News | INNOVACERA

Category Archives: News

BN Ceramics for PVD ALD and CVD Systems

Talking about the deposition techniques we have to mention Physical Vapor Deposition (PVD), Atomic Layer Deposition ( ALD) and Chemical Vapor Deposition (CVD) , which are fundamental in manufacturing high-precision components for semiconductors, electronics, aerospace industries even more. The versatility and properties of Boron Nitride (BN) ceramics make them become crucial components in PVD, ALD and CVD systems. Here I like to talk about the role of BN ceramics in these systems.

Boron Nitride ceramics are composed of boron and nitrogen atoms arranged in a lattice structure. They can exist in hexagonal (HBN), which is the most commonly used form due to its similarity to graphite, making it an excellent lubricant and insulator. Cubic BN, on the other hand, is known for its hardness, approaching that of diamond.

BN Ceramics in PVD Systems
PVD systems are used to deposit thin films through the physical vaporization of material. BN ceramics play a vital role in PVD systems primarily due to their low thermal expansion, chemical resistance, and outstanding electrical insulation.

Low Thermal Expansion: In PVD systems, high temperatures are often required to vaporize materials. BN ceramics shows outstanding thermal stability, allowing them to withstand these high temperatures max about 1800 degree in high vacuum and 2100 degree in in active gas environment without degradation. This property is particularly valuable in maintaining the integrity of the deposition chamber and other components exposed to extreme conditions.

Chemical Resistance: The reactive nature of certain PVD processes can lead to chemical interactions with chamber components. BN ceramics are highly resistant to extreme corrosion and wear, guaranteeing the deposition system remains uncontaminated and operational for longer periods.

Electrical Insulation: BN ceramics is an excellent electrical insulation. It can prevent unneeded electrical discharges during the PVD process. This insulation helps maintain the accuracy and consistency of the deposition process.

BN Ceramics in ALD Systems
ALD is a technique used to deposit thin, conformal films one atomic layer at a time. BN ceramics contribute significantly to the performance and reliability of ALD systems with their low reactivity and stability,help prevent contamination of the film and ensure uniform deposition across complex geometries.

The smooth and clean surface of BN ceramics help minimize particle contamination and defects, which is critical for producing high-quality films in ALD processes. Their non-wetting nature also prevents unwanted interactions with the precursors used in ALD.

BN Ceramics in CVD Systems
CVD involves the chemical reaction of gaseous precursors to form thin films. BN ceramics are integral to CVD systems for their non-reactivity and corrosion resistance that enhance process efficiency and longevity.

CVD processes often involve aggressive gases that can cause corrosion and reaction. BN ceramics exhibit exceptional resistance to these corrosive gases and do not react with them, protecting system components and contamination, extending their lifespan.

Boron Nitride ceramics are very important in enhancing the performance and reliability of PVD, ALD, and CVD systems. Their low thermal expansion, exceptional thermal stability, chemical resistance and outstanding electrical insulation, make them ideal for high-precision deposition processes.

BN material application – ultra high temperature plasma technology

This paper, which focuses on plasma technology and waste treatment, covers the field of environmental protection and a brief introduction to related ceramic materials.

With the growing population as well as the economic development makes the production of solid waste increase rapidly.

Therefore, how to deal with these wastes into useful materials is a major project in favor of human development.

Numerous researchers have devoted themselves to the in-depth study of environmentally friendly solid waste treatment technologies, and have developed a series of mature technological ideas, such as photochemical oxidation technology, pyrolysis technology and thermal plasma gasification technology, etc. Among them, thermal plasma can be used for the treatment of solid wastes. Among them, thermal plasma treatment of solid waste has the advantages of high temperature (103-104 K), high enthalpy, high reactivity, good controllability, etc., which opens up a new way for the harmlessness, minimization and resource treatment of solid waste.

Plasma is the fourth state of matter consisting of electrons, ions and neutral particles, and in the treatment of solid waste, the treatment of solid waste utilizes the properties of high temperature, high energy and high enthalpy of plasma. Plasma torch is one of the energy sources to make the waste gasification, the discharge between the electrodes will gas medium ionization, resulting in a high-temperature arc, high-temperature arc heating flow through the gaseous medium, thus generating a high temperature, ionization and conductivity of the plasma, the plasma flame temperature is generally in the 4,000-7,000 ℃, the highest up to tens of thousands of degrees, which for the pyrolysis of solid wastes into simple atoms This provides the energy required for the pyrolysis of solid waste into simple atoms. At high temperatures, the inorganic components of solid waste melt and solidify through rapid cooling to form glass, which can be used as building materials. The organic components are decomposed into syngas (the main components are CO and H2), which can be burned directly or used as a high-quality fuel and in the chemical synthesis industry. During the gasification process, the plasma heats up the syngas to a high temperature of 1200-1300 ℃, which can completely decompose the complex organic substances into small, simple molecules and avoid the production of toxic substances such as dioxins and furans. The production of toxic substances such as dioxins and furans is avoided.

One of the ceramic materials involved is BN, which is resistant to high temperatures and corrosion, and is currently used in ultra-high-temperature plasma gasification technology, where BN is used in the plasma torch.

Involving the issue of technical confidentiality, this will not be elaborated in detail.
However, it can be seen that BN can be used in plasma technology, in the treatment of wastewater, waste and other environmental protection areas.

The following diagram shows the working principle of the plasma torch:

a)Low power transfer are plasma torch[; (b) non-transfer arc and (c) transfer arc plasma reactor

*Plasma technical analysis reprinted from 【ACTA PHYSICA SINIC】

The following picture is for reference, welcome to customize.
Any more further detail, please contact:sales@innovacera.com.

Vacuum brazing of ceramics and metals

The general process of brazing ceramics and metals can be divided into seven processes: surface cleaning, paste coating, ceramic surface metallization, nickel plating, brazing and post-weld inspection.

Surface cleaning is to remove oil, sweat and oxide film on the surface of the base material. Metal parts and brazing materials are first degreased, then pickled or alkaline washed to remove the oxide film, rinsed with running water and dried. Parts with high requirements should be heat treated in a vacuum furnace or hydrogen furnace (or ion bombardment method) at an appropriate temperature and time to purify the surface of the parts. After cleaning, the parts must not come into contact with oily objects or bare hands, and should immediately enter the next process or be placed in a dryer. They cannot be exposed to the air for a long time. Ceramic parts should be cleaned with acetone and ultrasound, then rinsed with running water, and finally boiled with deionized water twice, each time for 15 minutes.

Direct brazing

When brazing directly (active metal method), the surface of the ceramic and metal parts to be welded should be cleaned first, and then assembled. To avoid cracks in component materials due to different thermal expansion coefficients, a buffer layer (one or more metal sheets) can be rotated between welds. The brazing material should be sandwiched between the two welded parts as much as possible or placed in a position where the gap is filled with brazing material, and then brazing should be performed like ordinary vacuum brazing.

(1)When using Ag-Cu-Ti brazing material for direct brazing, vacuum brazing should be used. When the vacuum degree in the furnace reaches 2.7×10-3Pa, heating begins, and the temperature can be increased rapidly at this time; when the temperature approaches the melting point of the brazing material, the temperature should be increased slowly so that the temperature of each part of the weldment tends to be consistent; when the brazing material melts, the temperature is quickly increased to the brazing temperature, and the insulation time is 3 to 5 minutes; when cooling, the temperature should be slowly reduced before 700℃, and it can be naturally cooled with the furnace after 700℃.

(2)When directly brazing Ti-Cu active brazing material, the brazing material can be in the form of Cu foil plus Ti powder or Cu parts plus Ti foil, or Ti powder can be coated on the ceramic surface and then Cu foil. All metal parts must be vacuum degassed before brazing. The degassing temperature of oxygen-free copper is 750-800℃. Ti, Nb, Ta, etc. require degassing at 900℃ for 15min. At this time, the vacuum degree should not be less than 6.7×10-3Pa. During brazing, the components to be welded are assembled in the fixture and heated to 900-1120℃ in a vacuum furnace for 2-5min. During the entire brazing process, the vacuum degree must not be less than 6.7×10-3Pa.

(3)The brazing process of the Ti-Ni method is similar to that of the Ti-Cu method, and the brazing temperature is 900±10℃.

In addition to surface quality inspection, the welded parts after brazing should also be subjected to thermal shock and mechanical property inspections. The sealing parts used for vacuum devices must also be leak tested in accordance with relevant regulations.

If you have ceramic-to-metal sealing parts, please feel free to contact us.

What’s the function of Electron Gun?

Electron beam (EB) accelerator is an advanced devices that utilize electromagnetic fields to accelerate high-energy electrons to the approximate speed of light. These accelerated electron beams are used in a variety of industrial and scientific applications, including materials processing, sterilization, medical radiation therapy, and scientific research. EB accelerators consist of an electron gun that emits the electrons, a series of electromagnetic components (e.g., oscillating chambers and magnets) that accelerate and focus the electrons, and a target or beam exit that directs the high-energy beam of electrons to its intended destination.

Electron Guns are devices that emit electrons using thermal energy or field emission mechanisms, such as tunnelling or Schottky effects, for applications like X-ray chemical analysis and electron backscatter diffraction. In electron beams, electron guns are used to accelerate charged particles. It mainly made of cathode, focusing pole, anode composition.

The cathode is one of the key components of the electron gun, which determines the launch capability and life of the electron gun. At present, the cathode of the electron gun used in the electron linear accelerators in the world is in various forms, which can be summarized in two ways of division:

Direct thermal cathode mostly adopts pure tungsten as cathode material, and the heating current passes through the cathode directly. Interthermal cathode is generally used to lay thoriated tungsten, lay oxide, scandium salt, lanthanum boride, which is divided into bombardment type and heating type.

The whole electron gun are metal-ceramic brazing assembled, which has good insulation, airtightness and firmness, and the ceramic surface is specially treated to prevent high-voltage creepage ignition.

Innovacera has rich experience in metal-ceramic brazing and introduced advanced technical talents. The main materials are 95%~99.5% alumina ceramics, metals such as stainless steel, Kovar, chrome-nickel alloys, etc., the solder used for soldering is silver-copper alloy, pure silver, pure gold and other materials according to the customer’s working condition. The gas tightness of the assembled parts is tested with helium leak detector at 1*10-8~-11 Pa-m3/s.

Come to get more detailed information with your designed drawing!

High Vacuum Ionization Gauges Explained: The Role of Glass to Metal Seals in Precision Measurement

In industries and research fields where maintaining a precise vacuum is crucial, the High Vacuum Ionization Gauge emerges as an indispensable tool. This sophisticated device is designed to measure the vacuum degree within a chamber by leveraging the ionization of gas molecules. Innovacera, a leading manufacturer in advanced ceramic products, produces high vacuum ionization gauges that are essential for laboratories, industrial applications, and scientific research.

How Does a High Vacuum Ionization Gauge Work?
At its core, a High Vacuum Ionization Gauge functions by ionizing gas molecules within a specialized chamber. The process begins when gas molecules enter the ionization chamber and are subjected to ionization methods such as heated wires or electron beams. This ionization process generates positive ions and free electrons. The positive ions are then attracted to an electron collector, while the free electrons create an electric current.

Interpreting the Measurements
The magnitude of the current produced in the ionization chamber is directly related to the density of the gas molecules, which in turn reflects the vacuum level. Generally, a higher current indicates a lower vacuum degree (higher pressure), while a lower current suggests a higher vacuum degree (lower pressure). This precise measurement is vital for applications where maintaining a specific vacuum level is crucial to the success of the process.

Versatility in Measuring Range
High vacuum ionization gauges are versatile instruments capable of measuring a wide range of pressures. For low-pressure environments, a larger ionization chamber and higher voltage are utilized, while high-pressure measurements require a smaller ionization chamber and lower voltage. This adaptability makes these gauges suitable for various vacuum conditions, ensuring accurate and reliable readings across different applications.

The Importance of Glass to Metal Seals
One of the critical components in a high vacuum ionization gauge is the Glass to Metal seal. These seals play a vital role in maintaining the vacuum integrity of the gauge by creating airtight connections between different parts, such as the ionization chamber and the electron collector.

Advantages of Glass to Metal Seals
Airtight Connection: Ensures that no external gases can enter the vacuum chamber, maintaining the accuracy of the measurements.

Durability: These seals are designed to withstand extreme conditions, including high temperatures and pressures, which are common in vacuum systems.

Electrical Insulation: The glass component provides excellent electrical insulation, preventing any leakage and ensuring reliable operation.

Metallization: Enhancing Gauge Performance
Metallization is a key process used in the construction of high vacuum ionization gauges, particularly in the formation of glass to metal seals. Metallization involves applying a metal coating to ceramic or glass surfaces, which allows these materials to be bonded with metal components. This process is crucial in ensuring the strength and durability of the seals, contributing to the overall performance and longevity of the gauge.

Benefits of Metallization
Strong Bonding: Metallization creates a robust bond between glass and metal, ensuring that the seal remains intact even under challenging conditions.

Enhanced Durability: The metallized surfaces are better able to withstand the thermal and mechanical stresses encountered in high vacuum environments.

Improved Reliability: By enhancing the integrity of the glass to metal seals, metallization ensures that the high vacuum ionization gauge operates reliably over extended periods.

The High Vacuum Ionization Gauge is an essential instrument in industries and research fields where precise vacuum measurement is critical. By understanding how these gauges operate, the importance of Glass to Metal seals, and the role of Metallization in their construction, professionals can better appreciate the value these tools bring to their work. As technology continues to advance, the demand for accurate and reliable vacuum measurement will only grow, making high vacuum ionization gauges an ever-more vital component in modern manufacturing and research environments.

Aluminum Nitride Wafer Substrates: The Foundation for Semiconductors Manufacturing

Aluminum Nitride Wafer Substrates are a crucial component in the semiconductor industry, known for their exceptional thermal and electrical properties. Aluminum Nitride (AIN) materials have gained prominence due to their compatibility with silicon, making them ideal for a variety of wafer-related applications.

The Importance of Aluminum Nitride Wafer Substrates
Aluminum Nitride Wafer Substrates play an essential role in the semiconductor industry. One of the key reasons for their popularity is their thermal profile, which closely matches that of silicon. This similarity makes AIN substrates an excellent choice for semiconductor applications where thermal management is critical. Innovacera, a leading provider of these substrates, offers Aluminum Nitride Wafer Substrates in various diameters, ranging from 2 inches to 8 inches, with the 6-inch and 8-inch sizes being the most commonly used.

Key Features of Aluminum Nitride (AIN)
Aluminum Nitride (AIN) stands out due to its impressive properties, which make it highly suitable for advanced semiconductor applications. Some of the most notable features include:

High Thermal Conductivity: AIN boasts a thermal conductivity range of 170-220 W/mK, which is crucial for dissipating heat in high-performance semiconductor devices.

High Electrical Insulation: The material’s excellent electrical insulation properties make it ideal for use in electronic components that require isolation from electrical interference.

Low Dielectric Constant: With a low dielectric constant, AIN substrates ensure minimal signal distortion, which is vital for maintaining the integrity of high-frequency signals in electronic circuits.

Mechanical Strength and Stability: AIN offers superior mechanical strength and stability, making it resistant to wear and deformation. This ensures the longevity and reliability of devices built on these substrates.

Corrosion Resistance: Aluminum Nitride demonstrates excellent resistance to corrosion, particularly against molten metals, enhancing its durability in harsh environments.

Chemical and Thermal Stability: The chemical and thermal stability of AIN substrates makes them reliable under extreme conditions, preventing degradation over time.

Applications in the Semiconductor Industry
The unique properties of Aluminum Nitride Wafer Substrates make them highly sought after in various semiconductor applications. These substrates are particularly valued in:

Power Electronics: The high thermal conductivity and electrical insulation of AIN substrates are crucial in power electronic devices, where efficient heat dissipation and electrical isolation are required.

RF and Microwave Devices: AIN’s low dielectric constant and excellent thermal properties make it an ideal choice for RF (Radio Frequency) and microwave devices, where signal integrity and thermal management are paramount.

LED Manufacturing: In LED applications, AIN substrates help manage the significant heat generated, thereby enhancing the longevity and performance of the LEDs.

Wafer Bonding Technology: Innovacera’s AIN wafers, with their polished surfaces (Ra ≤ 0.05 µm), meet the stringent requirements of direct wafer bonding technology. This process, which bonds semiconductor wafers without adhesives, demands extremely flat and smooth surfaces, and AIN substrates deliver on these fronts.

Aluminum Nitride Wafer Substrates are indispensable in the modern semiconductor industry, offering a combination of thermal conductivity, electrical insulation, and mechanical strength that few materials can match. Innovacera’s range of Aluminum Nitride (AIN) wafers, available in various sizes and customized options, provide the reliability and performance necessary for high-demand applications. As the semiconductor industry continues to advance, the role of AIN substrates will only become more critical, ensuring that devices remain efficient, durable, and capable of meeting the ever-growing demands of technology.

Choosing Aluminum Nitride Wafer Substrates can significantly enhance the performance and longevity of semiconductor devices, making them an excellent investment for any high-tech application.

Revolutionizing Gas Ignition: The Rise of Hot Surface Ignition Technology

In recent years, the landscape of gas ignition technology has seen a transformative shift, particularly in China and the global market. While high-frequency ignition systems have long been the standard in Chinese households and industries, a growing trend towards hot surface ignition systems is reshaping the sector abroad. This innovative approach to ignition brings a multitude of benefits, offering a safer, more efficient, and reliable alternative to traditional methods.

The Drawbacks of High-Frequency Ignition
High-frequency ignition, though widely used, has several notable drawbacks that have become increasingly apparent. These include:

1.Noise Pollution: The high-pitched sound generated during ignition can be disruptive, particularly in residential settings.

2.Unsafe Deflagration: High-frequency ignition can lead to deflagration, where gas combusts explosively, posing safety risks.

3.Poor Ignition Reliability: The system’s dependency on precise conditions can result in inconsistent ignition performance.

4.Electromagnetic Interference: High-frequency signals can interfere with nearby automatic control equipment, leading to malfunctions.

These issues have spurred the demand for more advanced ignition solutions, and the international market has responded by adopting hot surface ignition technology.

The Emergence of Hot Surface Ignition
Hot surface ignition technology is rapidly gaining traction for its ability to address the shortcomings of high-frequency ignition. This method utilizes a heated element to ignite gas, thereby eliminating many of the risks associated with traditional ignition systems. Hot surface ignition offers:

Silent Operation: By reducing noise pollution, it enhances user comfort, especially in household environments.

Enhanced Safety: The controlled ignition process significantly reduces the risk of deflagration.

Increased Reliability: Hot surface ignition provides consistent performance across a variety of conditions.

No Electromagnetic Interference: Its operation does not affect other electronic devices, making it ideal for modern homes and industries.

The Role of SiC and Si3N4 Ceramics
Silicon Carbide (SiC) ceramic hot surface igniters have been a staple in the U.S. and EU markets for over 25 years. These igniters are commonly used in commercial and household gas devices, such as air conditioners and heaters. However, SiC igniters are not without their limitations:

Decentralization of Hot Area: The uneven distribution of heat can lead to inefficiencies.

Fragility: SiC igniters are prone to breakage, reducing their lifespan and reliability.

Enter Innovacera’s Si3N4 Igniters, which offer a groundbreaking solution. Innovacera’s silicon nitride igniters provide several advantages over traditional SiC igniters, revolutionizing the field of gas ignition.

Innovacera’s Si3N4 Igniters: A New Era in Ignition Technology
Innovacera has developed Si3N4 igniters that overcome the limitations of both high-frequency and SiC igniters. The features of these advanced igniters include:

100% Reliable Ignition: Innovacera’s igniters deliver consistent ignition performance, ensuring reliable operation in all conditions.

No Interference: The design eliminates any electromagnetic interference, making them compatible with modern electronic systems.

No Gas Leakage: The precision engineering of the igniters prevents gas leakage, enhancing safety.

High Mechanical Strength: These igniters are built to withstand mechanical stress, reducing the risk of damage.

Humidity and Thermal Shock Resistance: The igniters are designed to function effectively in humid environments and withstand sudden temperature changes.

No Special Controller Required: They are user-friendly and easy to integrate into existing systems.

Complete Replacement of SiC: Innovacera’s Si3N4 igniters match the installation modes and thermal electrical characteristics of SiC igniters, allowing for seamless upgrades.

Diverse Applications Across Industries
The versatility of Innovacera’s Si3N4 igniters opens the door to a wide range of applications, both commercial and residential. They are suitable for use in:

Gas Air Conditioners: Ensuring efficient and reliable ignition for optimal cooling performance.

Gas Air Heaters: Providing consistent warmth in residential and industrial settings.

Dryers: Enhancing the safety and efficiency of gas-powered drying appliances.

Cooking Appliances: From ranges to cooktops, these igniters ensure precise and reliable ignition for culinary applications.

Pool and Water Heaters: Offering dependable ignition for heating solutions in various environments.

Pyrotechnic Effects: Enabling safe ignition for fireworks and other pyrotechnic displays.

Mosquito Traps: Powering traps with reliable ignition for effective pest control.

As the demand for safer, more efficient ignition systems continues to grow, hot surface ignition technology stands at the forefront of innovation. Innovacera’s Si3N4 igniters represent a significant advancement in the field, providing a reliable, versatile, and user-friendly solution to meet the evolving needs of modern households and industries. With their wide range of applications and superior performance, these igniters are poised to become the new standard in gas ignition technology, paving the way for a more secure and efficient future. For more information please contact with us.

12 Years’ Anniversary

August 9th is a special and happy day for all of the Innovacera’s member. As she is celebrating her 12 years’ anniversary on Aug. 9th 2024. At this special day, she is expressing her appreciation to all of the staff’s dedication by offering a red packet and a big party to every member. At the same time, for members with 10 and 5 years in company, Innovacera awards a gold ring to them as a memorial.

Here is the first part of party, giving every member with red packer and 5 years & 10 years staff with gifts.

At the same time we sing a Happy Birthday song to INNOVACERA.

After enjoying the cake and delicious food, we welcome our second part game time, which is full of funny and laughter. It leaves a good memory to all of the staff. We are so deeply enjoying in the game and do not have time to take more photos for this happy time.

Do you think it is over? No, absolutely no, we have a more happy time, the evening party. So busy with fancy dinner and forget to take some photos of Gourmet feast .

OK, that’s for this year’s anniversary. More let’s wait for next year. From here, I think you must be very interested with our story.

Let’s have a brief overview about the history of Innovacera.

Established in Aug.2012 China, Xiamen Innovacera advanced Materials Co., LTD (INNOVACERA) aims to be reliable a supplier of advanced ceramic components. She engages in research and development , manufacturing and selling the products of technical ceramic materials including Aluminum Oxide (Al2O3), Zirconium Oxide (Zirconia), Aluminum Nitride (ALN), Boron Nitride (BN), Silicon nitride, machinable glass ceramic (MGC) and other advanced materials.

Before she had Invested ZHONGDA, in Metallization Ceramics Process and Ceramic Components in year 2011. In 2015, INNOVACERA invested XMCERA, focus on manufacturing of high precision machining and ultral polishing Process. In year 2016, she becomes a shareholder of GreenWay, who is focus in Ceramic Heating Element.
For Innovacera, its mission is “winning with our customers and employees”.

Introduction to Ceramic Resistor Cores: The Building Blocks of Modern Devices

In the vast landscape of electronic components, ceramic resistor cores stand as pillars of reliability and performance. These advanced ceramic structures, crafted from premium materials like 99.5 Alumina and 95 Alumina, are the backbone of numerous electronic devices, ensuring precision, durability, and efficiency. Today, let’s delve into the world of Ceramic Resistor Cores, exploring their unique features, applications, and why they’re a game-changer in the electronics industry.

The Essence of Ceramic Resistor Cores
Ceramic resistor cores, affectionately known as ceramic resistor bodies, are the heart of fixed resistors. Crafted from high-purity alumina (Al2O3) in either 99.5% or 95% purity, these cores boast unparalleled surface quality and consistency. Their cylindrical shape and robust construction make them ideal for efficient heat dissipation, thanks to their exceptional thermal conductivity. This not only enhances the reliability of the resistors but also elevates their overall performance, ensuring a smooth and stable flow of electricity.

Features That Set Alumina Ceramic Cores Apart
Lower Noise Factor: Alumina ceramic cores minimize electrical noise, ensuring cleaner signals and improved audio/video quality in electronic devices.

Stable Resistance: Their resistance values remain consistent over time and across varying temperatures, making them reliable in demanding applications.

Good Electrical Shock Loads: Capable of withstanding sudden electrical surges, these cores protect circuits from damage, enhancing overall system safety.

Laser Trimming Reliability: Precision laser trimming techniques can be applied to alumina ceramic cores, allowing for fine-tuning of resistance values with utmost accuracy.

Electrical Insulation & Thermal Stability: Excellent insulation properties and resistance to thermal fluctuations ensure reliable operation in harsh environments.

Higher Integration Density: Alumina ceramic cores enable the creation of compact, high-density electronic circuits, ideal for space-constrained designs.

Higher Power Density: Their ability to handle higher power loads without overheating makes them ideal for high-performance applications.

Applications Galore
Ceramic resistor cores find their way into a myriad of industries, transforming the way we live and work. From the humble household appliances that keep our homes running smoothly to the sophisticated automobiles that take us on adventures, these cores are everywhere. They’re also crucial in electronic consumer goods, where precision and reliability are paramount. In the burgeoning new energy sector, ceramic resistors play a vital role in managing power flow and ensuring the safety of renewable energy systems.

Specifically designed for coated ceramics in fixed resistors, our ceramic resistor cores are indispensable in producing membrane pressure caps and various membrane resistors. These components are essential for maintaining precise electrical control in a wide range of electronic circuits and surface-mounted devices.

Ceramic resistor cores, crafted from premium 99.5 Alumina and 95 Alumina, are the unsung heroes of the electronics industry. Their unique blend of features, including low noise, stable resistance, and exceptional thermal stability, make them indispensable in a wide array of applications. Whether it’s ensuring the smooth operation of your refrigerator or powering the latest electric vehicle, ceramic resistor cores are quietly working behind the scenes, driving innovation and reliability forward. As the world continues to embrace technology, the importance of these advanced ceramic structures will only grow, solidifying their place as a cornerstone of modern electronics.

Boron nitride crucible application-electron beam evaporation

In semiconductor manufacturing, boron nitride can be used as an etching agent and thin film deposition raw material, acting as a protective layer to prevent damage or contamination of the device.

In addition, boron nitride can also be used as an electron beam evaporation source material for the preparation of various thin film materials.

For example: Electron beam evaporation coating conductive boron nitride crucible (BN crucible) – for thin film deposition equipment.

Conductive boron nitride crucibles are high-purity smooth crucibles designed for electron beam evaporation coatings.

It has excellent high-temperature resistance and thermal cycling properties, and will not react with various metals and ceramic rare earths.

Even under rapid heating and cooling conditions, the crucible remains intact.

It can be used for alloy melting, rare earth and ceramic sintering, and electron beam evaporation coatings.

It is commonly used in thermal evaporation processes such as high-frequency induction heating, coatings, electron beam evaporation coatings, aluminum, and silicon plating.

Conductive boron nitride crucibles offer high purity, high finish, and excellent electron beam evaporation coating properties.

They increase evaporation rates, accelerate material changeovers, improve thermal stability, and reduce power requirements, ultimately increasing productivity and cost-effectiveness.

Advantages:

good film finish, high purity, less pollution, long service life.

1.Excellent resistance to high temperatures and heat cycling.

It has a low rate of thermal expansion and is resistant to wetting of most molten metals.

2.Heat-resistant up to 2000°C, boron nitride does not react with aluminum and is not volatile.

3.increase evaporation rate; Increasing the evaporation rate results in shorter cycle times and higher overall yields.

4.Rapid material change; Conductive boron nitride crucibles facilitate rapid material changes, minimize furnace chamber downtime, and improve process efficiency.

5.enhanced thermal stability; These crucibles have higher thermal stability, reducing heat transfer from the crucible itself, ensuring consistent and controllable evaporation.

Main ingredients: BN+TiB2

Density 3.0g/cm3

Binding composition: B2O3

Color: Grey

Room temperature resistivity: 300-2000 Ω·cm

Operating temperature: below 1800℃

Thermal conductivity: > 40W/mk

Coefficient of thermal expansion: (4-6) x10-6K

Bending strength: > 130Mpa

Evaporation rate: 0.35-0.5g/min·cm2

TOP