Direct Plated Copper Substrate
Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness’ ranging from 10um to 130um, and then photolithography to form circuit patterns. electroplating is used to fill in the gaps and thicken the metal circuit layer, and the solderability and oxidation resistance of the substrate is improved through surface treatment, finally remove the dry film and etch the seed layer to complete the substrate.