News | INNOVACERA

Soldering ceramic vacuum welding components: A long-term and reliable sealing solution for high vacuum systems

In high vacuum and ultra-high vacuum systems, the electrical connections or functional components crossing the vacuum boundary are always the key factors affecting the stability and lifespan of the system. Traditional organic seals or mechanical compression structures often encounter risks of aging, gas release and sealing failure under high temperature, thermal cycling and long-term operation conditions.

In response to this industry challenge, we have introduced the Ceramic Vacuum Feedthrough, manufactured using a mature high-temperature vacuum brazing process. Through the mature high-temperature vacuum brazing process, it achieves a permanent airtight connection between ceramics and metals, specifically designed for the demanding vacuum pressure environment.

Structural Design Based on Engineering Requirements This component uses high-purity alumina ceramic as the insulating core, combined with metal materials (such as stainless steel, molybdenum or Kovar alloy) whose thermal expansion coefficient matches that of the ceramic. The high-temperature brazing is completed in a vacuum environment.

Key Process Advantages
– Vacuum brazing seal Employing a fully metal-ceramic sealed structure without any organic materials, this design avoids the problem of gas release during operation.
– High air-tight reliability The typical leakage rate can reach ≤ 10⁻⁹ mbar·L/s, meeting the requirements of high vacuum and ultra-high vacuum systems.
– High Temperature Resistance and Thermal Cycling Suitable for frequent start-stop and temperature-changing working conditions, with long-term stable sealing interface
– High insulation and low crosstalk The ceramic body has high dielectric strength and is suitable for the electrical connection requirements in precision analysis equipment.

In semiconductor vacuum devices, electron microscopes, vacuum ovens and other equipment, Ceramic Vacuum Feedthroughs are widely used for the electrical connection of ion sources, electrodes or heating units. Compared with the traditional structure, its advantages lie in:
– Reduce the risk of system leakage
– Enhance the long-term operational stability of the entire machine
– Decrease the frequency of maintenance and replacement
– Support higher working temperatures and more demanding working conditions

Through continuous optimization in material selection and process control, this brazed ceramic vacuum welding component provides engineers with a predictable, verifiable and long-term applicable vacuum sealing solution, suitable for the design of vacuum systems with extremely high reliability requirements.

Zirconia For High Temperature Use

Are you looking for a ceramic can be used for high temperature more than 1500 degree centigrade, or even more 2000 degree C? In Innovacera, we have such a material that can meet your requirement. It is MSZ zirconia ceramic.We also call it yellow Zirconia as its appearance is yellow color.

Its main composition is zirconium oxide about 95%, second is MgO around 2%. With MgO joining in, its performance is totally different with common Zirconia ceramic, which is white color without porosity and is only suitable for working temperature below 1000 degree C.

We have two types of the yellow Zirconia, one with high density 5.3-5.5g/cm3 but low porosity ≤5%.，one with lower density 4.8-5.2g/cm3 but higher porosity ≤12%. Please note that the density and porosity is a range not an exact data as different technology it will be different. It can be doing by casting, dry pressing and Isostatic pressing. Different technology the cost is various.

Here is the material data sheet:

Material Properties	Item	Units	MSZ-L	MSZ-H
Composition	ZrO2	%	≥95	≥95
	Al2O3	%	≤0.2	≤0.2
	SiO2	%	≤0.4	≤0.4
	MgO	%	≤2.9	≤2.9
	Fe2O3	%	≤0.1	≤0.1
	TiO2	%	≤0.1	≤0.1
Physical	Color		Yellow	Yellow
	Density	g/cm3	4.8-5.2	5.3-5.5
	Porosity	%	≤12	≤5

If you are looking for a ceramic working at atmosphere and the temperature reaches more that 1500degree C, our MSZ zirconia may be suitable. If your working environment is vacuum, high vacuum, or with inactive gas, BN family can be considered as well.

Advantages
– High wear-resistant and erosion- resistant
– Metal corrosion resistance in high temperature
– High Strength
– Long service life

Any more questions about MSZ/yellow zirconia ceramic, just feel free to contact us at +86 592 558 9730 or sales@innovacera.com for more information.

Ceramic SMD Packages: The Critical Parts for High-Frequency and Miniaturized Microwave Devices

Along with the rapid growth of microwave devices such as wireless communication, radar detection etc., that operate at higher frequencies, with greater bandwidth, in smaller size together with more reliability. As a critical component: the Surface-Mount Device (SMD) ceramic package, provided the protection for core components of the microwave systems, enables the excellent performance, miniaturization, and durability of modern microwave systems.

Why Ceramic SMD Packages as the Key Advantages for Microwave Applications?

Superior High-Frequency Electrical Characteristics: Ceramic packages manufactured by Innovacera are primarily composed of aluminum oxide ceramic material, which inherently possesses an extremely low dielectric constant and dielectric loss. This property ensures that the chips can be well protected within ceramic packages, providing the maximum signal integrity during high-frequency microwave signal transmission.

Outstanding Sealing Performance: Ceramic material is a type of material with high hardness, high rigidity, and the thermal expansion coefficient can be well-matched to semiconductor chips, and achieve hermetic sealing. This prevents the chips inside from mechanical stress, moisture, and corrosion, ensuring operation stability in extreme environments.

High Thermal Conductivity: Except for protecting chips from external moisture and corrosion, alumina ceramics also can be act as a heat dissipation during chips working. This prevents performance degradation and failure due to overheating, significantly enhancing the device’s power density and long-term operational reliability.

Based on these characteristics, ceramic SMD packaging plays an irreplaceable role in microwave devices:

It is not merely a “protective shell,” but a high-performance “functional extension.” Through precision-designed ceramic metallization patterns, it directly forms transmission lines, impedance matching networks, and even embedded passive components. More importantly, via system-level packaging technology, it integrates multiple chips and complex circuits into a single ceramic substrate in three dimensions, achieving ultimate miniaturization and maximized functionality for modules.

As technology advances, ceramic SMD packaging assumes an increasingly vital role in microwave devices. Innovacera is committed to continuously refining its materials and assembly processes, striving to provide stronger assurance for chip applications across diverse industries.

Material BAN–BN+AlN From Innovacera

Are you looking for a BN material with strong compressive strength and high thermal conductivity? If so our BAN ceramic will be a good choice. Innovacera’s BAN ceramic is composited by Boron Nitride and Aluminum Nitride. Main composition is 40%-50% boron nitride and 40%-50% AlN. It is equal to the material BN+AlN.

This is a material developed by Innovacera technical team. It has an excellent performance in thermal conductivity, mechanical strength and electrical insulation, at the same time low thermal expansion which can be used in precision engineering applications and extreme environment like semiconductor manufacturing,, electronics, clean energy industry and vacuum furnace.

For pure BN ceramic like 99% BN and 99.7% BN, its thermal conductivity rate can only 35-40W/wK. With the composition of AIN, which has thermal conductivity rate 170W/mK. It make BAN can reach 85W/wK, highly increasing. At the same time pure BN is very soft and its compressive strength can only be 45-85MPa. If you need harder BN, BAN will be a better choice as compressive strength can be 220MPa.

Regarding the application, it can work under temperature 1750 degree centigrade for a long time with inactive gas or under vacuum environment. But at atmosphere, the max working temperature is only 900 degree centigrade. Here is the material properties of BAN ceramic:

Material Composition	BN+ALN
Density	2.8g/cm2-2.9g/m3
Color	Greyish-Green
Bending Strength	90MPa
Compressive Strength	220MPa
Thermal Conductivity	85W/(m.k)
Thermal Expansion Coefficient (20-1000°C)	2.8 10-6/K
Max working temperature	In Inactive Gas 1750 °C
	In High Vacuum 1750 °C
	In Atmosphere 900 °C

Material Application:

– High temperature and Metallurgy
– Thermal Management like heat sink
– Vacuum components
– Semiconductor and Electronics
– Components where low dielectric constant and dissipation factor are required

Besides BN+AlN, Innovacera also have lots of similar ceramic parts like Aluminum nitride, machinable AlN, 99% BN, 99.7% BN, BN+SiO2, and BN+Al . If you have any question about BN ceramic, just feel free to contact us at +86 592 558 9730 or sales@innovacera.com for more information.

Alumina Ceramic Cartridge Spacer for Turntable Systems

In high-fidelity analog audio systems, the mechanical connection quality between the stylus and the tonearm directly affects the geometric accuracy, operational stability, and long-term consistency of the system. To meet the actual needs for fine-tuning the stylus height and ensuring installation stability, we have introduced an Ceramic Cartridge Spacer as a more reliable and predictable solution for the vinyl record player system.

Designed specifically for standard 1/2″ installation systems This ceramic gasket is suitable for all arm structures that adopt the standard 1/2″ (12.5 mm) stylus installation specification. It is compatible with the vast majority of MM and MC styluses and standard headshell configurations available on the market. It can be easily integrated into existing turntable systems without the need for additional modifications.

Alumina ceramic materials – a stable and restrained engineering choice The product is made of alumina ceramic (Alumina Ceramic). As a mature engineering ceramic material, alumina has high hardness, high rigidity and excellent dimensional stability. It does not age easily during long-term use and is not affected by humidity or environmental changes.

Compared to common plastic or soft gaskets, the ceramic material forms a more stable and rigid installation interface between the stylus and the head shell, which helps maintain the consistency of the stylus’s geometric relationship.

Precise weight control, facilitating system calibration The weight of the single pad is approximately 1.8 g. It ensures a fixed thickness and structural stability while avoiding excessive influence on the effective mass of the arm, making it convenient for users to perform controllable and repeatable fine adjustments during system calibration.

Detailed design tailored for both enthusiasts and rational users This product is mainly used to increase the fixed distance between the cartridge and the cartridge head housing, assisting in the fine adjustment of the cartridge height or the vertical tracking angle (VTA).

As precision ceramic components, the product requires careful handling during use and installation – treat it like thin glass and avoid dropping or lateral impacts to ensure structural integrity.

Applicable Scenario
– Installation and adjustment of vinyl record turntable cartridges
– Systems requiring fine-tuning of cartridge height / VTA
– Analog audio systems with requirements for mechanical stability and installation consistency
– Vinyl enthusiasts and engineering-oriented users

Holiday Notice – Chinese New Year 2026

Dear Valued Customers and Partners,

Thank you for your continued support of Xiamen Innovacera Advanced Materials Co., Ltd. (INNOVACERA) — a reliable global supplier of advanced ceramic components and precision technical ceramic solutions with over a decade of experience in R&D, manufacturing, and quality control. Our products serve industries including semiconductor, aerospace, automotive, medical, scientific research, fluid control, and more.

In observance of the 2026 Chinese New Year (Spring Festival), we would like to inform you of the upcoming holiday schedule as follows:

Holiday Schedule

Holiday Period: February 12, 2026 (Lunar Dec 25) to February 23, 2026 (Lunar Jan 7)

Total Days Off: 12 days

Return to Work: February 24, 2026 (Lunar Jan 8)

Make-up Work Day: February 28, 2026 (Saturday)

During the holiday period, our offices will be closed. Normal operations and order processing will resume on February 24, 2026.

Communication and Support

We remain committed to providing timely support throughout the holiday. Please feel free to contact us for urgent matters; sales and customer service emails will be monitored periodically to ensure communications remain smooth.

Warm Wishes

We sincerely thank you for your trust and cooperation over the past year. We wish you a Happy Chinese New Year, and may the Year of the Horse bring you good health, prosperity, and success!

Warm regards,
Xiamen Innovacera Advanced Materials Co., Ltd.

CDIP Packages and Innovacera’s Ceramic Packaging Solutions

CDIP Packages for Integrated Circuits

Innovacera provides a comprehensive of ceramic packaging, including nine types such as CDIP, CFP, and CQFP. These ceramic packages are widely used in integrated circuits and optical communications to semiconductors, laser packaging, and optoelectronic devices. Main packages focus on small to medium form factors with 8 to 44 pins, providing optimal versatility for most design requirements.

Alumina ceramic is good choice material of cost-sensitive applications, aluminum nitride is for high-power and thermally critical designs. Ceramic Dual In-line Package (CDIP) can be broad range of lead counts to accommodate diverse circuit layouts.

Ceramic Package Types

– Ceramic Dual In-line Package (CDIP)
– Ceramic Flat Package (CFP)
– Ceramic Quad Flat No-leads (CQFN)
– Ceramic Pin Grid Array (CPGA)
– Ceramic Small Outline Package (CSOP)
– Ceramic Leadless Chip Carrier (CLCC)
– Ceramic Quad Flat Package (CQFP)
– Surface Mount Device (SMD)
– ROSA Ceramic Package
– TOSA Ceramic Package

Material Properties: 92% vs. 93% Alumina

Property	Test Conditions	Unit	92% Alumina (Black)	93% Alumina (White)
Al₂O₃ Content	–	%	92	93
Density	25°C	g/cm³	3.7	3.65
Thermal Conductivity	25°C	W/(m·K)	20	18
Coeff. of Thermal Expansion	40–400°C	×10⁻⁶/°C	6.7	7.0
	40–800°C	×10⁻⁶/°C	6.9	7.2
Volume Resistivity	20°C	Ω·cm	10¹⁴	10¹⁴
	300°C	Ω·cm	10¹⁰	10¹⁰
	500°C	Ω·cm	10⁸	10⁹
Dielectric Constant	1 MHz	–	10	9
Dielectric Loss	1 MHz	×10⁻⁴	4	4
Flexural Strength	0.5 mm/min	MPa	400	400

With growing electric vehicles, semiconductor tech, and high-frequency communications, the global ceramic packaging market is on the rise too. There are a few key innovations driving this growth: high-thermal-conductivity substrates (aluminum nitride, or AlN, and alumina, Al₂O₃), multilayer ceramic packages (MLC/MLP), and advanced hermetic sealing.

Aluminum nitride substrates stand out with thermal conductivity ranging from 170 to 200 W/, plus great CTE (coefficient of thermal expansion) matching. These features boost the reliability and performance of power modules. On the other hand, multilayer ceramic packages cut down on RF signal loss and let you achieve higher integration density—making them a perfect fit for 5G/6G front-end modules, all kinds of ICs, and MEMS sensors.

Hermetic packaging ensures long-term operational stability. That’s a must-have for semiconductor manufacturing, test equipment, and tough optoelectronic applications where consistent performance matters.

M3 Threaded Ceramic Insulators for Ion Repellers & High-Voltage Vacuum Systems

Electron gun and ion source assemblies work in harsh conditions—high voltage, high temperatures, and ultra-high vacuum alike. This is especially true for ion repeller insulators, a key interface component where reliable electrical isolation and airtight vacuum sealing are both must-haves.

Our glazed alumina ceramic tubes with precision internal threading—engineered as Ion Repeller Ceramic Tubes—are made specifically for these tough applications. As the core insulating part of repeller insulator assemblies, they pair perfectly with alumina bolts, delivering steady performance while ensuring firm mechanical fastening and reliable electrical isolation.

High-Vacuum Design: A Core Engineering Challenge

Keeping long-term vacuum integrity in high-voltage setups is a classic engineering hurdle. Insulators have to do three jobs at once: act as mechanical support, block electrical current, and seal the vacuum—all while staying stable when hit with thermal and electrical stress.

Common alternatives all come with risks. Metal inserts can weaken insulation; unprocessed ceramic surfaces have tiny microscopic pores that cause slow outgassing and vacuum loss. Even poorly machined threads can create leak paths, leading to gradual performance drops: higher internal pressure, unstable beam currents, and inconsistent ion repeller output.

How Our M3 Threaded Ceramic Tubes Fix These Issues

We’ve built this component from the ground up to tackle these pain points, combining tailored material selection with precise machining for high-vacuum, high-voltage needs.

95% Alumina Substrate

Our high-purity alumina is a tried-and-true choice, balancing all the key properties these applications demand:
– Dielectric strength over 15 kV/mm
– Stable performance even at high temperatures
– Ultra-low outgassing—critical for keeping vacuum purity intact

Precision M3 Internal Thread

Every M3 internal thread is machined to 6H tolerance, ensuring a tight, consistent fit with standard M3 alumina bolts and electrodes. This precision cuts down on misalignment, distributes clamping force evenly across the surface, and lowers the chance of ceramic cracking during installation and use.

Proprietary Vitreous Glaze Coating

We fuse a vitreous glaze to the ceramic surface, which eliminates all microscopic pores outright. This boosts vacuum retention and tracking resistance dramatically, and also creates a chemically inert, easy-to-clean surface that resists contamination and holds up over time.

Typical Applications

– High-voltage feedthroughs for electron guns
– Insulated mounting for ion source and repeller electrodes
– Diagnostic port insulators in vacuum chambers
– Custom vacuum system assemblies and prototyping work

Customization & Technical Support

– We regularly customize these components to match specific assembly needs—including thread sizes, custom dimensions, and alternative material grades like 99% alumina. We also provide detailed torque guidelines and technical notes to make sure alumina bolts are installed correctly every time.

– If your system is dealing with unexplained vacuum leaks, high-voltage instability, or inconsistent ion repeller performance, the Ion Repeller Ceramic Tube interface is almost always a key factor. We invite you to test this component in your setup—our biggest strength is delivering steady, reliable performance that holds up long-term.

High-Current Hermetic Ceramic Feedthrough For CO₂ Laser Power Systems

Designed for demanding laser applications, high-current hermetic feedthroughs for CO₂ lasers are critical components where stable power transmission, reliable insulation, and mechanical integrity are essential for continuous system operation.

Hermetic Ceramic Feedthrough Applications:

The ceramic feedthrough for laser power supply is commonly used in:
CO₂ laser power supplies
Industrial laser cutting and welding systems
Laser system maintenance and component replacement
Other high-current electrical feedthrough applications within laser equipment

Feedthrough for laser power supply

Ceramic Feedthrough Features:

100A rated capacity
High electrical insulation
Ceramic Material High-Purity Alumina (Al₂O₃)
Copper conductor ensuring minimal resistive loss
Compact, flanged design for secure panel mounting
Engineered for continuous, reliable operation in laser environments

Technical Specifications

Parameter	Specification
Rated Current	Up to 100 A
Ceramic Material	High-purity Alumina (Al₂O₃)
Conductor Material	Copper
Overall Height	38 mm (excluding top terminal)
Flange Diameter	Ø 35 mm
Flange Thickness	5 mm
Mounting Type	Flanged mounting
Insulation Function	Electrical insulation
Customization	Available upon request

Performance & Design:

The alumina ceramic body provides stable electrical insulation,while the copper conductor ensures low electrical resistance and efficient high-current transmission.

The flanged structure enables secure installation into the laser power supply housing,helping maintain system stability and reducing the risk of overheating or electrical failure during laser operation.

Laser systems

Reliability & Manufacturing:

Built for industrial duty, each unit supports continuous high-current operation. Manufactured using a controlled ceramic-to-metal sealing process, every custom high-current feedthrough undergoes dimensional and visual inspection prior to delivery.

Customization Services:

We offer tailored solutions, including modifications to:
Flange dimensions and layout
Conductor design and configuration
Current rating adjustments
Mechanical and electrical interface requirements

We specialize in hermetic ceramic feedthroughs for laser and vacuum systems,focusing on long-term reliability and stable electrical performance, for more detail, pls contact sales@innovacera.com.

CSOP: Hermetic Ceramic Package for Stable and Reliable SMT Applications

In semiconductor equipment, industrial control systems, and high-reliability electronic systems, the package not only provides electrical connections but also directly affects the long-term stability of the device in high-temperature, vacuum, or otherwise demanding environments. Although traditional plastic-encapsulated SOP packaging is cost-effective and fast to produce, it is susceptible to aging, leakage, or performance degradation under high humidity, high temperature, and long-term operation conditions.
In contrast, ceramic packaging has inherent advantages in terms of air tightness, material stability, and service life. Among them, Ceramic Small Outline Package (CSOP) is a type of ceramic package that combines mature manufacturing techniques with surface mount requirements. It integrates the high stability of ceramic materials with the compact form factor of SOP (Surface Mount Package), and is widely used in electronic systems that have high requirements for reliability and process stability.

01 What is a CSOP ceramic tube shell?
CSOP is a ceramic gas-sealed housing developed based on the Small Outline Package (SOP) structure.
Its typical characteristics include:
– Using alumina or aluminum nitride ceramics as the matrix material.
– Two-sided pins or metallized pads for SMT assembly.
– An internal sealed cavity can be formed, which is used for chip mounting and lead bonding.
– Provides gas-tight sealing by using ceramic caps or metal caps.
While maintaining the familiar form factor and mature manufacturing process of the SOP packaging, the CSOP adopts ceramic materials to enhance its high-temperature stability and long-term reliability. It can protect the performance and lifespan of the chip in harsh environments such as humidity, temperature or vacuum. Meanwhile, its through-hole compatible design also makes the production process more flexible, enabling automated SMT assembly and facilitating system repair and maintenance.

02 The Positioning of CSOP in the Ceramic Tube Shell System
In the entire ceramic tube housing product line, CSOP does not aim for the highest pin density or the smallest package size. Instead, it serves as a basic and reliable solution, providing stable support for semiconductor equipment, industrial control modules, and aerospace electronic systems.
Compared with forms such as CLCC and CQFN that have no pins or are of high-density, CSOP places greater emphasis on the following characteristics:
– Mature structure, with sufficient long-term application verification.
– More friendly to PCB design and soldering processes.
– It has better tolerance under thermal cycling and mechanical stress.
– Easier for detection, repair and system-level maintenance.
Therefore, CSOP is often chosen for systems that emphasize reliable performance and long-term reliability, rather than simply pursuing the limits of package size or pin count.

03 Typical Application Domains
CSOP ceramic tubes are commonly used in the following application scenarios:
– Semiconductor manufacturing and testing equipment: Sensors and control modules for use in high-temperature, vacuum or clean environments, ensuring stable device performance.
– Industrial control and sensing systems: In complex environments such as those with temperature, humidity or vibration, they provide airtight protection and thermal stability, thereby extending the lifespan of the modules.
– Aerospace and high-reliability electronic equipment: Capable of withstanding temperature fluctuations, humidity changes and vibration shocks, ensuring the long-term reliability of critical components.
– Package for analog, power and dedicated function chips: Offers high stability and airtight protection, reduces temperature drift and noise, suitable for industrial, medical and research equipment.
In the aforementioned applications, the stability and long-term reliability of CSOP are usually more crucial than its size or the number of pins.

Relying on Innovacera’s mature ceramic molding and metallization processes, our CSOP package supports a variety of customization options: The size and number of pins can be customized according to customer requirements. The ceramic material can be either alumina or aluminum nitride. The metalization and surface coating schemes are flexible. The cover can be made of ceramic or metal for complete airtight protection.