Participate in the Semicon Southeast Asia 2026 in Kuala Lumpur to explore the application trends of boron nitride, micro porous ceramics and alumina substrates, aluminum nitride substrates in power devices, electronic packaging and precision processing, and seize the innovation opportunities in the Asia-Pacific semiconductor industry.
About the Semicon Southeast Asia 2026
In 2026, Semicon Southeast Asia 2026 will witness its annual grand event – the Semiconductor Exhibition at the Kuala Lumpur International Convention Centre.This exhibition brings together the world’s leading suppliers to showcase the latest applications and technical cases of boron nitride, micro porous ceramics, alumina substrates, aluminum nitride substrates and precision machined parts.Next, we will comprehensively introduce the exhibition bright spot, key material trends and application cases, helping enterprises and engineers understand the latest developments of advanced semiconductor materials in the fields of power devices, electronic packaging and precision processing.Semicon Southeast Asia 2026 bright spot and information
- Time and Place: May 5-7, 2026, Kuala Lumpur International Convention Centre
- Exhibition participating companies and products: Covering local and international suppliers, with a focus on showcasing high-performance substrates, precision ceramic parts and power heat dissipation components and so on
| Item | Details |
|---|---|
| Year / Edition | 2026 / 31st Edition |
| Format | In-Person |
| Gross Area | > 24,000 sqm |
| Targeted Companies | > 500 International & Local Companies |
| Number of Booths | > 1,000 Booths |
| Expected Attendees | 15,000 – 20,000 |
| Show Hours | 9:00 – 17:00 |
| Expected Audiences’ Profile | Industry Leaders, Government Agencies, SMEs, Media |
Main material trends and application
Boron Nitride Advantages and Semiconductor Application
- High thermal conductivity and excellent electrical insulation
- Heat dissipation for power devices and intelligent packaging
- Exhibition cases: LED heat sinks, microelectronic packaging
Porous Ceramics For Microelectronic Packages
- High-temperature stability and lightweightHigh-density electronic packagingExhibition example: Heat dissipation structure of semiconductor modules
Alumina and Aluminium Nitride Substrates
Alumina: Moderate cost, suitable for conventional power devicesAluminum nitride: High thermal conductivity, dimensional stabilityExhibition Cases: Power Modules and Precision Packaging
Precision Machining Ceramic Components
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- Processing of complex micro-structures
- Semiconductor packaging, optoelectronic devices
- Application illustration of aluminum nitride substrate and precision ceramic parts
- The heat dissipation module of the power device adopts microporous ceramics and boron nitride.
The advantages of Malaysia’s semiconductor industry
- Asia-pacific semiconductor manufacturing base, Kuala Lumpur and Penang industrial parks
- Complete supply chain and policy support
- Display the practical application and demand of materials in the local industry
Contact us for further discussion
Our boron nitride, micro porous ceramics, alumina and aluminum nitride substrates , precision machined parts have been widely applied in Asia, Europe and the United States. Application fields: Heat dissipation of power devices, microelectronic packaging, and processing of complex and fine structures.The materials displayed at this exhibition are only some of the cases. For enterprises that need high-performance heat dissipation, precise packaging and customized substrates, we welcome you to contact us for more professional advice or visit our booth L2 2591 for further discussion.
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