Aluminum Nitride Ceramics

Inovacera’s Aluminum Nitride (AlN) ceramics combine outstanding thermal conductivity with excellent electrical insulation and a thermal expansion closely matched to silicon, making them ideal for high‑performance heat dissipation and semiconductor processing applications. With a bulk density of 3.335 g/cm³, flexural strength of 382 MPa, dielectric constant of 8.56, thermal conductivity ≥170 W/m·K, and stability up to 1500 °C, these dark‑gray, 96 % AlN components resist corrosion, thermal shock, and molten salts while offering low thermal expansion (2.8×10⁻⁶ /°C) and superior mechanical properties beyond Al₂O₃ and BeO. Available in custom shapes and through processes like injection molding, dry press, tape casting, and precision machining, Inovacera’s AlN products—including heat sinks, crucibles, DBC substrates, wafers, rods, and heaters—serve semiconductor equipment, IC packaging, high‑power and high‑frequency modules, LEDs, UV/DUV light‑emitting devices, and laser diode substrates, and provide an optimal GaN epitaxial platform to reduce defect density and enhance device performance.