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    The Ceramic Dual In-line Package (DIP) Enclosure is a high-reliability ceramic housing designed for integrated circuits and electronic components requiring stable electrical performance, thermal manag…

  • Ceramic Small Outline Package (CSOP)

    Ceramic Small Outline Package (CSOP)

    The Ceramic Small Outline Package (CSOP) is a high-reliability ceramic IC packaging solution designed for miniaturized electronic systems that demand excellent mechanical strength, thermal stability, …

  • Supports for induction heating coils

    Silicon Nitride Ceramic Coil Core

    Silicon nitride coil supports are widely used as sensors in underground mining, geological exploration and other fields.

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