Ceramic Packages and Housings for Optoelectronic and MEMS Devices

Ceramic packages and housings are hermetic enclosures manufactured from high-purity alumina (Al₂O₃), aluminum nitride (AlN), and LTCC/HTCC materials, providing exceptional electrical insulation, thermal management, and environmental protection for sensitive optoelectronic and MEMS devices. These packages feature precisely controlled co-fired metalization patterns, feedthroughs, and sealing surfaces that enable reliable wire bonding, die attachment, and hermetic sealing. With thermal conductivity ranging from 24 W/m·K (alumina) to 170 W/m·K (AlN), ceramic packages significantly outperform plastic alternatives in high-power LED, laser diode, optical transceiver, and sensor applications. Innovacera's ceramic packaging solutions include standard and custom designs with integrated thermal vias, multi-layer metallization, and glass-sealed feedthroughs, meeting MIL-STD and Telcordia reliability requirements.