Merry Christmas and a Happy New Year!
We wish all customers, suppliers, partners and friends of the INNOVACERA a peaceful Christmas and a prosperous new year!
The INNOVACERA team
The Ceramic Dual In-line Package (DIP) Enclosure is a high-reliability ceramic housing designed for integrated circuits and electronic components requiring stable electrical performance, thermal manag…
The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that demand excellent mechanical strength, thermal stability, …
Silicon nitride coil supports are widely used as sensors in underground mining, geological exploration and other fields.