Innovacera's Ceramic Leadless Chip Carriers (CLCC) provide hermetic packaging for high-reliability integrated circuits, especially in aerospace and defense applications. Fabricated from alumina with tungsten metallization, these packages feature cavity-up or cavity-down designs with brazed seal rings. They offer excellent thermal dissipation and minimal parasitic capacitance for high-frequency operation. Innovacera delivers CLCC packages with gold-plated pads for eutectic or solder attachment.