Meet us at Expo Electronica 2026 in Hall 14 C7101 To Explore Advanced Ceramic Substrates & Ceramic Packaging Solutions.
At Expo Electronica 2026, we will present our ceramic substrates, ceramic packages and ceramic heating elements in Microelectronics Assembly and Semiconductor packaging electronics applications which covers Chip Packaging, IC Packaging, and Integrated Circuit Packaging, with a strong focus on ADVANCED PACKAGING and advanced microelectronics assembly technologies.
As global demand rapidly expands in the fields of new energy, power semiconductors, and optoelectronics, we are committed to delivering integrated solutions-ranging from ceramic packaging to high thermal conductivity are ceramic substrates and functional ceramic components such as ceramic heating element.
Advanced Packaging Solutions with Technical Ceramic Materials
With the rapid evolution of Semiconductor Packaging, materials play a critical role in ensuring device reliability and thermal performance. We would like show our related technical ceramic materials and components in our booth:
– High-reliability ceramic packages for hermetic sealing applications
– High-performance Ceramic PCB and Thin-Film Circuit Boards Substrates for high-frequency and high-density designs
– Thin Film Ceramic Substrate and Thick Film Ceramic Substrate for precision circuits and power electronics
These solutions are widely used in advanced microelectronics assembly, enabling compact design, improved thermal management, and long-term stability.
What is Ceramic Substrates Application and Solutions?
1. Energy Storage & EV Charging Infrastructure
For energy storage systems and EV charging stations, reliability and thermal management are key.
Our solutions include:
– Alumina (Al₂O₃) thick film substrates for power resistors
– Alumina thin film substrates for chip resistors and control circuits
– Ceramic spacers and high-power thermal pads for heat dissipation
Applications:
– Power supply modules
– Charging piles (fast/ultra-fast EV chargers)
– Energy storage converters
2. IGBT Power Modules & Power Electronics
In high-power applications, thermal conductivity is critical. Our Aluminum Nitride (AlN) substrates provide superior heat dissipation.
Key offerings:
– AlN DPC sub mount (Direct Plated Copper) for high-current applications
– Ceramic Substrates for Power Electronics
– High-performance substrates for IGBT modules
Applications:
– IGBT power modules
– Inverters (solar & industrial)
– EV drivetrain systems
3. Automotive (EV & Tier 1 Suppliers)
We support automotive-grade requirements with high-reliability ceramic solutions.
Applications include:
– On-board chargers (OBC)
– DC-DC converters
– Motor control systems
Core materials:
– AlN ceramic substrates
– DPC ceramic substrates
– High-power thermal interface pads
4. LED & Optoelectronics
For High Power LED applications, efficient heat dissipation directly impacts performance and lifespan.
Our solutions:
– LED thermal ceramic substrates
– AlN DPC substrates for high-end LED packaging
– Ceramic PCB for lighting modules
Customized Ceramic Components for Advanced Systems
At Expo Electronica 2026, we also provide customized ceramic solutions for demanding environments:
– Ceramic Substrates for Plasma Generators (semiconductor equipment)
– Precision ceramic spacers for energy and industrial systems
– AIN DPC sub mount for high-performance packaging
Ceramic Heating Elements for Microelectronics
Except ceramic substrates and packaging, we also provide Ceramic Heating Elements.
Key advantages:
– fast heating and uniform temperature distribution
– Excellent thermal stability and long service life
– Excellent electrical insulation
Applications:
– Consumer Microelectronics
– New energy automotive EV
– Home appliances
– Industrial heating and energy systems
Why Choose Us?
– Full coverage products from alumina substrates to AlN DPC advanced packaging
– Strong capabilities in thin film and thick film technologies
– Proven solutions for Semiconductor Packaging, EV, and LED industries
– Customizable designs for high-reliability applications
Meet Us at Expo Electronica 2026 in Hall 14 C7101
As Chip Packaging and IC Packaging continue evolving toward ADVANCED PACKAGING, technical ceramic materials are becoming essential to next-generation electronics.
We warmly invite you to visit us at Expo Electronica 2026 in Hall 14 C7101 to explore our complete range of ceramic substrates, ceramic packages, and thermal management solutions.
Let’s collaborate to power the future of microelectronics, energy, and automotive.
For more details, welcome to contact us at sales@innovacera.com.
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