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Why Is Ceramic Metallization Layer Important In Electronic Device Packaging

In the midst of the information age, as industries such as communication and microelectronics experience rapid growth, high-frequency and high-power electronic devices have become the cornerstone of the market. Ceramic materials have emerged as a favored choice for electronic device packaging due to their exceptional thermal, electrical, and mechanical stability.

However, evolving market demands necessitate advancements in ceramic packaging technology. Central to this advancement is the critical aspect of connecting ceramics with metals. A solution is to deposit or sinter a thin metal layer on the surface of ceramics, a process commonly known as ceramic metallization. The performance of this ceramic metallization layer holds the key to determining the overall efficacy of the packaged electronic device.
Ceramic metallization layers play a crucial role in electronic device packaging for several reasons:

Electrical Conductivity: Ceramic materials are typically insulators, meaning they do not conduct electricity. Metallization layers are applied to ceramics to make them electrically conductive. This conductivity is vital for creating electrical connections between different components of electronic devices.
Interconnection: Electronic devices consist of various components that need to be interconnected. Metallization layers allow for the creation of conductive paths, enabling communication between different parts of the device. These paths can be highly intricate, connecting tiny components on a microscale.
Adhesion: Metallization layers can enhance the adhesion properties of ceramic substrates. Proper adhesion is necessary to ensure that the metal layer remains firmly attached to the ceramic surface, especially during the manufacturing process and the lifetime of the electronic device.

In summary, ceramic metallization layers are essential in electronic device packaging because they enable electrical conductivity, interconnection, adhesion. all of which are critical for the reliable and efficient functioning of electronic devices.
Are you seeking cutting-edge solutions for your electronic device packaging needs? Look no further! At Innovacera, we specialize in state-of-the-art ceramic metallization services. With our expertise, we ensure impeccable metallization layers that meet the highest industry standards. Our commitment to excellence guarantees the optimal performance of your electronic devices. Partner with us and experience the transformative power of superior ceramic metallization. Contact us today to explore a world where innovation meets reliability!

Boron Nitride Application-Crucible

Boron nitride is an excellent self-lubricating ceramic that can withstand high temperatures and maintain its lubrication capabilities in high vacuum environments.
Usually composed of hexagonal boron nitride (P-BN), it has good heat resistance, thermal stability, thermal conductivity, high temperature dielectric strength, and is an ideal heat dissipation material and high temperature insulation material.
Due to its high thermal and chemical stability, boron nitride crucibles are used in high temperature applications.

They are also used in metal casting because it bonds well to metals, as a sandwich of metal borides or nitrides is formed.
The benefits of using a boron nitride crucible are its low wettability to molten metal, relatively high resistance to thermal shock, and conductivity with low thermal expansion. Another advantage of boron nitride crucibles is their very high operating temperatures and appropriate inert gas protection (temperatures above 3000°C have been recorded).
Boron nitride crucible is used for melting aluminum, zinc and other alloy smelting, replacing graphite crucible.
The boron nitride crucible has strong resistance to thermal shock and will not crack when quenched to 1500 degrees. It will not crack if it is kept in the furnace at 1000 degrees for 20 minutes and taken out to be blown and quenched continuously for hundreds of times.
Note: Boron nitride crucible is easy to absorb moisture and cannot be stored in humid areas. It cannot be washed with water. It can be wiped directly with sandpaper or wiped with alcohol.

Main applications of boron nitride ceramics

Basic overview of boron nitride ceramics
In its solid form, hexagonal boron nitride (HBN) is often called “white graphite” because its microstructure is similar to graphite. However, unlike graphite, boron nitride is an excellent electrical insulator with a higher oxidation temperature. It has high thermal conductivity and good thermal shock resistance and can be easily machined to almost any shape tolerance. After processing, it is ready for use without additional heat treatment or sintering operations.

Boron nitride is a heat- and chemical-resistant refractory compound composed primarily of the elements boron and nitrogen. Its chemical formula is BN.
Other common descriptions of boron nitride include hexagonal boron nitride (H-BN) and hot-pressed boron nitride.
Boron nitride exists in various crystal forms that are isoelectronic to the similarly structured carbon lattice. The most stable form of boron nitride is the hexagonal form corresponding to graphite.
The following are the main application areas of boron nitride ceramics:
1. Insulators for high temperature furnaces;
2. Electrical insulators in vacuum systems;
3. Hexagonal boron nitride is mainly used as an alternative lubricant to graphite when the electrical conductivity or chemical reactivity of graphite is considered to be a problem.
4. They are used as semiconductor substrates, microwave transparent windows and sealing structural materials in electronic products
5. It is used as a gasket for glass melting;
6. Crystal growth crucible;
7. Broken rings for horizontal continuous casting machines;
8. Feedthrough of high-voltage equipment;
9. Boron nitride ceramics parts for ion implantation equipment;
10. Electrostatic printing process and laser printer, it is used as the charge leakage barrier layer of the photosensitive drum;
11. In the automotive industry, h-BN is often mixed with binders such as boron oxide to seal oxygen sensors.
Performance parameters of boron nitride ceramics:

Density	1.6g/cm³
Color	White
Working temperature	900-1800-2100
Three point-bending strength	18mpa
Compressive strength	45Mpa
Thermal Conductivity	45W/m·k
Thermal expansion coefficient(20-1000℃）	1.5 10-6/K
Room Temperature Electric Resistivity	＞10 14Ω·cm

Boron Nitride Application-Nozzle

BN nozzle is a high-performance nozzle that is usually used for fluid dynamics research and spray experiments under special working conditions such as high temperature/high pressure. It is suitable for the following application fields:

1. Liquefied natural gas/LNG spray: BN nozzles can stably spray liquefied natural gas under high temperature and high pressure conditions, improving the uniformity and flow control of LNG spray.
2. Ion implantation: BN nozzles can make long-term ion implantation simpler and more reliable, and are used in manufacturing and repair in the semiconductor industry.
3. Fine chemicals manufacturing: BN nozzles can be used to manufacture high-purity and high-efficiency catalysts, high-temperature curing agents, chemicals and biological agents, etc.

Precautions:
1. Before using the BN nozzle, you first need to clean the nozzle surface and ensure that all pipes and joints are in normal condition.
2. When splashing liquid in the nozzle, the pressure and distance of the nozzle need to be appropriately adjusted according to the characteristics of the nozzle and the physical properties of the liquid.
3. During long-term use, the nozzle may be worn and clogged and needs to be cleaned and replaced in time.

Hot-Pressed Aluminum Nitride

About Hot-Pressed Aluminum Nitride (AlN)

Hot pressed aluminum nitride ceramics are sintered by vacuum hot pressing. The aluminum nitride purity is up to 99.5%(without any sintering additives), and density after hot pressing reaches 3.3g/cm3, it also has excellent thermal conductivity and high electrical insulation. The thermal conductivity can be from 90 W/(m·k) to 210 W/(m·k).

The aluminum nitride ceramic mechanical strength and hardness of the product after high temperature and high pressure are better than those of the tape casting process, dry pressing and cold isostatic press method.

Hot pressed aluminum nitride ceramics have high temperature resistance and corrosion resistance, and will not be eroded by various molten metals and molten hydrochloric acid.

Typical Application of Aluminum Nitride (AlN)

Cooling cover and magnetic resonance imaging equipment
As the substrate of high-frequency surface acoustic wave device, large-size and high-power heat dissipation insulating substrate
Electrostatic chuck and heating disk for semiconductor and integrated circuit
Infrared and microwave window materials
Crucible for compound semiconductor single crystal growth
Target of high-purity aluminum nitride film

Features

High thermal conductivity
Expansion coefficient can match with semiconductor silicon chips
High insulation resistance and voltage withstand strength
Low dielectric constant and low dielectric loss
High mechanical strength

Maximum Size of Hot Press Sintering.

Length 500 x width 500 x height < 350 mm
Outer diameter 500 x height < 500 mm
We can provide Hot Pressed Aluminum Nitride (HPAN) as required.

Order Information

Inquiries and orders should include the following information:
1.Dimensions or drawings
2.Quantity

Packing and Storage

Standard Packing: Sealed bags in carton boxes. Special package is available on request.

Typical Specification

Purity:	>99%
Density:	>3.3 g/cm3
Compress Strength:	>3,350MPa
Bending Strength:	380MPa
Thermal Conductivity:	>90W/(m·K)
Coefficient of Thermal Expansion:	5.0 x 10-6/K
Max. Temp:	1,800°C
Volume Resistivity:	7×1012 Ω·cm
Dielectric Strength:	15 kV/mm

Ceramic Heat Sinks Replaced Aluminum Heat Sinks In LEDs

There are a lot of practical uses for ceramic in LEDs. First of all, they’re possibly the best material to use for heat sinks. This is because aluminum replaced copper as the cheaper alternative for heat sinks in LEDs. However, although it is relatively malleable and effective in conducting heat, it’s not that environmentally friendly to dispose of. This is where ceramic comes in! Ceramic is a very cost-productive material to use for heat sinks. This is because it is very easily available, can be printed out into heat sink shapes very easily and only needs the LED chip to be stuck directly onto it. This means using ceramic material for your LED’s heat sinks removes the need for PCB boards and thermal adhesives. Ceramic is a great alternative to previously used aluminum as they’re more environmentally friendly and contribute better to the overall heat dissipation of the light.

There are below benefits to use ceramic heat sinks:
Longer Lifespan: Having highly effective heat dissipation will prolong an LED’s life significantly. This is because LEDs are semiconductor devices and their internal components are made from materials that do not operate well under high temperatures. So the key is to find a way of shifting the heat away from the internal components to prolong the life of the LED.
Safer: Everybody knows a light running at a very high temperature is a safety risk. Especially LED’s at high temperatures. If your home has lights running at lower temperatures, there is much less risk to in one blowing or an accident happening.
Energy Efficient: An LED light with great heat-dissipating qualities will be more energy efficient. Although LED’s do run at lower temperatures than incandescent bulbs, they still have a lot of wasted energy as heat. If the light’s heat sinks are capable of removing the heat away from the internal components the LED light will have the capability of using less wattage with the same amount of lumens.

Below is different material thermal conductivity:

Material	Thermal Conductivity(W/mK)
AlN	>200
Aluminum	235
Al alloys	166 -229
Gold	316
Copper	399
Silver	429
Diamond	900-2320

Although there are many good heat dissipation materials, the ceramic heat sinks is a great alternative and a very cost-productive material.
If you have more interesting, pls consult with us for ceramic heat dissipation solution.

Boron Nitride Sealing Ring, Vacuum Gasket, High Temperature Protection Ring

Due to its excellent performance, boron nitride ceramic sealing rings are widely used in various industrial fields with strict high temperature, corrosion and sealing requirements.

1. Automotive industry: Boron nitride ceramic sealing rings can be used in high-temperature/high-pressure and corrosive environments of automobile engines to improve sealing performance and reduce energy loss.
2. Aerospace industry: Boron nitride ceramic sealing rings can be used in high-temperature/high-pressure and corrosion-resistant environments such as turbine components, jet engines and aerospace instruments.
3. Chemical industry: Boron nitride ceramic sealing rings can be used in chemical equipment/pipeline connections and pump valve seals, providing good corrosion resistance and long life.
4. Vacuum technology: Boron nitride ceramic sealing rings can be used in sealing devices of vacuum equipment because it has good sealing performance and high temperature stability.

How To Solve The Problem Of Insufficient Heat Dissipation Of Ceramic Substrate In Thermoelectric Cooler

Thermoelectric cooling is a new technology that has the potential to revolutionize the way things are kept cold, whether it is food, wine, beer or cigars. In fact, it is a completely different approach to refrigeration from standard compressors.

As we know that ceramic substrate plays a vital role in the thermoelectric cooler, the top and bottom of thermoelectric cooler(TEC) are ceramic substrate, which play the role of electrical insulation, heat conduction and support. And the biggest problems for the TEC is the heat dissipation.
To solve this problem it the top concern.

As different ceramic materials have different electronical and chemical properties. For example, the thermal conductivity of alumina is ≧24W/M.K, and the thermal conductivity of aluminum nitride is ≧170W/M.K. After the TEC is connected with the current, the temperature difference is generated due to the Parr effect, and the resistance encountered in the process of heat transfer inside the ceramic base is called the thermal conductivity resistance. The thermal resistance experiment shows that Al>Al2O3>Cu>AlN, aluminum nitride substrate has the lowest thermal resistance and the best thermal conductivity.
And the aluminum nitride substrate with thinner plate thickness has smaller thermal resistance.
The best choice is to use aluminum nitride substrate instead of alumina.

How to use Alumina Ceramic Tubes for long-term use

Alumina ceramic is widely applied in the high-temperature industry because of its excellent resistance to high temperatures. It can withstand high temperatures up to 1800℃, in addition to its stable chemical properties, high mechanical strength, and electrical insulation. So Alumina ceramic tube is commonly used in high-temperature furnaces, thermocouples tubes, insulating tubes, and corona electrode’s square ceramic tubes. In this articles, we would like to discuss how to use alumina ceramic tubes at high temperatures to ensure optimal performance and longevity.

1. Proper handling and storage
Alumina tubes are brittle, avoid any sudden impacts or shakes to prevent breakage. During storage, it should be stored in a dry and clean environment to prevent contamination.
2. Preheating
When using alumina tubes, we should be preheated gradually, the heating rate should be controlled at 5 degrees per minute until it reaches the desired temperature, the slower the better.
3. Cleaning
Before using aluminum oxide tubes, it is important to clean them thoroughly to remove any impurities or residue. Any foreign matter on the surface of the tube may cause contamination or blockage during use. A combination of solvents, detergents, and/or acid solutions can be used to clean the tubes. After use, don’t leave some samples in the tube to avoid chemical reactions that may cause the alumina tube to crack.
4. Heating
When placing or removing the sample, do not exceed 150 degrees and move slowly from the edge to the center. Placing or removing samples at high temperatures is the main cause of alumina tube breakage. Do not touch the high temperature furnace tube with low temperature objects. Repeated thermal cycling can stress the aluminum oxide tubes, causing them to crack or even fail completely. So it is recommended to use the alumina tube at a steady temperature without any sudden changes.
5. Cool down
After use, it is important to cool the aluminum oxide tube slowly to avoid thermal shock. Rapid cooling can cause the tube to crack or even fail completely. It is recommended controlled at 5 degrees per minute until it reaches room temperature.

In conclusion, proper handling, preheating, cleaning, heating, and cooling are essential to ensure optimal performance and longevity of the tube.

Ceramic Metallized Technology, A Strong Combination Of Ceramics And Metals

With the development of intelligent devices in the direction of digitalization, miniaturization, low energy consumption, multifunctionalization, high reliability, etc., the closely related electronic packaging technology has also entered a period of ultra -high -speed development.
Commonly used electronic packaging substrate materials include three categories: organic packaging substrate, metal base composite substrate, and ceramic packaging substrate. With the evolution of intelligent devices, traditional substrate materials can no longer meet the current needs of the current development. Therefore, the base board materials are evolved from organic materials, metal materials, and evolution to ceramic materials.

As we all know, ceramic materials have many advantages compared to traditional substrate materials:
1. Low communication loss – The dielectric constant of the ceramic material itself makes the signal loss smaller.
2. High thermal conductivity – the heat on the chip is directly transmitted to the ceramic sheet. There is no need for insulating layer to achieve relatively better heat dissipation.
3. The more matched thermal expansion coefficient -the thermal expansion coefficient of ceramics and chips is close, and it will not cause too much deformation when the temperature difference drama changes causes the problem of line welding and internal stress.
4. High-temperature resistance – Ceramics can withstand a high and low temperature cycle with large fluctuations, and can even operate normally at a high temperature of 500-600 degrees.
5. High-electricity insulation – Ceramic material itself is an insulating material, which can withstand high breakdown voltage.
6. High chemical stability – Ceramic materials can be etched with acid, alkali, and organic solvents during processing.
7. High mechanical strength – The ceramic material itself has a good mechanical strength and good stability
Therefore, ceramic materials have gradually developed into an ideal packaging substrate for new generation of integrated circuits and power electronic modules. The current commonly used ceramic substrate materials include Al2O3, AlN, and SI3N4. Ceramic metallized technology has also received extensive attention and rapid development.
Finally, ceramic metallization process is as follows: