tiny signals in modern AI chips. People often ask me if this massive shift toward glass cores means that the old reliable sealing methods are suddenly becoming obsolete in the face of new technology. Actually, putting an expensive and highly sensitive chip on a beautiful glass substrate makes the physical outer protection of that component even more critical than before.

Why do glass substrate chips require ceramic-to-metal sealing?

While a glass substrate acts as the ultra-smooth internal highway system for data routing within an advanced semiconductor, it absolutely requires ceramic-to-metal sealing to provide the heavy-duty external vault that stops moisture and air from ruining that delicate internal setup.

Specifically, these technologies work together in a few critical ways:

1. Thermal matching: Both the internal glass and the external ceramic must perfectly align with the thermal expansion of the metal pins to avoid cracking when things get hot.

2. Hermetic protection: High-performance chips mounted on glass substrates demand vacuum-tight spaces that only true hermetic seals can reliably maintain over a long lifespan.

3. Environmental survival: The rugged outer ceramic housing absorbs the actual mechanical stress and high pressures so the fragile glass core never has to deal with the outside world.

If you look at the whole picture of an electronic component working out in the field, you will quickly understand why these two distinct concepts do not compete with each other but actually belong in the exact same room. A glass substrate gives you incredible electrical performance with practically zero signal loss, which is exactly what data centers and advanced sensors need right now to push the boundaries of computing. But once you build that amazing brain, you still have to plug it into the messy, hot, and unpredictable outside world without breaking it.

Based on my experience dealing with high-voltage feedthroughs and sensor housings here at Innovacera, carefully matching the Coefficient of Thermal Expansion between our high-purity alumina and the Kovar alloy pins is the only reliable way to prevent those microscopic stress fractures from forming over years of heavy use. The protection must be absolute. You can have the fastest and most technologically advanced glass substrate in the world sitting quietly inside your device, but if the outer shell lets in even a microscopic drop of moisture during a sudden temperature shift, the entire expensive package simply fails.

We spend a massive amount of time making sure that the transition from ceramic to metal is completely flawless because high-end electronics simply cannot afford unpredictable leaks when deployed in the field. Since every advanced chip architecture brings its own unique physical dimensions, standard off-the-shelf parts rarely work. This is exactly why we support custom manufacturing to engineer a hermetic package that perfectly matches the exact geometry of your specific device. When you use precise brazing techniques to join the ceramic and metal parts, you get a solid, dependable package that can easily withstand harsh environments and temperatures well over 500 degrees Celsius while maintaining a perfectly vacuum-tight space inside.

We usually measure this hermeticity down to extremely strict levels, which is really just our technical way of ensuring that absolutely nothing is getting through our barrier to harm the sensitive electronics inside. So, while the brilliant engineers over in the semiconductor labs keep making the internal glass substrates thinner and faster, we will keep focusing our energy on building the impenetrable ceramic and metal walls that keep all those amazing innovations completely safe from the elements.

PCIM Europe 2026 Preview: Focus on Power Electronics and Advanced Materials Trends

Against the backdrop of the rapid development of new energy and high-power electronic applications, high-performance materials are becoming the key to enhancing system efficiency and reliability. PCIM Europe 2026 will be held in Nuremberg, Germany in June 2026, bringing together the latest technologies and innovative achievements in the global power electronics field.

Innovacera will participate in the exhibition with a variety of advanced ceramic solutions (booth number: 5-112), highlighting the applications of boron nitride, microporous ceramics, and aluminum oxide and aluminum nitride substrates in power devices, electronic packaging, and precision processing.

Regarding PCIM Europe 2026

PCIM Europe is currently the most influential professional exhibition and communication platform in the global power electronics industry. The exhibition has been dedicated to promoting the innovation and upgrading of power electronic technology in the industrial and practical scenarios. This year’s exhibition brought together equipment manufacturers, material suppliers, system integrators, and research institutions from all over the world. They collectively showcased the latest technological achievements in core fields such as power semiconductors, drive control, energy management systems, and advanced materials. The exhibition covered the entire industrial chain from device research and development, material development to system implementation and application, and also provided a high-quality platform for technical exchanges and cooperation among industry professionals. As an important platform connecting academic research and industrial practical applications, PCIM Europe not only demonstrates the current technical level of power electronics but also focuses on future development directions such as energy transition, electrification systems, and efficient power conversion. It continuously provides support for the innovative development of related industries worldwide.

Time and Place: June 9th to 11th, 2026, Nuremberg Exhibition Center, Germany

Item	Details
Year	2026
Format	In-Person
Scope	International exhibition covering the full power electronics value chain
Exhibitors	Leading global companies in power electronics and advanced materials
Focus Areas	Power semiconductors, drive technologies, energy systems, thermal management, and advanced materials
Show Hours	9:00-17:00
Audience Profile	Industry experts, manufacturers, research institutions, universities, and media

Main Material Trends and Applications

The advantages of boron nitride and its applications in the semiconductor field

Boron nitride possesses excellent thermal conductivity and electrical insulation properties, and is widely used in semiconductor and power device cooling-related solutions.
It plays a significant role in the cooling design of power devices and intelligent packaging.
Demonstration cases include: LED heat sink, microelectronic packaging structure.

Porous ceramics for microelectronic packaging

Porous ceramic materials possess excellent high-temperature stability and lightweight characteristics, making them suitable for high-density electronic packaging applications.
Typical applications include the design of heat dissipation structures in semiconductor modules.

Alumina and AlN substrates

Alumina substrates have the advantages of moderate cost and stable performance, and are suitable for conventional power device applications.
AlN substrates, on the other hand, possess higher thermal conductivity and excellent dimensional stability, and are suitable for high-performance power modules and precision packaging fields.
The demonstration cases include power modules and precision packaging applications.

Precision processing of ceramic components

Precision processing of ceramic components enables the manufacturing of complex microstructures, meeting the high precision requirements of semiconductor packaging and optoelectronic devices.
In power device heat dissipation modules, microporous ceramics and boron nitride materials are also used in the design of key structures, and relevant application examples are presented.

Industry Trends and the Advantages of the German PCIM Platform

Currently, the development in fields such as new energy, electric vehicles, energy storage systems, and data centers is continuously driving the upgrade of power electronic technology. It places higher demands on efficiency, power density, and thermal management capabilities, and also leads to an increase in the demand for high-performance materials.

Germany has a mature industrial foundation and engineering technology system in the fields of power electronics and high-end manufacturing. Now, centered around Nuremberg, a favorable atmosphere conducive to technological exchanges and industrial cooperation has been formed in the region. PCIM Europe 2026 is an important international exhibition held under such circumstances. It brings together numerous enterprises and industry experts from the global power electronics and advanced materials fields, showcasing various core technologies and application results, and also establishing an efficient platform for technical exchanges and cooperation connections among the upstream and downstream of the industry chain.

We welcome you to visit and contact us

PCIM Europe 2026 is not only a platform for showcasing products, but also an important opportunity to gain a deeper understanding of industry trends and expand cooperation opportunities. Innovacera’s boron nitride, microporous ceramics, alumina and aluminum nitride substrates, as well as various precision processing components, have been widely applied in the markets of Asia, Europe and the United States, covering multiple fields such as power device heat dissipation, microelectronic packaging and the manufacturing of complex and precise structures. The materials showcased at this exhibition represent only a portion of our application cases. If you have any requirements related to high-performance heat dissipation, precise sealing, or customized substrates, please feel free to contact us for technical support. Alternatively, you can visit our booth (5-112) for on-site communication.

MCH Ceramic Heater Selection Guide for Different TCR Values

The core principle for selecting the TCR (Temperature Coefficient Resistance) value of MCH ceramic heaters is to match the customer’s actual needs and specific usage scenarios. A properly matched TCR value ensures stable heater operation, extends service life, and adapts to the overall performance of the equipment. The following are detailed selection points:

I. Core Selection Basis: Matching Scenarios and Needs

The TCR value directly affects the heater’s starting power and current. It must be precisely selected based on the voltage conditions and equipment requirements of the usage scenario. The specific correspondences are as follows:

1. High TCR Value: Suitable for High-Voltage Use Scenarios

MCH ceramic heaters with high TCR values are suitable for high-voltage working environments. Their core advantage is a larger starting power, which can quickly meet the heating needs of the equipment. A typical application scenario is electronic tool heaters—such equipment has high starting power requirements, and a high TCR value ensures rapid heater start-up and efficient heating, guaranteeing the normal operation of the tools.

2. Low TCR Value: Suitable for Low-Voltage Use Scenarios

MCH ceramic heaters with low TCR values are more suitable for low-voltage working environments. Its core feature is a low starting current, which effectively reduces power loss to the power supply (especially battery-powered equipment), preventing damage to the battery and extending the power supply’s lifespan due to excessive starting current. It is compatible with various low-voltage heating devices.

II. Special Scenarios: Imitating Existing Customer Products

If the project requires imitating an existing customer heater product (i.e., replicating the product), it is recommended not to change the original TCR value. This is because the original product’s TCR value is fully compatible with the customer’s equipment, usage scenario, and power supply conditions. Blindly modifying the TCR value may lead to incompatibility between the heater and the equipment, resulting in problems such as abnormal starting, unstable heating, and equipment damage. Maintaining the original TCR value is crucial to ensuring consistent performance of the replicated product.

III. Summary

There is no absolute superiority or inferiority in the selection of the TCR value for MCH ceramic heaters. The core principle is “scenario adaptation and requirement matching”: High-voltage scenarios requiring high starting power (e.g., electronic tools) → Choose a high TCR value; Low-voltage scenarios requiring low starting current (to protect the battery) → Choose a low TCR value; Replicating customer products → Keep the original TCR value unchanged.

If you have more questions regarding the ceramic heater, pls consult with us at sales@innovacrea.com.

When to Use Boron Nitride Crucibles? BN vs Alumina and Zirconia

In high-temperature experiments and material processing, the crucible is not merely a container for loading materials; it directly affects the purity of the materials, the stability of the process, and the performance of the final product.

For common crucible materials such as alumina, zirconia, and silicon nitride, they can already meet the needs of most industrial scenarios. However, in some cases where the requirements are extremely high and the working conditions are more demanding, boron nitride crucibles often become the indispensable alternative.

So in what scenarios must we prioritize the use of boron nitride crucibles?

I.. When the melt fails to adhere: Non-wetting properties determine process quality

1. Principle Analysis

Boron nitride has an extremely low surface energy and exhibits excellent non-wetting properties towards various molten substances, meaning that the molten material is not likely to spread or adhere to its surface.

In contrast:

· Alumina: Can be partially wetted by certain metals

· Zirconia: Exhibits adhesion phenomena in specific systems

This means that the BN crucible can achieve a more “clean” release of the material.

2. Application Case: Aluminum Liquid Treatment

During the melting process of aluminum and aluminum alloys, common problems include:

· The molten metal adheres to the inner wall of the crucible

· The pouring is not thorough

· Residues affect the purity of the next batch

After using boron nitride crucibles:

· The molten aluminum hardly adheres

· It can be completely poured out

· The frequency of cleaning is significantly reduced

Applicable scenarios: Metallurgical processing of non-ferrous metals, glass treatment, salt melt process technology

II. When purity is of utmost importance: Chemical inertness prevents contamination

1. Principle Analysis

Boron nitride exhibits extremely strong chemical stability:

· It does not react with the melt

· It does not release impurity elements

· It does not introduce ion contamination

In contrast, some oxide ceramics may undergo interface reactions or element migration at high temperatures.

2. Application Case: Processing of High-Purity Metals (Ga / In)

In the semiconductor field, materials such as gallium (Ga) and indium (In) are extremely sensitive to purity:

· Even a small amount of contamination can affect electrical performance

· The requirements for container materials are extremely high

After using boron nitride crucibles:

· Effectively prevent impurities from being introduced

· Maintain the high purity of the material

· Meet the requirements of semiconductor-level processes

Applicable scenarios: Semiconductor material preparation, single crystal growth, functional material development

III. When there is a significant temperature variation: The thermal shock resistance is more reliable.

1. Principle Analysis

Boron nitride possesses:

· Low thermal expansion coefficient

· Excellent thermal shock resistance

· Good structural stability

Can withstand the stress changes caused by rapid heating and cooling.

2. Application Case: Laboratory Rapid Thermal Cycling

In scientific research experiments, crucibles often require:

· Multiple rapid heating and cooling cycles

· Local heating (such as induction heating)

· Frequent repeated use

After using boron nitride crucibles:

· Significantly reduce the risk of cracking

· Extend service life

· Improve experimental efficiency

Applicable scenarios: Material testing, research and development experiments, heat treatment processes

IV. When in a Vacuum or Inert Atmosphere: Significant Advantages in Environmental Stability

1. Principle Analysis

Boron nitride exhibits excellent stability in the following environments:

· Vacuum

· Inert atmospheres such as nitrogen and argon

· Reductive atmosphere

However, it should be noted that:

Boron nitride begins to oxidize in the air at approximately 800–900℃. It is not suitable for long-term high-temperature oxidation environments and is more suitable for use in a vacuum or inert atmosphere.

2. Application Case: Vacuum Evaporation and PVD Process

During the vacuum evaporation process, the crucible needs to withstand high temperatures for a long time and remain clean.

After using boron nitride crucibles:

· No contamination of the evaporation materials

· The process becomes more stable

· Extends the service life of the equipment

Applicable scenarios: Vacuum coating, powder sintering, high-temperature experimental equipment

V. Comparison of Properties of Different Crucible Materials

Performance Dimension	Boron Nitride (BN)	Alumina (Al₂O₃)	Zirconia (ZrO₂)	Silicon Nitride (Si₃N₄)
Non-wettability	⭐⭐⭐⭐⭐	⭐⭐	⭐⭐⭐	⭐⭐⭐
Chemical Stability	⭐⭐⭐⭐⭐	⭐⭐⭐	⭐⭐⭐	⭐⭐⭐
Thermal Shock Resistance	⭐⭐⭐⭐⭐	⭐⭐	⭐⭐⭐	⭐⭐⭐⭐
Operating Atmosphere	Vacuum / Inert	Air	Air / Controlled	Inert
Cost	Relatively High	Low	Medium	Relatively High

VI. How to Select the Appropriate Crucible Material?

In practical applications, material selection should be based on the core requirements of the process:

· If cost and versatility are the priorities: alumina can be given priority consideration.

· If high-temperature structural stability is the concern: zirconia or silicon nitride can be chosen.

· If high purity, non-wetting or thermal shock resistance are required: boron nitride has more advantages.

VII. Conclusion

The selection of crucible material essentially matches the process requirements.

When your application involves the following key conditions:

· The melt does not adhere

· High purity control

· Intense temperature changes

· Vacuum or inert atmosphere

Boron nitride crucibles are often not only a better choice, but even the only feasible solution.

For different sizes, structures and application requirements, boron nitride crucibles also support customized designs to meet diverse industrial and scientific application scenarios. Please contact sales@innovacera.com for more information.

Ceramic-Metal Sealing Technology: Core Processes, Materials, and Industrial Applications

Ceramic‑metal sealing technology represents a key manufacturing process. It achieves stable and reliable bonding between ceramic materials and metal materials through physical or chemical integration mechanisms. This technology acts as an indispensable fundamental support for high‑performance equipment in numerous core industries including semiconductor manufacturing, and industrial automation. As an advanced integrated process, it effectively improves the hermetic performance, high‑temperature resistance, and structural stability of related products. It also greatly prolongs the service life and enhances the operating reliability of key core components. Driven by the continuous pursuit of higher precision and stronger harsh‑environment adaptability in modern industries, ceramic‑metal sealing technology has gradually developed into a crucial driving force that supports and promotes the innovation and upgrading of cutting‑edge industrial equipment.

The core implementation of ceramic‑metal sealing depends heavily on the rational selection of matching processes and suitable materials. Such selection is essential to solve the inherent technical challenges that arise during the connection of two completely dissimilar materials, among which the typical problems include the mismatch of thermal expansion coefficients and insufficient wettability of solder on ceramic surfaces. A variety of mature sealing processes are widely used in industrial production and advanced manufacturing. These commonly applied processes mainly include brazing, ceramic metallization, active metal brazing, vacuum evaporation sealing, pressure sealing, and laser welding. Among these available technical solutions, brazing has become one of the most widely used and recognized sealing methods due to its high stability and strong applicability. The working principle of brazing can be described in a clear and systematic manner. A layer of filler metal with a melting point lower than that of the base materials is placed between the ceramic part and the metal part. The entire assembly is then heated to a specific temperature that can fully melt the solder without changing the structure and performance of the base materials themselves. After being heated to a molten state, the solder will fully wet and uniformly spread on the contact surfaces of the two materials. It will effectively fill the tiny gaps and defects at the joint interface. When the temperature decreases and the solder solidifies, a firm and stable metallurgical bond will be formed between ceramic and metal. Such a metallurgical bond can effectively guarantee the long‑term structural stability and service reliability of the sealed components.

For ceramic materials that exhibit low wettability to conventional solders, the ceramic metallization process, which is also referred to as indirect brazing, is commonly adopted in industrial production. In this process, the surface of the ceramic substrate is first subjected to pre-metallization treatment by means of typical methods such as the Mo-Mn process. This treatment is designed to construct a continuous and dense transition layer on the ceramic surface, and such a layer can significantly improve the adhesion strength between the ceramic and the molten solder. On the other hand, active metal brazing, which is often called direct brazing, provides another effective technical route for ceramic-metal bonding. This method can completely omit the pre-metallization step by introducing specific active elements into the solder system. Typical active elements include titanium (Ti) and zirconium (Zr). Under certain temperature and atmosphere conditions, these active elements will undergo sufficient chemical reactions with atoms on the ceramic surface. Such reactions will promote the formation of a compact and stable interfacial reaction layer. The generation of this layer enables direct and reliable bonding between ceramic and metal without additional surface modification. Among various solder materials used in active metal brazing, Ag-Cu-Ti solder is the most extensively applied in engineering practice. This type of solder is widely recognized for its outstanding bonding performance. It also possesses excellent interface compatibility with most common ceramic substrates and metal substrates, making it suitable for diverse ceramic-metal sealing applications.

Material selection plays a decisive role in determining the final success and service performance of ceramic‑metal sealing. In the entire sealing system, the most critical design requirement is to achieve a high degree of matching between the thermal expansion coefficients of ceramic materials and metal materials. This matching design can effectively reduce the residual thermal stress generated during the heating and cooling process, thereby avoiding interface cracking or structural failure caused by stress concentration. Metals with low and stable thermal expansion coefficients are often preferred in engineering applications. Typical representatives include tungsten (W), molybdenum (Mo), and Kovar alloy. These metal materials have become mainstream choices in ceramic‑metal sealing systems. The main reason is that their thermal expansion characteristics are highly compatible with commonly used structural ceramics such as alumina (Al₂O₃) and silicon nitride (Si₃N₄). Solder materials used for ceramic‑metal sealing must meet a series of strict performance indicators. These indicators mainly include a suitable melting point range, excellent wetting ability on the material surface, and strong interface gap‑filling capacity. At present, a variety of solder systems are widely used in the field of ceramic‑metal sealing. These commonly used solders include Ag‑Cu‑Ti active solders, copper‑based solders, gold‑based solders, and oxide glass solders. Among these types of solders, oxide glass solders have unique application advantages. They are specially developed and designed for ultra‑high‑temperature sealing environments above 1500℃. During the cooling process after sealing, such solders will in situ form a high‑strength glass‑ceramic composite bonding layer at the interface. This special structure enables the sealed components to maintain excellent structural stability and service reliability in extremely harsh high‑temperature environments.

Ceramic‑metal sealing components have been widely applied in a variety of high‑tech industrial sectors. These products provide critical support for the stable operation of advanced equipment in modern industry. As a typical representative, electrical feedthroughs can realize the reliable transmission of electric energy, gas media, or fluid media in a closed environment. At the same time, they can maintain excellent airtight performance and electrical insulation properties. For this reason, feedthroughs have become indispensable core components in semiconductor manufacturing equipment and particle accelerators. Multipin connectors can achieve stable signal transmission and power supply transmission under extreme working conditions. These harsh conditions include ultra‑high vacuum, high pressure, and strong vibration environments. Such components provide important guarantees for the reliable operation of precision analytical instruments. Coaxial components have excellent anti‑interference performance. They can effectively suppress and isolate radio frequency interference. Therefore, they are widely used in communication systems and microwave equipment. Isolators can provide safe and stable electrical isolation for fluid transmission systems. They play an important role in ensuring the safety and stability of the whole system. Thermocouple feedthroughs can realize accurate temperature measurement and signal transmission in high‑temperature furnaces and industrial machinery. They ensure the accuracy and real‑time performance of temperature monitoring in key working links.

Viewport assemblies are typically fabricated using high-performance optical materials such as sapphire and fused silica. These materials possess excellent light transmittance and structural stability under harsh working conditions. Such viewport assemblies can provide stable and reliable optical observation channels for vacuum systems. They allow light beams or imaging signals to pass through without interference while maintaining the airtightness of the vacuum environment. Therefore, they are widely used in laser processing systems, precision optical imaging equipment, and other related high-tech fields.

Filament assemblies rely on mature and reliable metal-ceramic sealing technology. This technology ensures stable operation and effective insulation under high-temperature working conditions. It enables stable and long-term high-temperature electron emission during operation. As a result, filament assemblies have become key core components in advanced scientific instruments and industrial equipment. Typical application scenarios include scanning electron microscopes (SEM), transmission electron microscopes (TEM), and high-precision semiconductor manufacturing equipment.

In summary, ceramic‑metal sealing technology effectively overcomes the core technical challenges associated with the joining of dissimilar materials. It achieves this goal through strict and precise process control as well as careful and scientific material matching design. This technology possesses outstanding performance advantages. It can stably withstand extreme environments including high temperature, high pressure, and strong corrosion. Due to these unique capabilities, it has become an indispensable and irreplaceable key supporting technology in the field of modern industrial manufacturing. With the continuous development of global industries toward miniaturization, high efficiency, and higher reliability requirements, ceramic‑metal sealing technology will keep undergoing continuous iteration and progressive upgrading. It will further promote and lead a series of innovative technological breakthroughs in key strategic fields. These fields mainly include semiconductor equipment, medical devices, and other high‑end manufacturing sectors. No matter in the optimization of existing manufacturing processes or the research and development of new sealing materials, the development direction of ceramic‑metal sealing technology is clear and definite. The continuous pursuit of higher bonding strength, better service durability, and more cost‑effective sealing solutions will always be the central focus and core goal that guides the long‑term technological evolution of ceramic‑metal sealing. Please contact sales@innovacera.com for more information.