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Innovacera to Showcase Advanced Ceramic Solutions for Semiconductor Manufacturing at SEMICON Europa 2025 – Booth #C2/249

Innovacera is pleased to announce its participation in SEMICON Europa 2025, one of Europe’s premier trade shows for the semiconductor industry, taking place November 18–21, 2025, at the Trade Fair Center Messe München, Am Messesee 2, 81829 Munich. We welcome you to visit us at Booth #C2/249 to explore how our advanced ceramic solutions empower next-generation semiconductor manufacturing through precision, reliability, and superior thermal performance.

Pioneering Ceramic Solutions for Semiconductor Equipment

As the semiconductor industry pushes toward higher integration, smaller geometries, and greater thermal demands, material performance becomes a critical factor in achieving manufacturing precision and yield. Innovacera’s technical ceramics are engineered to meet these challenges—offering excellent electrical insulation, thermal conductivity, and dimensional stability under extreme conditions.

Innovacera’s Key Exhibits at SEMICON Europa 2025

✅ Boron Nitride Parts for PVD Machines – Exceptional machinability, high temperature resistance, and excellent non-wetting properties make BN an ideal material for thin film deposition systems.

✅ Thermal Transfer Plate – Designed to provide stable and efficient heat exchange for semiconductor process equipment, ensuring uniform temperature distribution.

✅ Alumina and Aluminum Nitride Parts for Semiconductor Applications – Delivering high dielectric strength, thermal stability, and corrosion resistance for wafer processing and chamber components.

✅ ALN Cover Heater – Made from hot-pressed aluminum nitride ceramics, the ALN cover heater offers exceptional thermal conductivity (up to 210 W/m·K) and electrical insulation.

✅ Aluminum Nitride Wafer Substrates (ALN Wafer) – High-purity aluminum nitride wafers offering outstanding thermal conductivity and mechanical strength, supporting the next generation of high-power and high-frequency devices.

Driving Performance in Semiconductor Manufacturing

Innovacera’s ceramic materials are integral to critical semiconductor manufacturing processes such as PVD, CVD, etching, and wafer handling. Our boron nitride and aluminum nitride components deliver unmatched reliability under high-vacuum and high-temperature conditions, while thermal transfer plates and cover heaters ensure precise thermal control for process consistency. These solutions contribute to improved equipment uptime, reduced contamination, and higher production efficiency.

Whether your focus is wafer fabrication, deposition technology, or equipment innovation, Innovacera provides tailored ceramic solutions to meet your specific engineering requirements.

Event Details

Event: SEMICON Europa 2025
Dates: November 18–21, 2025
Location: Trade Fair Center Messe München, Am Messesee 2, 81829 Munich
Innovacera Booth: #C2/249

Innovacera will also be exhibiting at another booth during the same event — visit us at [B2 Hall 1409] to explore more advanced ceramic solutions: Innovacera Will Showcase Technical Ceramic Solutions for Electronic Manufacturing at Productronica 2025 in Booth B2 Hall 1409

Black Alumina Ceramic: Ideal Material for High-Reliability Optoelectronic Packaging

Traditional white alumina ceramics have held a significant market position in electronic packaging applications due to their excellent electrical insulation, high-temperature resistance, and mechanical strength. However, with the rapid miniaturization and high-powerization of optoelectronic devices, users’ demands for the optical purity and signal accuracy of products have become increasingly strict. The high-reflectivity white ceramic surface can no longer meet the requirements of many high-precision packaging fields. For this purpose, black alumina ceramic materials were developed. These materials not only retain the original characteristics of the materials but also possess excellent light absorption properties and low reflectivity.

Black alumina ceramics are made from alumina materials by doping specific metal or non-metal ions. These dopants can absorb various light waves in the visible light spectrum, thereby achieving a stable black appearance. This material can meet the light-shielding requirements of some electronic products in high-reliability packaging. Moreover, compared with other ceramic materials, it has numerous advantages and enjoys extensive practical value in industrial applications.

The core advantages of black alumina in ceramic packaging:

(1) Excellent light-blocking and anti-reflective performance: Maintaining the purity of light signals

Traditional white alumina ceramics are semi-transparent, allowing light to pass through easily. This property can cause interference for light-sensitive devices (such as optical sensors and image sensors). In contrast, the surface light reflection rate of black alumina ceramic is lower, which can effectively reduce stray light and prevent light from reflecting onto the chip surface within the device cavity, thereby improving the purity of the laser output light and the signal-to-noise ratio of photoelectric detection.
This is precisely where its key value lies in laser module packaging, camera modules, and photo-sensitive sensors.

(2) Excellent heat dissipation performance: Rapid heat release

(3）Black alumina, due to the addition of carbon-based or metal oxide particles with higher thermal conductivity during the sintering process, has stronger infrared absorption and thermal radiation capabilities. This feature not only improves the overall thermal conductivity of the material but also enables faster heat dissipation and release in high-power packaging, significantly reducing the accumulation of thermal stress in devices, maintaining stable device temperatures, thereby extending service life and enhancing system reliability.

(4) High electromagnetic shielding efficiency: The “invisible protective layer” of the chip

By using special doping systems or microstructure design, black aluminum oxide can absorb and reflect electromagnetic waves while maintaining electrical insulation, achieving effective electromagnetic interference (EMI) shielding. It not only prevents internal signals from leaking out but also guards against external interference waves, ensuring the stability and reliability of the equipment’s operation.
Note: Not all black alumina materials possess significant EMI shielding capabilities. Functional packaging requires optimized designs, such as the addition of conductive phases or carbon doping.

(5) Inheritance of basic characteristics: A reliable foundation for packaging

Black alumina retains the fundamental advantages of white alumina ceramics, providing a solid foundation for microelectronic packaging design:

·High electrical insulation: Suitable for power devices and microelectronic substrates

·High mechanical strength and hardness: Ensuring the long-term stability of micro pads, substrates, bases, and casings

·Thermal expansion coefficient matched with the chip: Reducing cracks or peeling caused by temperature cycling

·Chemical stability: Capable of withstanding cleaning, reflow soldering, and various chemical environments

(6) Metalization processing capability: Multi-functional packaging capability

Black alumina ceramics can undergo various metallization processes, such as wire bonding, glass sealing, soldering, and other complex packaging techniques. By depositing metal layers such as Ni, Mo/Mn, or Ag on the ceramic surface, it can achieve a reliable connection with electronic chips or other packaging components, while ensuring airtightness and mechanical stability.

Application Examples:

Laser diode packaging and photodetector module: As a substrate or spacer, black oxidized aluminum ceramics can effectively absorb internal stray light, improve the purity of the laser output beam, while ensuring the high insulation and mechanical stability of the package, and enhancing the long-term reliability of the device.

Black support piece for camera module / Shading pad: Used in optical components such as micro cameras and projection modules, it serves as a shading pad and structural support material, effectively reducing light reflection and cross-light interference, preventing the image from experiencing glare and ghosting, thereby ensuring the clarity and color accuracy of the imaging.

Miniature sensor packaging shell, chip base: In MEMS sensors, optical sensors, or high-precision microelectronic modules, black alumina ceramics can be used as packaging shells or chip bases. Its material properties not only match the thermal expansion coefficient of the chip and possess reliable airtightness, but also can withstand thermal shock and mechanical stress, block external light interference, and ensure the stability of the sensor performance.

Vacuum packaging and MEMS device black substrate: In vacuum packaging or MEMS systems, the black alumina ceramic substrate not only provides a strong and high-temperature-resistant structural support, but also has the functions of optical shading and electromagnetic interference shielding, offering comprehensive protection for precision components.

Innovacera can offer customized services for black alumina ceramic packaging products. For more information on these products, please contact sales@innovacera.com.

Oxygen Sensors and the Role of Advanced Heating Elements

Introduction: What is an Oxygen Sensor?
An oxygen sensor is a key device for measuring the oxygen concentration in exhaust gas. At its core, the sensor relies on a zirconia or ceramic sensing element, supported by a built-in heater, which provides real-time feedback to the engine control unit (ECU). This feedback ensures that the engine maintains an ideal air-fuel ratio, thereby enhancing fuel efficiency, reducing emissions, and improving the overall performance of the engine.

Applications of Oxygen Sensors

Automotive

Installed both upstream and downstream of catalytic converters

Fundamental to meeting emission compliance standards (OBD-I and OBD-II)

Industrial
They are widely used in boilers, furnaces, and other combustion monitoring systems.

Environmental
Applied in gas detection, air quality monitoring, and safety systems

Types of Oxygen Sensors (Bosch Case Study)

Thimble Sensors: Traditional ceramic type, highly durable, requiring an external heater for fast activation.

Planar Sensors: Feature integrated heaters for quicker warm-up and lower power consumption.

Wideband / Air-Fuel Sensors: Measure precise oxygen concentration, allowing the ECU to fine-tune the air-fuel ratio.

Universal Sensors: Aftermarket-ready with flexible SmartLink™ connections.

Types of Oxygen Sensors

The Role of Heaters in Oxygen Sensors

To ensure normal operation, the oxygen sensor must reach a working temperature of 300–400 °C. Without a heating device, the sensor can only rely on hot exhaust gases to warm up, which will delay its startup and result in higher emissions during cold starts. Integrated heating elements, such as ceramic heating chips, solve this problem. They can provide rapid and reliable heating at the moment of engine startup.

sensor chip heater

Market Trends
Increasingly strict emission regulations → more sensors per vehicle

Growing adoption of wideband sensors for hybrid and modern engines

Expand the replacement market (with a service life ranging from 30,000 to 100,000 miles)

The demand for cost-effective OEM and aftermarket solutions continues to grow.
Advantages of Heating Chips

Heating chips (ceramic heating elements) are becoming the preferred solution for oxygen sensors due to several advantages:

Sensor chip heater temperature curve

Cost Advantage: Significantly more cost-effective than traditional heating systems

High Performance: Rapid warm-up, stable operation, reduced cold-start emissions

Compact Design: Ideal for integration into planar and wideband sensors

Durability: Advanced ceramic materials ensure long service life

Our Advantages as a Supplier
Competitive Pricing: We deliver heater solutions with outstanding cost benefits.

Complete Component Supply: Beyond heating chips, we provide a full range of oxygen sensor parts.

Reliable Quality: Our products match OE standards and can be customized to customer requirements.

Oxygen sensors are indispensable in modern vehicles, industrial applications, and environmental monitoring systems. As the industry moves towards faster and more cost-effective heating solutions, ceramic heating chips will drive the next wave of widespread adoption in this field. With our highly competitive pricing, complete component supply, and excellent quality, we are fully capable of providing support to original equipment manufacturers and aftermarket partners, helping them meet future demands.

Innovacera Will Showcase Technical Ceramic Solutions for Electronic Manufacturing at Productronica 2025 in Booth B2 Hall 1409

Innovacera will attend Productronica 2025, the world’s leading trade fair for electronic development and production, from November 18–21, 2025, at the Trade Fair Center Messe München. We invite you to visit us at Booth B2 Hall 1409 to explore how our technical ceramic solutions address critical challenges in electronic manufacturing, from high-density packaging to thermal management and precision assembly.

Ceramic Packages: The Gateway to Advanced Electronic Manufacturing

Productronica 2025 brings together the global electronics industry, featuring innovations in PCB, semiconductor, and assembly technologies. As electronic devices evolve toward miniaturization and higher power densities, traditional materials struggle to meet demands for reliability, thermal performance, and hermeticity. Innovacera’s technical ceramics offer exceptional electrical insulation, high-temperature resistance, and tailored thermal properties, making them ideal for next-generation electronic applications.

Innovacera’s Key Exhibits at Productronica 2025:

✅ Ceramic Packages (Primary Focus) – Hermetic encapsulation for semiconductors and sensors
✅ Ceramic Substrates – Materials: Al2O3, ZTA, ALN, Si3N4
✅ Ceramic-to-Metal Solutions & Metallized Ceramics – Customized sealing and integration
✅ Precision Miniature Ceramic Components – For production equipment and automation
✅ Ceramic Heating Elements – Alumina/Silicon Nitride-based, HTCC-processed, compact design with high power density (max. temperature: 1100°C)

Ceramic packages serve as a critical entry point for electronic manufacturing, providing robust protection and thermal management for ICs, MEMS, and power devices. Our ceramic substrates (e.g., AlN for high thermal conductivity) enable efficient heat dissipation in high-power circuits, while ceramic-to-metal solutions ensure reliable hermetic sealing for harsh environments. The precision miniature components support automated production lines with wear-resistant and stable performance. Additionally, our HTCC-fabricated ceramic heating elements deliver rapid thermal response and compact integration for applications requiring localized high-temperature control.

Precision Ceramic Components for Electronics

Whether you are designing advanced PCBs, power modules, or sensor systems, Innovacera’s ceramic solutions enhance performance and longevity. Visit our booth to discuss your specific requirements and learn how our expertise in ceramic packaging, metallization, and custom components can optimize your electronic manufacturing processes.

Event Details:

Productronica 2025
Dates: November 18–21, 2025
Location: Trade Fair Center Messe München, Am Messesee 2, 81829 Munich
Innovacera Booth: B2 Hall 1409

Innovacera will also be exhibiting at another booth during the same event — visit us at [C2 Hall 249] to explore more advanced ceramic solutions: Innovacera to Showcase Advanced Ceramic Solutions for Semiconductor Manufacturing at SEMICON Europa 2025 – Booth #C2/249

Ceramic Packaging for Micro Electro Mechanical Systems (MEMS): Solutions for Harsh Environments

Unlike single-function devices made by traditional manufacturing techniques, Micro Electro Mechanical Systems (MEMS) is a micro-sized controllable electromechanical device system that integrates micro-mechanical structures, sensors, actuators, and electronic components. This type of product has numerous advantages, including small size, light weight, low cost, low power consumption, high reliability, mass producibility, easy integration, and intelligent implementation. This also means that encapsulation not only needs to protect the internal microelectronic components from external impurities, but also provides a stable and controllable physical environment for the internal structure. Different types of MEMS products all have their own unique manufacturing processes and specific packaging forms. Ceramic packages, due to its excellent airtightness, outstanding thermal-mechanical properties, insulation, and thermal stability, generally offers better comprehensive performance in providing long-term reliability protection compared to metal or plastic packaging.

Commonly used ceramic packaging materials and characteristics

Aluminum oxide (Al₂O₃): Low cost, excellent insulation properties, commonly used in sensor substrates and packaging casings.

This is the most widely used and technologically mature ceramic packaging material. Its advantages lie in its excellent comprehensive performance and relatively low manufacturing cost. Its high resistivity (up to 10¹⁴ Ω·cm) and high dielectric strength also ensure excellent electrical insulation properties. However, its thermal conductivity is relatively lower than that of aluminum nitride, and it is not suitable for scenarios with extremely high power density.

Aluminum Nitride (AlN): High thermal conductivity, suitable for heat dissipation packaging of high-power MEMS devices.

Its thermal conductivity can reach 170–200 W/m·K, which is several times higher than that of alumina. Meanwhile, its thermal expansion coefficient is very close to that of silicon chips. This can significantly reduce the thermal stress generated by the package on the chip when the temperature changes, thereby enhancing the lifespan and stability of the device in harsh temperature environments. Therefore, it is commonly found in the packaging of high-power LEDs, lidar systems, high-performance computing chips, and tactical-level MEMS sensors.

Silicon nitride (Si₃N₄): High strength and chemical resistance, suitable for MEMS in harsh environments.

The advantage lies in its outstanding comprehensive mechanical properties, especially its extremely high fracture toughness and bending strength, which can provide unparalleled shock and vibration protection for sensitive MEMS structures. However, its manufacturing cost is higher than that of alumina. It is usually applied in scenarios that have extremely high requirements for reliability and mechanical strength, rather than in cost-sensitive consumer electronics.

Forms and processes of ceramic packaging

Co-fired ceramics (LTCC/HTCC): Suitable for mass production and capable of integrated wiring.

This process combines multiple layers of raw porcelain with metal circuits and conducts a high-temperature co-firing operation at one time, resulting in an airtight assembly containing complex three-dimensional interconnection structures. It not only facilitates mass production to reduce costs, but also enables high-density wiring and the embedding of passive components (resistors, capacitors, inductors), thereby enhancing the integration and miniaturization level of MEMS devices.

Hermetic packaging: Based on a ceramic substrate, it achieves long-term stability through metallization and glass brazing/laser welding.

This structure is the key to ensuring the long-term reliability of MEMS devices (such as gyroscopes, resonators). It undergoes metallization treatment on a ceramic substrate to form a sealing ring, which is then fused with the cover plate using glass brazing or laser welding, creating an internal inert or vacuum environment that can isolate moisture and contaminants, ensuring the stable performance of sensitive microstructures over long-term use.

Microchannel ceramic packaging: Integrated channel design for fluid MEMS and gas sensors.

Utilizing precision processing techniques such as laser ablation and solution coating stacking, microfluidic channels are directly manufactured within the ceramic substrate. This encapsulation process is essential for realizing functional MEMS devices such as microfluidic controllers, biochips, and gas sensors, as it enables controlled interaction between the working fluid and the sensing chip.

Application Examples

1. MEMS Gyroscope and Accelerometer: Used in aerospace and autonomous driving
The inertial sensor requires the internal micro-mass block to move in a vacuum environment to avoid the influence of air damping on the signal sensitivity, thereby achieving extremely high detection accuracy. The ceramic gas seal ensures the long-term stability of the internal vacuum environment and is the lifeline that guarantees its high precision and reliability.

2. MEMS Pressure Sensor: Used in automotive engine compartments and oil well monitoring

In extreme environments such as high temperature, high pressure, and corrosive media, ceramic packaging can serve as a mechanical isolation layer, preventing external stress from directly acting on the sensitive silicon chips. At the same time, its corrosion-resistant property enables it to come into direct contact with harsh media, which ensures the accuracy of the signal output.

3. RF MEMS Switches and Filters: For 5G/6G Communications and Radar Systems
These devices are extremely sensitive to high-frequency signals and require a stable working environment. Improper packaging can seriously degrade the Q value and insertion loss of the devices. Ceramic packaging (such as LTCC) offers low-loss transmission paths, excellent thermal management capabilities, and enables the embedding of multiple passive components (such as inductors and capacitors) onto the substrate, facilitating the miniaturization of system-level packaging.

Ceramic packaging in MEMS systems is far from being merely a simple protective shell. It plays a crucial role in ensuring the long-term stability and reliability of the devices in harsh environments, and can create a high-quality internal environment for MEMS devices to survive and function.

Zirconia Ceramics Used on Medical Application Case

Zirconia ceramics (ZrO₂) possess exceptional physical, chemical, and biological properties, making them an ideal material for various medical applications. The following summarizes their core properties and typical applications.

1. Excellent Biocompatibility

Non-toxic and non-allergenic: Zirconia does not produce rejection reactions with human tissues and does not release harmful ions, unlike certain metal alloys such as nickel-chromium.

Chemically inert and stable: It will not corrode or degrade in the physiological environment (more reliable than absorbable materials), allowing for safe long-term implantation in the human body.

Application Case:
The incidence of tissue inflammation around zirconia implants is 60% lower than that around titanium alloy implants in dental applications.

2. Mechanical Performance Advantages

Characteristics	Value	Medical Significance
Flexural strength	900–1200 MPa	Withstand high-frequency operation of surgical instruments
Hardness (Vickers)	1200–1400 HV	Maintain sharpness of surgical tools (e.g., surgical blades)
Elastic modulus	200–210 GPa	Similar to bone, reduces stress shielding in orthopedic implants

Application Cases:

Artificial hip joint femoral head (wear rate < 0.1 mm/year)

Minimally invasive surgical forceps (service life three times longer than stainless steel)

3. Chemical Stability

Corrosion resistance: Excellent resistance to body fluids and disinfectants such as hydrogen peroxide and ethylene oxide.

High-temperature stability: It can be safely used in 134 °C sterilization, performing better than polymer-based instruments.

Application Case:
Used in laparoscopic and robotic surgical instruments, such as electrodes and surgical forceps, where corrosion resistance and insulation minimize tissue adhesion and enhance surgical precision.

Laparoscopic instruments show no performance degradation after 500 sterilization cycles.

4. Functional Properties

Electrical insulation: Suitable for high-frequency electrosurgical scalpels and ultrasonic knife heads to prevent current leakage.

Low thermal conductivity: Reduces thermal damage to surrounding tissues during energy-based surgical procedures.

Surface modification: Polishing (Ra < 0.05 μm) or coating can reduce bacterial adhesion by up to 70%.

Application Case:
In high-frequency electrosurgical scalpels and ultrasonic knife heads, zirconia’s insulation and high-temperature resistance optimize device performance and minimize thermal damage to tissues.

From LEDs to IGBTs: Customized ceramic substrates meet diverse power and size requirements

As being intelligence and electrification in various industries, ceramic substrates have become an indispensable foundational material in power electronics, semiconductor packaging, and microelectronics. These products act as key of electronic components, serving as packaging and interconnect materials used to support, connect, dissipate heat, and protect them. With independent R&D system and comprehensive production processes, Innovacera offers high-performance ceramic products for a variety of applications, including 96% aluminum oxide (Al₂O₃), aluminum nitride (AlN), zirconium oxide (ZTA), and silicon carbide (Si₃N₄) substrates.

Multi-series product matrix, accurately matching diverse application needs

ceramic substrates

Innovacera provides ceramic substrates made of different materials to meet different customer applications:

1.96 Alumina (Al₂O₃)
Features: Low warpage, High thermal shock resistance, low warpage, high-temperature and resistant to acid and alkali corrosion, and excellent processability.
Applications: Thick/thin-film chip resistors, low-power LEDs, energy storage, and charging station substrates.

2. Aluminum Nitride (AlN)
Features: High thermal conductivity, high breakdown voltage and thermal expansion coefficient close to that of silicon wafers.
Applications: Heat sinks, High-power IGBT modules, high-power LEDs.

3. Zirconia Toughened Alumina (ZTA)
Features: High strength, high reflectivity, high thermal shock resistance, and excellent for processing.
Applications: Medium-power power modules, medium-power LEDs, and instruments.

4. Silicon Nitride (Si₃N₄)
Features: High thermal conductivity, high strength and toughness, coefficient of thermal expansion close to that of silicon wafers.
Applications: High-power IGBT modules, high-power heat sinks, and wireless modules.

Technological advantages across the entire industry chain, fully controlling the foundation of quality

1. Powder material is independent and controllable

Product raw material powder

Innovacera starts from the source, and its powder materials are independently controllable and of stable quality. The powder has high purity and low impurity content, which can realize batch production of powder, enhance stability, and better ensure the high consistency and stability of key parameters such as thermal conductivity and strength of the product.

2. Various molding processes
Proficient in various advanced ceramic forming technologies such as tape casting, dry pressing, isostatic pressing, etc., and able to select the most appropriate process according to the shape, size and performance requirements of the product, for better precision processing.

Specifications and dimensions：

Material	Unit	Al2O3	ZTA	AlN	Si3N4
Effective size（A、B）	mm	50.8-190	50.8-190	50.8-190	138*190
Thickness（T）	mm	0.25-1.5	0.25-1.5	0.25-1.0	0.25、0.32
Thickness Tolerance	mm	±5% （Min±0.03mm）	±5% （Min±0.03mm）	±5% （Min±0.03mm）	±5% （Min±0.03mm）
Warp（C）	mm	≤0.3%	≤0.3%	≤0.3%	≤0.3%
Surface Roughness	μm	0.2-0.6	0.2-0.5	0.2-0.75	0.2-0.75
Customizable in size, thickness, and surface roughness

3. Precision machining capabilities
Equipped with advanced equipment such as laser processing and grinding and polishing, it can achieve micron-level precision dimensional processing and ultra-low surface roughness (Ra value can reach nanometer level), meeting customers’ strict requirements for substrate shape, hole position and surface condition.

4.Strong independent R&D and customization capabilities
With more than 40 patents and contituing technical improvment, Innovacera’s R&D team can customize ceramic substrates with different thicknesses and performance parameters based on customers’ specific needs, providing one-stop solutions.

Product R&D Laboratory

5. Complete quality management system
With the IATF16949 automotive quality management system certification and a full-process quality control mechanism we are aimed to ensure that each substrate has stable performance and reliability. At the same time, we are equipped with a full range of precision testing and analysis instruments to assure high-standard quality.

Focusing on providing customers with a wide range of high-quality ceramic substrate products Innovacera offer one-stop ceramic substrate solutions, from standard parts to customized solutions. For more information on these products, please consult with sales@innovacera.com.

Zirconia Ceramic Parts For Tundish In the Powder Metallurgy Process

Zirconia ceramic parts, the main components of tundishes in the steel and metallurgical industry
The tundish is mainly used in the steel metallurgical process as a key component of the continuous casting process. Its primary function is to store and distribute molten steel, ensuring a continuous and stable flow from the ladle to the mold.

Main Components of a Tundish

Tundish Body — The main structure that holds molten steel, typically consisting of a refractory lining and a steel shell.

Lining — Includes the working layer in direct contact with molten steel and the permanent layer for thermal insulation. Commonly made from refractory bricks, castables, or spray coatings.

Stopper Rod — A critical part for controlling the molten steel flow rate and regulating the steel level in the crystallizer.

Submerged Entry Nozzle (SEN) — Introduces molten steel into the crystallizer while preventing oxidation and splashing.

Sliding Gate System — Precisely controls the molten steel flow rate, consisting of upper and lower slides and a drive mechanism.

Impact Pad — Reduces impact force during molten steel injection and prevents lining erosion.

Weirs & Dams — Optimize the molten steel flow path and promote the flotation and separation of inclusions.

Tundish Flux / Powder — Prevents oxidation of molten steel and helps retain heat.

Zirconia Ceramic Parts on the tundish

Zirconia ceramic key features include high corrosion resistance, excellent thermal shock resistance, and stability in high-temperature, making it suitable for the following key tundish components:

Shroud Nozzle (SEN) — Requires resistance to molten steel erosion and thermal shock. Zirconia ceramic can extend service life.

Stopper Rod Tip — Directly contacts molten steel and must be resistant to high-temperature erosion. Zirconia ceramic enhances corrosion resistance.

Sliding Gate Plates — Zirconia ceramic provides superior wear and thermal shock resistance against molten steel erosion and mechanical wear.

Impact Pads — Zirconia ceramic is effective in high-erosion areas, extending operational life.

Advantages of Zirconia ceramic

High-temperature resistance (up to 2000 °C)
Excellent thermal shock resistance (withstanding severe temperature fluctuations during continuous casting)
Superior resistance to molten steel and slag erosion (superior to alumina and mullite)

These unique features make Zirconia ceramics an ideal material for key refractory components in tundishes, particularly in the continuous casting of high-end steel grades.

Boron Nitride Electrode insulator for Ion Implanter

What is Boron Nitride?

Hexagonal boron nitride (h-BN) ceramic has a microstructure similar to graphite. It is manufactured by hot pressing boron nitride powders at temperatures up to 2000 °C and high pressure. The maximum blank size is 500 × 500 × 200 mm, and it can be further machined into complex shapes.

Why Can Boron Nitride Ceramics Be Used in Ion Implanters?

Ion implantation is a key process in semiconductor manufacturing, where wafers are doped with foreign atoms to modify material properties such as conductivity and crystal structure.

BN Insulator

The high-current extraction electrode is the core of an ion implanter system. It must withstand temperatures up to 1400 °C, strong electromagnetic fields, aggressive process gases, and high mechanical forces.

Therefore, components made from boron nitride insulator ceramics help ensure that this process remains efficient, precise, and free of impurities.

The unique combination of exceptional thermal, physical, and chemical characteristics of INNOVACERA’s Boron Nitride ceramics makes them ideal for addressing critical challenges in insulator applications.

Boron Nitride Electrode insulator for Ion Implanter

Boron Nitride Material Advantages

Non-Wetting

High Electrical Resistivity

High Thermal Conductivity

Excellent Machinability

Good Chemical Inertness

High-Temperature Resistance

High Dielectric Breakdown Strength

Excellent Thermal Shock Resistance

Excellent Lubricating Properties (Low Coefficient of Friction)

INNOVACERA Boron Nitride Ceramics Grades

Learn more about our binder-bonded grades HB, with over 90% BN, our highest purity (>99.7% BN) grade UHB, and our composite grades BMS, BMA, BSC, BMZ, BAN and BSN.

Properties	Unit	UHB	HB	BC	BMS	BMA	BSC	BMZ	BAN	BSN
Main Composition	–	BN>99.7%	BN>99%	BN>97.5%	BN+SiO2	BN+Al2O3	BN+SiC	BN+ZrO2	BN+AlN	BN+Si3N4
Color	–	White	White	White	White Graphite	White Graphite	Greyish-Green	White Graphite	Greyish-Green	Gray Black
Density	g/cm3	1.6	2	2.0~2.1	2.2~2.3	2.25~2.35	2.4~2.5	2.8~2.9	2.8~2.9	2.2~2.3
Three-Point Bending Strength	MPa	18	35	35	65	65	80	90	90	/
Compressive Strength	MPa	45	85	70	145	145	175	220	220	400~500
Thermal Conductivity	W/(m·k)	35	40	32	35	35	45	30	85	20~22
Thermal Expansion Coefficient (20~1000°C)	10-6/K	1.5	1.8	1.6	2	2	2.8	3.5	2.8	/
Max Using Temperature In Atmosphere In Inactive Gas In High Vacuum (Long Time)	°C	900 2100 1800	900 2100 1800	900 2100 1900	900 1750 1750	900 1750 1750	900 1800 1800	900 1800 1800	900 1750 1750	900 1750 1700
Room Temperature Electric Resistivity	Ω·cm	>1014	>1014	>1013	>1013	>1013	>1012	>1012	>1013	/
Typical Application	–	Nitrides Sintering	High Temperature Furance	High Temperature Furance	Powder Metallurgy	Powder Metallurgy	Powder Metallurgy	Metal Casting	Powder Metallurgy	Metal Casting

Packaging of Boron Nitride Components

Given its fragile nature, boron nitride is typically vacuum-sealed in plastic bags, cushioned with thick foam, and packed in cartons to prevent damage during transportation. Special packaging arrangements can be provided upon request.

Contact INNOVACERA

INNOVACERA offers a wide range of boron nitride materials and solutions. If you are looking for a boron nitride insulator solution for your application, please contact us to learn more about our full product range and how we can support your needs.

Complete Ceramic Housing Solutions for Optical Communication and Electronic Packaging

Ceramic packaging stands out as the material of choice for optical communication, power devices, high-reliability military and aerospace systems, and automotive electronics, thanks to its exceptional thermal performance, excellent dielectric properties, and hermetic sealing capability. Unlike plastic packages, ceramic solutions excel in high-temperature and harsh environments, as well as applications demanding long service life and high reliability. Moreover, ceramic package housings can be tailored into a variety of structural forms to perfectly match the specific characteristics and operating conditions of different devices.

The following sections introduce several representative product series:

1. Ceramic Small Outline Package (CSOP)

The CSOP (Ceramic Small Outline Package) is a commonly used miniature surface-mount package. Its leads extend from both sides, with pitch options including 1.27 mm, 1.00 mm, and 0.80 mm. CSOP offers advantages such as low manufacturing cost, excellent performance, high reliability, compact size, light weight, and high packaging density.

Features:
Miniaturized design with gull-wing leads, minimizing stress
Excellent resistance to mechanical shock
Multiple lead pitches available: 1.27 mm, 1.00 mm, 0.80 mm

Applications:
Various integrated circuits, high-reliability component packaging

2. Ceramic Surface-Mount Power Package (SMD)

Designed for power devices and high-heat-flux components—such as power semiconductors, resistors, and power ICs—the ceramic SMD package provides extremely low thermal resistance pathways and excellent thermal contact surfaces, allowing heat to be rapidly conducted to the PCB or heatsink.

Features:
High current-carrying capability
Large chip bonding area serving as an efficient heat sink
Reliable performance with superior thermal management

Applications:
Microwave device housings
Crystal and oscillator device packages

3. Ceramic Dual In-line Package (CDIP)

The CDIP (Ceramic Dual In-line Package) is one of the most widely used through-hole packages. It consists of two pressed ceramic blocks enclosing a dual in-line lead frame, with leads extending from both sides of the package. Standard lead pitches are typically 2.54 mm, and the number of leads ranges from 6 to 64. CDIPs offer excellent thermoelectric performance and high reliability.

Features:
Dual in-line lead configuration
Wide range of lead counts

Applications:
Various integrated circuits with moderate pin-out and assembly density requirements
Optocouplers, MEMS devices, and other high-reliability components

4. Ceramic Leadless Quad Packages (CLCC / CQFN)

CLCC (Ceramic Leadless Chip Carrier) and CQFN (Ceramic Quad Flat No-leads) belong to the leadless or no-exposed-lead quad package family. They are ideal for high-frequency, low-parasitic inductance applications that require efficient thermal dissipation and high-reliability integrated circuit packaging.

Features:
Low parasitic parameters with compact size
Excellent thermal management and high reliability
Available in dual-side or four-side lead configurations
Multiple lead pitch options: 1.27 mm, 1.00 mm, 0.50 mm, etc.

Applications:
High-density surface-mount applications
Various VLSI, ASIC, and ECL circuits

5. Laser SMD Ceramic Packages

The core function of laser device ceramic packages is optical control. Their purpose is to safely encapsulate a light-emitting or light-receiving chip while efficiently and reliably transmitting optical signals to the outside, and effectively managing the heat generated. Proper thermal management in laser packages ensures a stable, optimal operating temperature, thereby maintaining wavelength stability and consistent output power.

Features:
High thermal conductivity with excellent chip protection
Stable performance and reliable driving capability
Compact 7 mm surface-mount design with built-in safety features
Enables long projection distances, narrow beam angles, and small optical dimensions

Applications:
Portable exploration and rescue lighting
Automotive and architectural lighting
Outdoor and entertainment lighting

6. Optical Communication Package Series (ROSA / TOSA, etc.)

ROSA (Receiver Optical Sub-Assembly) and TOSA (Transmitter Optical Sub-Assembly) are critical submodule packages in optical device modules (such as SFP/QSFP) that house key optoelectronic components—including laser diodes, photodiodes, and fiber coupling windows. Ceramic ROSA/TOSA packages are commonly used in applications requiring high frequency, high-speed operation, excellent thermal management, and hermetic window sealing.

Features:
High hermeticity with extremely low leakage, ensuring a stable internal optical environment
Excellent thermal management for extended service life
Supports a wide range of data rates from 10 GHz to 400 GHz
Customizable design to meet specific user requirements

Applications:
Fiber-optic communication systems
Various optoelectronic transmitter and receiver devices
Optical switches, modules, and high-power laser systems

Innovacera offers a one-stop ceramic packaging solution, ranging from standard components to fully customized designs. From material selection, ceramic processing, metallization, and sealing, to hermeticity and reliability testing, we work closely with customers to develop prototypes and scale up to mass production.

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