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Zirconia Ceramic Pin Rods For Cameras

Cameras rod components is very small and it was made by zirconia ceramic, the zirconia ceramic pin rods manufacturing process request strict quality control and advanced ceramic technology . Each rod is carefully produce to ensure precise dimensions and smooth surfaces. This attention to detail is essential for seamless integration into the camera’s design and for optimal performance.

Zirconia ceramics pin rods are often used in camera applications due to their excellent properties, they can serve various functions, including acting as guiding rods, support structures, or wear-resistant components in mechanisms like lens adjustments or focusing systems.

Zirconia Ceramic Pin Rods

Zirconia ceramic pin rods feature:

· Coefficient of thermal expansion similar to iron
· High strength&hardness
· High fracture toughness
· Wear resistance
· Excellent thermal insulation
· Very high resistance to crack propagation, high fracture toughness
· Low thermal conductivity
· Corrosion resistance in acids and alkalis
· Modulus of elasticity similar to steel

Zirconia ceramic pin rods material properties:

Properties	Unit	Value
Composition	%	94.5% ZrO2 5.5% Y2O3
Specific Density	g/cm3	≥6.03
Hardness (HV)	GPa	>12
Coefficient (20-400°C)	10-6 /k	9.6
Elastic Modulis	GPa	205
Fracture Toughness	MPa·m1/2	8-10
Crushing Load	KN	≥25 (S ⊄6.5mm)
Grain Size	μm	<0.5
Thermal Conductivity	w/(m·k)	3

The Application of zirconia ceramic pin rods:

Zirconia rods for camera exceptional hardness provides a stable and reliable support structure within the camera, the zirconia ceramic wear resistance protects camera lens to avoid the scratches and corrosion.

With its good mechanical properties and stability, it provides support and protection for the internal structure of the camera.

Zirconia rods as part of the camera motor ensure the reliability and performance of the camera, which makes the camera can be used in a variety of environments.According to the design, function and application scenarios of the camera, different materials can be selected as the material of its motor accessories, such as zirconia can be selected as the material of the camera motor support rod for specific applications.

zirconia ceramic pin also can be used for other fileds: medical equipment, fluid control, communication devices, precision instruments, textile machine and aerospace industry. For example, zirconia ceramic can be used to manufacture the stem (tube) of the electrosurgical prostatectomy, Optical fiber tube, zirconia nozzles and mobile phone plate.

Consult with Innovacera

If you need any zirconia ceramic components for Photoelectric technology industry or any technology questions, welcome to contact us at sales@innovacera.com or 86 592 558 9730, we will try our best to meet your requirement.

LaB6 Elements Hollow Cathode Emitter for Thermionic Emission

Lanthanum hexaboride (LaB6) is an inorganic compound with remarkable properties. It is a refractory ceramic material, characterized by a dark purple appearance, a high melting point of 2210°C, and excellent stability in both vacuum and harsh chemical environments—it is insoluble in water and hydrochloric acid. Known for its low work function, LaB6 exhibits one of the highest electron emissivities, making it a highly efficient electron source.

LaB6 cathodes are high-performance, resistively heated thermionic electron emitters. Over the years, LaB6 hollow cathodes have demonstrated exceptional durability and reliability in electric propulsion systems. Hollow cathodes, which utilize materials with low work functions to efficiently emit electrons, are complex devices. LaB6 hollow cathodes with polycrystalline inserts are particularly well-suited for such applications due to their favorable properties.

high purity Lanthanum Hexaboride LaB6 ceramics

Lanthanum Hexaboride Cathodes Advantages:

Extended lifespan
Exceptional stability
Low work function (high electron emissivity)
Strong resistance to thermal shock
Excellent electrical conductivity
Superior chemical and oxidation resistance

Lanthanum Hexaboride Applications:

Thermionic emission (cathodes)
Plasma sources for plasma-enhanced chemical vapor deposition (PECVD)
Vacuum electron beam welding systems
Electron beam surface modification devices
Electron beam lithography systems
Transmission electron microscopes (TEM)
Scanning electron microscopes (SEM)
Surface analysis systems
Radiotherapy devices
Properties of Lanthanum Hexaboride:

Lanthanum Hexaboride Properties:

Properties	Unit	Lanthanum Hexaboride
Purity	%	>99.5
Density	g/cm3	>4.30
Structure	/	Monocrystalline
Vickers hardness	HV	1065
Shore hardness	HS	HS
Thermal conductivity	W/mK	15
Electrical Conductivity	S/m	1.83*10^6
Flexural strength	MPa	165

Lanthanum Boride Produce Process

Hot pressing sintering is a common method used to produce Lanthanum Boride (LaB6), especially due to its high melting point and excellent thermionic emission properties, Hot Press Sintering process for producing Lanthanum Boride is as below:

LaB6

Raw Material Preparation-Powder Blending-Compaction-Hot Press Sintering Process
-Cooling and Finalization- Quality Control and Testing

Packaging of Lanthanum Boride

Given its fragile nature, LaB6 is typically vacuum-sealed in plastic bags, cushioned with thick foam, and packed in cartons to prevent damage during transportation. Special packaging arrangements can be made upon request.

Consult with Innovacera Engineers

Innovacera provide our customers with premium-quality Lanthanum Hexaboride ceramic components, supported by a team of experienced engineers who can assist with material selection and product design. For more information, please contact us at +86 592 558 9730 or email us at sales@innovacera.com.

Aluminum Nitride Substrate

Aluminum nitride (AlN) is a advanced technical ceramic material that features an extremely interesting combination of very high thermal conductivity(up to230 W/m.K) and excellent electrical insulation properties.

Aluminum nitride ceramics

This makes aluminum nitride (AlN) ceramic substrate widely use in power electronics and microelectronics. For example, it is used as a circuit carrier (substrate) in semiconductors or as a heat-sink in LED lighting technology or high-power electronics.

Aluminum Nitride Ceramic Substrate

Aluminum Nitride(AlN) Ceramic Substrate Advantages

·High thermal conductivity (170-230W/mK), up to 9.5 times than that of Aluminum Oxide ceramic substrate.

·Similar coefficient of thermal expansion to that of silicon (Si), GaN, and GaAs semiconductors. This helps to achieve high reliability of silicon (Si) chip and thermal heat-up cycling.

·High electrical insulation, and smaller dielectric constant.

·High mechanical strength (450MPa).

·Superior corrosion resistance against molten metal.

·Very high purity, no toxicity.

Material Properties of AlN Ceramics:

Properties	Unit	AN170	AN200	AN230	AN99	AN999
Color	–	Gray	Gray	Beige	Gray	Beige
Content of AlN	–	≥95%	≥95%	≥96%	≥99%	≥99.9%
Bulk Density	g/cm3	≥3.30	≥3.30	≥3.28	≥3.26	≥3.25
Flexural Strength	MPa	≥400	≥300	≥300	≥300	≥300
Compressive Strength	MPa	2500	2000	2000	2000	2000
Hv 500g	Gpa	10.5	9.5	9	9	9
Young’s Modulus	Gpa	300	300	300	280	280
Thermal Conductivity (@20°C)	W/m·K	≥170	≥200	≥220	~100	~90
Specific Heat	KJ/(Kg·K)	0.74	0.74	0.73	0.73	0.73
C.T.E (r.t.-400°C)	10-6/K	4.6	4.6	4.6	4.6	4.6
Volume Resistivity	Ω·cm 20°C	≥1014	≥1014	≥1013	≥1010	≥1010
Dielectric Strength	KV/mm	≥16	≥16	≥15	≥15	≥15
Dielectric Constant (@1MHz)	–	8.6	8.6	8.6	8.6	8.6
Loss Tangent (@1MHz)	×10-4	5	5	5	5	5

·Aluminum Nitride(AlN) Ceramic Substrates Applications

·Microelectronics: Ideal for use in integrated circuits and electronic devices.

·LED Packaging: Ensures effective heat management in LED applications.

·Power Electronics: Used in power modules and high-frequency circuits.

·Semiconductor Manufacturing: Provides a stable platform for semiconductor devices.

·Microwave and RF Components: Suitable for applications requiring high-frequency performance.

·Aluminum Nitride (AlN) Ceramic Substrates available for various metallization process, like Thin film, Thick film, Direct Bonded Copper, Active Metal Brazing and Direct Plated Copper.

Aluminum Nitride Thin Film Metallization Product Pictures

In-House Advanced Machining Processes

Aluminum Nitride Wafer Substrates

Innovacera provides all the advanced services you need to shorten lead times and improve component quality.
Surface Finishes:
AF = As Fired
LBS = Lapped Both Sides (25u” Ra)
PBS = Polished Both Sides (2u” Ra)
P1S = Polished 1 Side (2u” Ra) / 2nd Side Lapped
Improved tolerances, surface finishes and alternate sizes are also available.

Standard & custom substrate available

Ceramic substrate

Standard squares: 25.4mm, 50.8mm, 101.6mm and 114.3mm (1ʺ, 2ʺ, 4ʺ, 4.5ʺ)
Standard rounds: Φ101.6mm,Φ152.4mm, Φ203.2mm,Φ304.8mm and Φ356mm (4ʺ, 6ʺ,8ʺ,12ʺ,14ʺ)
Thickness available: 0.2~25.4mm (0.008ʺ to 0.140ʺ)
Custom shapes and sizes available for quoting!

Consult with Innovacera Engineers
Innovacera has a highly qualified staff to assist with material selection and product design. Please contact us today at +86 592 558 9730 or sales@innovacera.com for more information.

Hot Pressing (HP) Sintering Process for Ceramic Materials Applications

Hot pressing(HP) sintering process is the most commonly used technique for fabricating dense, non-oxide monolithic ceramics and their composites.

During hot pressing sintering, temperature and pressure are simultaneously applied to the powder compact contained in a die. Under the application of pressure, the contact points between particles develop a very high stress, increasing the local diffusion rates.

Hot pressing(HP) sintering workshop

As for all forms of densification, the particle size, temperature, pressure, heating rate and holding time all influence the density and micro-structure of the hot pressed compacts whilst a controlled atmosphere is required for the Non-oxides. Carbides, borides and silicides are often hot pressed under vacuum or an inert gas such as argon whilst the nitrides are generally densified under a nitrogen atmosphere.

What are the benefits of hot pressing sintering?
Hot pressing sintering is a manufacturing process that uses heat and pressure to create strong, durable parts. The process has several benefits, including:

· High strength and durability
Hot pressed parts are typically much stronger and more durable than parts sintered using traditional methods. This is because the high temperature and pressure of the hot pressing process cause the particles in the powder to sinter more completely, resulting in a denser material with fewer defects.

· Precise dimensional control
Hot pressing sintering can create parts with exact dimensional tolerances. This is because the pressure of the hot pressing process helps to force the particles in the powder to close together, resulting in a more uniform and consistent shape.

· Reduced manufacturing costs
Hot pressing sintering can be a more cost-effective manufacturing process than traditional methods, such as machining or casting. This is because hot pressing sintering can create parts with complex shapes and features that would be difficult or expensive to machine or cast.

· Improved surface finish
Hot pressing sintering can produce parts with a much improved surface finish than traditional sintering methods. This is because the high temperature and pressure of the hot pressing process help to close up any pores or voids in the material, resulting in a smoother and more uniform surface.

· Reduced sintering time
Hot pressing sintering can reduce the sintering time required for some materials. This is because the hot pressing process’s high temperature and pressure help accelerate the sintering process, resulting in shorter manufacturing cycles.

· Improved mechanical properties
Hot pressing sintering can improve the mechanical properties of some materials. This is because the hot pressing process’s high temperature and pressure help strengthen the material, resulting in parts with improved tensile strength, compressive strength, and fatigue resistance.

Lanthanum Hexaboride (LaB6) Ceramics

Which type ceramic material is available for Hot pressing(HP) sintering process?

· Borides Ceramics: CeB6, Cr2B, LaB6, TaB2,TiB2, ZrB2;

· Carbides Ceramics: B4C, HfC, SiC, TiC, TiCN, VC, WC, ZrC;

· Nitrides Ceramics: AlN, BN, HfN, Si3N4, TiN, ZrN;

· Oxide Ceramics: Al2O3, CeO2, HfO2, MgO, SiO, TiO2, Y2O3, ZrO2, ZnO;

350mm hot press sintering Aluminum Nitride

What’s the application of advanced ceramics materials made by hot pressing sintering process?

The high purity ceramic materials(Oxide, Nitride, Boride, and Carbide Ceramics) produce by hot pressing sintering is widely used in thin film technology(as a sputtering target) and semiconductor process.

Our hot pressing sintering process also serves to produce composite parts with more complex shape. Please contact us if your required high purity advanced ceramic material(2N~5N) and hot pressing sintering service(maximum size is Φ580*H500mm).

thin film deposition process

TO 247 Alumina Ceramic Thermal Pads For Power Switches

Alumina Ceramic Thermal Pads are designed to provide a preferential heat-transfer path between heat-generating components, power switches, heat sinks, and other cooling devices. Alumina ceramic (Al₂O₃) thermal pads are renowned for their exceptional thermal conductivity and electrical insulation properties. Alumina ceramics exhibits thermal conductivity ranging from 20 to 30 W/m·K, allowing for efficient heat dissipation in high-power applications. This critical feature prevents overheating, enhancing the reliability and longevity of electronic components. Additionally, alumina’s high melting point and chemical stability make it suitable for harsh environments, ensuring these thermal pads maintain performance even under extreme conditions.

TO 247 alumina ceramic thermal pads typically used in the power switches, Integrated Circuit Chip, Packaging Heat Conduction, IGBT Transistor Heat Sink MOS Transistor, MOSFET Transistor Heat Sink Interface, LED Board TIM ( Thermal Interface Material ), COF Heat (Chip ON Film), and various electronic devices where effective heat management is crucial. Their excellent electrical insulation properties make them particularly well-suited for applications requiring high insulation resistance and low thermal resistance, such as power supply modules, inverters, and electric vehicle (EV) drive systems. As the demand for efficient thermal management solutions grows, TO 247 alumina ceramic thermal pads are increasingly integrated into designs for high-performance power electronics.

TO 247 Alumina Ceramic Thermal Pads For Power Switches

The market for TO 247 alumina ceramic thermal pads is growing with the power electronics market expands. The need for advanced thermal management solutions becomes more pronounced. With the increasing complexity and power requirements of electronic devices pushing the demand for materials that offer both high thermal conductivity and insulation. Alumina ceramic thermal pads are poised to become essential components in next-generation power electronics, ensuring efficient operation and reliability.

Alumina ceramic thermal pads regular model size:
TO-3P/TO-220/TO-247/TO-264/TO-3/TO-254/TO-257/TO-258,
With Hole or Without Hole.

25x20x1mm (other thickness is available, too);
20x14x1mm (other thickness is available, too);
22x17x0.635mm (other thickness is available, too);
28x22x1mm (other thickness is available, too);
39.7×26.67x1mm (Rhombus shape);
34x24x1mm (other thickness is available, too);
40x28x1mm (other thickness is available, too);
50.8×50.8x1mm (other thickness is available, too).

Alumina ceramic thermal pads

Other Standard Size:
114.3×114.3mm;
152x152mm;
190.5x138mm …

Customized sizes are available.
TO 247 alumina ceramic thermal pads represent a critical advancement in thermal management technologies. As industries continue to innovate, these thermal pads will play a key role in meeting the demands of future technologies.

Advantages of ceramics used in ion implanters

As an advanced semiconductor manufacturing equipment, ion implanters have very high requirements for the performance of materials.

As an important component, ceramic accessories play a vital role in ion implanters.

A.Basic characteristics of ion implanter accessories and ceramic accessories

Semiconductor series ceramic parts

Ion implanter accessories are mainly made of high-purity silicon nitride, silicon carbide (SiC), alumina, alumina/silicon carbide microporous ceramics, aluminum nitride (AIN), sapphire and other ceramic materials, with the following characteristics:

1. High hardness and high strength: Ceramic fittings have high hardness and strength, which can withstand high load and wear during ion implantation.

2. High thermal stability: Ceramic fittings have a high melting point and can maintain stable performance in high temperature environments.

Aluminum nitride series ceramic parts

3. Good chemical stability: Ceramic accessories have good chemical stability and can work stably for a long time in harsh environments.

4. Excellent electrical insulation: Ceramic fittings have excellent electrical insulation, can withstand high voltage, and are suitable for electrical parts in ion implanters.

B. Advantages of ion implanter accessories and ceramic accessories

Sapphire series parts

1. Improve ion implanter performance
The excellent performance of the ceramic accessories of the ion implanter makes the ion implanter work stably in harsh environments, improving the performance and reliability of the equipment.

2. Reduce ion implanter costs
The processing performance of ceramic accessories is good, and it can be processed by traditional metal processing methods, such as turning, milling, grinding, etc. This makes the application of ceramic accessories in ion implanters more extensive, reducing the production cost of ion implanters.

3. Promote innovation in semiconductor manufacturing materials
The successful application of ion implanter accessories and ceramic accessories provides new ideas for the research and development of semiconductor manufacturing materials, and promotes the development of semiconductor manufacturing materials in the direction of high performance and low cost

Alumina series parts

C.Application cases of ion implanter accessories and ceramic accessories

1. Ion implanter component case
Application examples of ion implanter accessories include the manufacture of key components of ion implanters, such as bearings, vacuum suction cups, electrostatic chucks, nozzles, filaments, cathode modules, etc. Due to their high hardness, high strength and high heat resistance, ceramic accessories are able to improve the performance and reliability of ion implanters.

2. Semiconductor manufacturing equipment case
Ion implanter partsExamples of semiconductor manufacturing equipment for ceramic accessories include the key components for manufacturing semiconductor manufacturing equipment, such as packaging substrates, insulating materials, etc. Due to their excellent electrical insulation and chemical stability, ceramic accessories can ensure long-term stable operation of semiconductor manufacturing equipment in harsh environments.

For more information, please contact at sales@innovacera.com.

The Difference Between Electric Heating Wire And Ceramic Heater

Alumina ceramic heater is a kind of high efficiency heat division uniform heater, excellent thermal conductivity of metal alloy, to ensure that the hot surface temperature uniform, eliminate the hot and cold points of the equipment. Alumina ceramic heater is divided into two kinds, respectively PTC ceramic heating body and MCH ceramic heating body. The materials used in these two products are completely different, but the finished products are similar to ceramics, so they are collectively referred to as “ceramic heating elements”.

Electric Heating Wire

Due to the increasingly high operating temperature requirements in modern industry, ceramic heaters can adapt to, especially chemical fiber, engineering plastics, plastic machinery, electronics, medicine, food and various pipeline heating; Ceramic heating element in which a meta tungsten or molybdenum manganese paste is printed on a ceramic casting body and laminated by hot pressing and then co-fired at 1600°C, in a hydrogen atmosphere to co-sinter ceramic and metal. Form effective high temperature, high power density, strip heater, and flexible design for easy installation.

Electric heating wire is the most common heating element, its role is to heat up after the power is turned into heat energy. The application range of electric heating wire is very wide, and a variety of common electric heating equipment will use electric heating wire as a heating element, so the electric heating wire is used in medical, chemical, electronics, electrical appliances, metallurgical machinery, ceramic glass processing and other industries.

Electric Heating Wire

Take the fan heater as example, the heating body with electric heating wire is more seen on the market, Its heating body is an electric heating wire, and the heat generated by the electric heating wire is blown out by a fan.

The main differences of them are as below:

1. Different materials
Ceramic heating uses PTC heating body, and electric heating wire heating is the heat generated by the heating wire inside the heating core to conduct heat to the metal tube.

2.Different insulation performance
Ceramic heating is not conductive, surface safety is not charged, good insulation performance; The electric heating wire heating is easy to leak because the metal is conductive.

MCH ceramic heater

3.Different properties
The biggest advantage of electric heating wire heating is that the hardness is greater than that of ceramic heating core, and it is not easy to break. The disadvantage is that the metal heating core will be oxidized at high temperature, and the efficiency of heat conduction after oxidation is much worse than that before oxidation.

The biggest feature of the ceramic heating core is that the thermal conductivity is good, and there will be no oxidation at high temperature, no matter how long it takes, the efficiency of its thermal conductivity will not have any reduction, and the disadvantage is that the robustness is relatively less than the metal heating core.

Below chart is for better understanding:

Electric Heating Wire	Ceramic Heater
Fast heating speed	Long life
Accurate temperature control	High safety
Low cost	Uniform temperature
Short life	Lower heating speed
Security risks	Poor temperature control
	Manufacturing cost is high

According to the different demand, choose different heater material, if you need fast and accurate temperature control, use electric heating wire , if you pay more attention to safety and life ,use ceramic heater.

For more information, pls contact with us.

Introduction to ceramic sealing process

Sealing refers to the physical or chemical connection of two or more materials. Joining technology is one of the key technologies in glass and ceramic manufacturing, which can improve the product’s sealing, thermal resistance, and stability, thereby improving its reliability and service life.

The connection methods between ceramics and metals include mechanical connection, adhesive connection, brazing connection, solid-phase diffusion connection, instant liquid phase connection, melting welding, self-propagating high-temperature synthesis connection, friction welding, microwave connection, and ultrasonic connection, etc.

According to the connection method, it can be divided into mechanical sealing and welding sealing. Mechanical sealing mainly realizes through fasteners, sealing rings, etc., while welding sealing realizes through melting connection.

Ceramic to metal

According to the material type, it can be divided into glass sealing and ceramic-to-metal sealing. Glass sealing is mainly used for connecting glass and glass, glass and metal, etc., while ceramic sealing is mainly used for connecting ceramic and ceramic, ceramic and metal, etc.

According to the use environment, it can be divided into vacuum sealing, high-temperature sealing, and low-temperature sealing. Vacuum sealing is mainly used for manufacturing vacuum containers and sensors, high-temperature sealing is mainly used for manufacturing high-temperature furnaces and heaters, and low-temperature sealing is mainly used for manufacturing low-temperature containers and refrigeration equipment.

In this article, we will focus on the brazing process
Brazing involves placing a metal (called the brazing filler or flux) with a lower melting point than the parent material (the material being brazed) between the parent materials; heating the assembly to a temperature below the melting point of the parent materials but above the melting point of the brazing filler, allowing the brazing filler to melt; allowing the molten brazing filler to wet, spread, and fill the voids between the parent materials; and allowing the parent materials to dissolve and diffuse into each other through the molten brazing filler. Upon cooling, a connection is formed between the parent materials with the brazing filler serving as an intermediate layer.

metal brazing

Advantages:
1)In the process of brazing, the weldment does not melt, and the size, structure and physicochemical properties of the weldment are stable
2)The welded joint has good air tightness and strength;
3) If the welded joint is bad, it can be re-welded;
4) Multiple welds can be welded at once.

Brazing also includes the following types
Metallized Ceramics
First, the ceramic surface is metallized, and then the conventional filler metal is brazed together, so it is also called two-step brazing. The purpose of ceramic surface and metallization is to solve the problem of poor wettability of the filler metal on the ceramic surface. The Mo-Mn method is commonly used in the electronics industry to premetallize the ceramic surface. The appropriate amount of Mn is added to the Mo powder to improve the combination of the metal coating and the ceramic. In addition, a series of metallization methods such as physical or chemical vapor deposition, thermal spraying, sintered metal powder method, ultrasonic method, chemical deposition, plasma injection and vacuum evaporation have been developed.

Ceramic metallization brazing

Active metal brazing
The wettability of the filler metal on the ceramic surface is improved by forming an active metal film on the ceramic surface, adding active elements to the filler metal and forming a reaction layer on the ceramic surface through chemical reaction. These active elements usually include Ti, Zr, Hf, V, Ta, Nb, Cr and so on.

INNOVACERA is a professional enterprise integrating research and development, production and sales, providing various ceramic parts, ceramic to metal products. Currently involved in the application of vacuum equipment, lithography machine, vacuum coating machine, spectrometer, mass spectrometer, ion source, particle accelerator, electronic appliances, instrumentation, aerospace, new energy vehicles, intelligent robots, energy storage systems, chemical vacuum and so on.

Please feel free to contact us for any request. Provide one-stop service for drawing and sample.

Advantages and applications of crucible with different materials

This article mainly describes the advantages and applications of different materials crucible.

1. Tungsten boat:
· High temperature resistance: Tungsten boat has excellent high temperature resistance and can withstand the vacuum evaporation process at high temperature.

· Thermal conductivity: Tungsten has good thermal conductivity and can provide uniform heating, which helps to obtain uniform film deposition.

Stability: tungsten is relatively stable at high temperature, not easy to oxidize, suitable for evaporation under high temperature conditions.

Tungsten Boat

2. Boron nitride crucible:
· Adhesion resistance: boron nitride crucible has good adhesion resistance, which can reduce material residue and pollution.

· Electrical conductivity: boron nitride(BN) crucibles usually have low electrical conductivity, which is helpful for certain processes where electronic conduction needs to be controlled.

· Chemical inertia: boron nitride crucible is relatively inert in many chemical environments and is not susceptible to corrosion.

Boron Nitride Crucible

3. Alumina crucible:
· High temperature/corrosion resistance/high strength: used as sliding gate for steelmaking, crucible for smelting high purity metal or growth of single crystal, as well as various high temperature kiln structural parts (furnace cavity, furnace tube), physical and chemical utensils, aerospace spark plug, heat resistant oxidation resistance coating, glass wire drawing crucible.

Alumina Crucible

4. Quartz crucible
Quartz crucible can be burned below 1700 degrees, but the burning temperature above 1100 degrees quartz will become opaque, so the melting temperature should not exceed 800 degrees.

· Can not contact with HF, at high temperature, easy to interact with caustic alkali and alkali metal carbonate.

Quartz crucible is suitable for melting samples with K2S2O7, KHSO4 as the flux and Na2S207(first dried at 212 degrees) as the flux.

· Quartz is brittle and easy to break, so pay attention when using.

· Except HF, ordinary dilute inorganic acid can be used as cleaning solution.

Quartz Crucible

5. Corundum crucible
· Corundum crucible is composed of porous fused alumina, which is firm and resistant to melting.

· Corundum crucible is suitable for using anhydrous Na2C03 and other weakly alkaline substances as the melt sample, not suitable for using Na202, NaOH and other strongly alkaline and acidic substances as the melt sample (such as K2S207, etc.)

Corundum Crucible

Boron nitride nozzles- a solution to solve technical problems from atomization to 3D printing and molten metals

Powder metallurgy has core process advantages such as high material utilization, low unit energy consumption, and environmental protection. It is a technology that is in line with the future direction of carbon neutrality.

In recent years, with the maturity of powder metallurgy technology and the trend of miniaturization of parts, two emerging process routes, metal injection molding (MIM) and 3D printing (AM), have rapidly emerged.

At the same time, the supply of high-quality powder raw materials has begun to become a major factor restricting the development of the industry.

Small and complex parts are undoubtedly more suitable for injection molding and 3D printing (particle size of 20μm or even smaller), and have been increasingly used in high-end fields such as aerospace, medical, electronics, and military industry.

Therefore, the preparation of metal powders with high purity, good sphericity, small particle size and narrow distribution, and low oxygen content has become a new focus in the industry. These parameters have a crucial impact on the quality of metal products.

Boron nitride atomization nozzles

1.Atomization powder making and nozzle

The water atomization, gas atomization, oil atomization, gas-water linkage atomization, and plasma atomization were developed and replaced the carbonyl method to become the mainstream.

The key component of atomization powder making is the nozzles, largely determines the atomization rate (fine powder yield), and then also determines the production efficiency and powder quality.

The industry continues to explore improvements to nozzles, such as changing the gas, melt, and liquid flow field through design, improving the gas-liquid ratio, and controlling the oxygen content.

The nozzles faces harsh working conditions such as erosion, wear, high temperature, and severe thermal shock. Its material determines the process stability and component life.

High-purity boron nitride ceramics have excellent high-temperature resistance, while composite boron nitride ceramics slightly sacrifice high-temperature resistance in exchange for improved capabilities in different directions such as corrosion resistance, wear resistance, and thermal shock resistance.

Composite boron nitride ceramic nozzles can minimize clogging and metal creep, thereby reducing the frequency of nozzle replacement. Due to the low friction coefficient of boron nitride (BN), the smooth surface finish and tighter tolerances provide predictable particle size distribution between batches. In addition, the extremely strong thermal shock resistance allows boron nitride nozzles to be used without a lot of preheating.

2.3D printing and nozzles

The biggest difference between 3D printing and injection molding is that 3D printing does not require molds, which is more conducive to personalized and diversified production. Since there is no constraint and auxiliary role of the mold, its production process naturally depends more on the performance of the printing equipment and powder raw materials.

The nozzle is a key component that determines the quality of the finished product. Only by selecting the nozzle according to the needs can you get a satisfactory result – the easiest way to understand is that if you pursue speed, you have to give up precision and choose a large nozzle, and if you pursue precision, you have to give up speed and choose a small nozzle.

As metal 3D printing technology develops, the benefits that boron nitride brings to metal atomization are becoming more and more relevant to these new 3D printing technologies.

For example, some 3D printing manufacturers are currently looking for ways to deal with molten metal at high temperatures – high temperatures will cause huge thermal stresses on mechanical parts, thus bringing new challenges in printer design; in addition, there are requirements such as non-adhesion and non-wetting of molten metal liquid…

Boron nitride ceramics’ high thermal shock resistance and low thermal expansion coefficient enable it to withstand high thermal gradients, and its high thermal conductivity helps the rapid solidification of metal after deposition.
Different Types of Boron Nitride Ceramic Properties Datasheet For Atomization

Properties	Units	UHB	HB	BMA	BSC	BMZ
Main Composition		BN>99.7%	BN>99%	BN+ZR+AL	BN+SIC	BN+ZRO2
Color		White	White	White Graphite	Greyish Green	White Graphite
Density	g/cm3	1.6	2	2.25-2.35	2.4-2.5	2.8-2.9
Three-Point Bending Strength	MPa	18	35	65	80.00	90
Compressive Strength	MPa	45	85	145	175.00	220
Thermal Conductivity	W/m·k	35	40	35	45.00	30
Thermal Expansion Coefficient (20-1000℃)	10-6/K	1.5	1.8	2	2.80	3.5
Max Using Temperature In Atmosphere In Inactive Gas In High Vacuum (Long Time)	(℃)	900 2100 1800	900 2100 1800	900 1750 1750	900 1800 1800	900 1800 1800
Room Temperature Electric Resistivity	Ω·cm	>1014	>1014	>1013	>1012	>1012
Typical Application	Nitrides Sintering	High Temperature Furance	High Temperature Furance	Powder Metallurgy	Metal Casting	Powder Metallurgy
High Temperature Electrical Furnace Components	✓	✓	✓	✓	✓
Metal Vaporize Crucible	✓	✓	✓
The Container of Metal or Glass Melting	✓	✓	✓	✓	✓	✓
The Casting Mould Components of The Precious Metal and Special Alloy.	✓	✓	✓
High Temperature Support Part	✓	✓	✓
Nozzle and Transport Tube of The Melting Metal	✓	✓	✓	✓	✓
Nitrides Sintering (Sagger and Setter Plate)	✓

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