Features
1. High thermal stability and excellent electrical conductivity
2. Excellent mechanical stability, good adhesion
3. High operating temperatures
4. Excellent electrical insulation
5. Good heat spreading
Application:
1.Cells for Solar Concentrator
2.Hybrid and Electric Automobile
3.Power Management Electronics
3.Sensor in Automotive Motor Control
5.High Power LED
6.Laser System
7.Semiconductor Modules: Such as IGBT
8.Microwave Devices
9.Packages for RF
10.Power Semiconductor Packaging
Ceramic Materials Properties:
| Item | Unit | Alumina | ALN |
| Content | % | 96% Al2O3 | – |
| Density | g/cm3 | ≥3.7 | ≥3.3 |
| Thermal Conductivity | W/m·K | >24 | >170 |
| Coefficient of Thermal Expansion | 10⁻⁶/K | 6.5–7.5 (20–300℃) | 4.6 (20–300℃) |
| Flexural Strength | MPa | >350 | >350 |
| Dielectric Loss | ×10⁻⁴ (1MHz) | 3 | 3.8 |
| Dielectric Constant | 1MHz | 9.8 | 9 |
| Dielectric Strength | kV/mm | 14.5 | 17 |
| Volume Resistivity | Ω·cm | >1014 | >1014 |
| Young’s Modulus of Elasticity | GPa | 340 | 320 |
Capability:
| Item | Description | Capability |
| Material | – | Al2O3 / AlN |
| Ceramic Thickness | – | 0.38–1.0mm |
| Copper Thickness (When Distance Between Copper) |
<0.2mm | 10–50μm |
| 0.2–0.5mm | 30–80μm | |
| 0.6–1.0mm | 30–150μm | |
| <0.075mm | 30–60μm | |
| Copper Width (When Copper Thickness) |
<35μm | ≥0.075mm |
| 35–100μm | ≥0.10mm | |
| ≥100μm | ≥0.15mm | |
| Ag Thickness | – | ≥0.4μm |
| Surface Treatment | NiAu / NiPdAu | Ni: 5 ± 2.5μm Pd: >0.05μm Au: >0.05μm |
Declaration: This is an original article of INNOVACERA®. Please indicate the source link when reprinting: https://www.innovacera.com/product/dpc-ceramic-substrate.
Enquiry