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Search Results for: aluminum+nitride+substrate

Why Aluminum Nitride (AlN) ceramic is a preferred choice for substrate and thermal management applications?

Aluminum Nitride Ceramic (AlN) is a special ceramic material that combines high thermal conductivity with high electrical resistivity. Only a few ceramics possess high thermal conductivity: Such as Beryllium Oxide (BeO) and cubic Boron Nitride (c-BN) are virtually the only other examples. However, the use of BeO is restricted due to its powder toxicity, and c-BN is very difficult to produce. Also, the material is suitable for further processing with thick and thin-film technology aluminum nitride is an ideal material for applications in telecommunications technology. Aluminum nitride ceramic is therefore used as a substrate for semiconductors, as well as for high-power electronic parts, housings, and heat sinks.

Advantages of DPC Aluminum Nitride Ceramic Substrate in VCSEL Packaging

What is a VCSEL? VCSEL stands for Vertical Cavity Surface Emitting Laser, in this case, the laser resonator is aligned to the orthogonal direction with respect to the plane of the semiconductor substrate to allow vertical emission of light. It was invented in 1977 by Dr. Iga, the former president of the Tokyo Institute of Technology, and is now used in various fields, including data communication and sensor applications. It is also prominent in facial recognition technology in cellular devices. Compared to edge-emitting lasers, VCSELs can take advantage of batch semiconductor manufacturing processes for large volume, low-cost production. The range of wavelengths available from VCSELs is wide, and thus they have found uses in various applications. VCSEL is widely used in consumer electronics products, automotive products, and other commercial applications such as industrial heating, environmental monitoring, medical equipment, and consumer applications such as 3D perception. VCSEL chip power conversion efficiency is low, which means that there are certainly problems in heat dissipation, facing the problem of thermoelectric separation, and the ceramic substrate is born to solve the thermoelectric separation. VCSEL generates large heat when running. One is that the heat needs to be emitted through the substrate in time; Secondly,...

Application of aluminum nitride substrate

Aluminum nitride products are attracting more and more attention as a new generation of high thermal conductivity materials due to their superior thermal conductivity, high insulation, and thermal expansion rate close to silicon. Features: High thermal conductivity: about 7 times the thermal conductivity of alumina Thermal expansion rate: thermal expansion is close to silicon, and the reliability of the mounting of large silicon wafers and heat-resistant cycles Electrical characteristics: high insulation, low dielectric coefficient Mechanical properties: superior to the mechanical properties of alumina Corrosion resistance: stronger than molten metal corrosion resistance Purity: low impurity content, non-toxic, high purity Application: High-power transistor module substrate High-frequency device substrate Heat-radiating insulation board for turn module Fixed substrate for semiconductor laser and light-emitting diode Hybrid integrated module, the ignition device module IC package Thermal module substrate Some products for semiconductor production equipment

Aluminum Nitride (AlN) Substrates

The AIN crystal is a covalent bond compound with [AIN4] tetrahedron as the structural unit, and has a wurtzite structure, and belongs to the hexagonal crystal system. ALN with outstanding insulating properties and extremely high thermal conductivity. In addition, aluminum nitride has the characteristics that it is not attacked by aluminum liquid and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid. Aluminum Nitride Substrate Advantages Very high thermal conductivity Non-toxic alternative to BeO Low thermal expansion similar to Si, GaN, and GaAs semiconductors High dielectric strength

CoorsTek Inc Introduces High-Performance Aluminum Nitride(AlN) Ceramic Substrates

The largest supplier of ceramic substrates for decades, CoorsTek Inc expands product line to include high-heat-dissipation aluminum nitride(AlN) ceramics substrates. February 12, 2013 – Golden, Colorado – CoorsTek Inc, the world’s largest technical ceramics manufacturer, today announced introduction of aluminum nitride substrates. Ideal for the rapidly growing LED market and other markets where high heat dissipation is useful, these ceramic substrates boast a thermal conductivity of 170 W/m.K. CoorsTek AlN (aluminum nitride) ceramic substrates feature a very high dielectric strength, are a non-toxic alternative to BeO (beryllium oxide), and exhibit a thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors. “While we already offer an extensive line of ceramic substrates, our new high-performance aluminum nitride substrates cover high heat dissipation applications,” says Andrew Golike, Electronics General Manager for CoorsTek,Inc. “We’ve ramped our production and finishing services to ensure an on-timedelivery for our customers,” he continues. Information: http://www.coorstek.com/resource-library/library/8510-1843-Aluminum_Nitride_Substrates.pdf

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) Substrates

Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) substrates are key technologies in power electronics. They involve bonding a pure copper layer to a ceramic base, typically Alumina or Aluminum Nitride, providing excellent thermal dissipation and electrical insulation. These substrates are crucial for IGBT modules, power LEDs, and automotive electronics. Innovacera offers high-quality DBC and DPC substrates, enabling superior performance and reliability in high-power applications.

Semiconductor Ceramic Substrates

Innovacera provides advanced semiconductor ceramic substrates critical for high-power and high-frequency electronics, including Direct Bonded Copper (DBC) substrates offering robust copper-ceramic bonding for superior thermal management and power cycling, Direct Plated Copper (DPC) substrates enabling ultra-fine circuit patterns and high-precision interconnections through laser drilling and copper plating, and Aluminum Nitride (AlN) wafer substrates renowned for their exceptional thermal conductivity and low expansion coefficient, ideal for demanding semiconductor applications requiring efficient heat dissipation.

Hot-Pressed Aluminum Nitride Heater Cover Introduction

Hot-pressed aluminum nitride ceramics are sintered using vacuum hot pressing, a process more challenging than normal pressure sintering. The purity of aluminum nitride can reach 98.5% (without any sintering additives), and the density after hot pressing reaches 3.3 g/cm3. Additionally, it exhibits excellent thermal conductivity and high electrical insulation, ranging from 90 W/(m·K) to 210 W/(m·K).   The material is hard and brittle, making it difficult to process. Consequently, it is prone to nicks or scratches during handling or processing, leading to a high scrap rate.     The thinnest thickness is only 0.75 mm, and the processing difficulty is also relatively high.   Applications of hot-pressed aluminum nitride heater covers: - Semiconductor Cover Heater - Cover and MRI equipment (magnetic resonance imaging) - High-power detectors - Plasma generators - Military radios - Electrostatic chucks and heating plates are used for semiconductors and integrated circuits. - Infrared and microwave window materials     Material Properties 1. Uniform microstructure 2. High thermal conductivity (70-180 W/(m·K)), customized through processing conditions and additives 3. High resistivity 4. Thermal expansion coefficient is close to that of silicon 5. Corrosion and erosion resistance 6. Excellent thermal shock resistance 7. The material exhibits chemical stability up...

Introduction of AMB Substrate Technology

AMB (Active Metal Brazing) is a method of sealing ceramics and metals developed on the basis of DBC technology.   Compared with traditional DBC substrates, ceramic substrates prepared by AMB process not only have higher thermal conductivity and better copper layer bonding, but also have advantages such as lower thermal resistance and higher reliability. In addition, because its processing process can be completed in one heating, it is easy to operate, has a short time cycle, good sealing performance and a wide range of applications for ceramics, so this process has developed rapidly at home and abroad and has become a commonly used method in electronic devices. AMB process description AMB is to add active elements to the brazing material, form a reaction layer on the ceramic surface through chemical reaction, improve the wettability of the brazing material on the ceramic surface, so that the ceramic and the metal can be directly brazed and sealed. Usually, the active element content is between 2% and 8% with good activity. When the content of active elements is too high, the brittleness of the brazing material will increase, thereby reducing the strength of the sealing surface. When the content of active elements is...
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