Direct Plated Copper (DPC) Ceramic Substrate

DPC is a newest development in the field of Ceramic Substrate PCBs, by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness’ ranging from 10um to 130um, and then photolithography to form circuit patterns, electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderability and oxidation resistance of the substrate is improved through surface treatment, finally remove the dry film, and etch the seed layer to complete the substrate.

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Features

1. High thermal stability and excellent electrical conductivity
2. Excellent mechanical stability, good adhesion
3. High operating temperatures
4. Excellent electrical insulation
5. Good heat spreading

Application:

1.Cells for Solar Concentrator
2.Hybrid and Electric Automobile
3.Power Management Electronics
3.Sensor in Automotive Motor Control
5.High Power LED
6.Laser System
7.Semiconductor Modules: Such as IGBT
8.Microwave Devices
9.Packages for RF
10.Power Semiconductor Packaging

Ceramic Materials Properties:

Item	Unit	Alumina	ALN
Content	%	96% Al2O3	-
Density	g/cm3	≥3.7	≥3.3
Thermal Conductivity	W/m·K	>24	>170
Coefficient of Thermal Expansion	10⁻⁶/K	6.5–7.5 (20–300℃)	4.6 (20–300℃)
Flexural Strength	MPa	>350	>350
Dielectric Loss	×10⁻⁴ (1MHz)	3	3.8
Dielectric Constant	1MHz	9.8	9
Dielectric Strength	kV/mm	14.5	17
Volume Resistivity	Ω·cm	>10¹⁴	>10¹⁴
Young's Modulus of Elasticity	GPa	340	320

Capability:

Item	Description	Capability
Material	-	Al2O3 / AlN
Ceramic Thickness	-	0.38–1.0mm
Copper Thickness (When Distance Between Copper)	<0.2mm	10–50μm
	0.2–0.5mm	30–80μm
	0.6–1.0mm	30–150μm
	<0.075mm	30–60μm
Copper Width (When Copper Thickness)	<35μm	≥0.075mm
	35–100μm	≥0.10mm
	≥100μm	≥0.15mm
Ag Thickness	-	≥0.4μm
Surface Treatment	NiAu / NiPdAu	Ni: 5 ± 2.5μm Pd: >0.05μm Au: >0.05μm

Declaration: This is an original article of INNOVACERA®. Please indicate the source link when reprinting: https://www.innovacera.com/product/dpc-ceramic-substrate

Frequently Asked Questions

What is a Direct Plated Copper (DPC) Ceramic Substrate? What are its main applications?

A Direct Plated Copper (DPC) Ceramic Substrate is an advanced PCB that utilizes magnetron sputtering and electroplating technologies to deposit a highly precise copper circuit layer onto a ceramic base. Featuring high thermal stability and excellent electrical insulation, it is widely used in demanding thermal management fields, including Hybrid and Electric Automobiles, High Power LEDs, Semiconductor Modules (such as IGBT), and RF/Microwave Devices.

How to choose between Alumina and AlN materials? What is the copper thickness capability?

The choice depends on your project’s heat dissipation requirements. Alumina (96% Al2O3) offers excellent mechanical stability with a thermal conductivity of >24 W/m·K, making it a cost-effective choice for general power electronics. Aluminum Nitride (AlN) delivers superior thermal conductivity (>170 W/m·K), which is ideal for extreme high-power applications like laser systems. For both materials, the copper thickness capability ranges from 10μm to 150μm depending on the copper trace distance, fully supporting highly customized circuit designs.