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Innovacera is on attending the foreign exhibition

Innovacera a leading supplier of advanced ceramic components and solutions for the semiconductor and electronics industry, is excited to announce its participation in a foreign exhibition, one of the important events in the semiconductor and microelectronics industry.

Innovacera is showcasing its latest advancements in technical ceramic solutions in the semiconductor industry. Attendees can visit us at Booth 3928, where we are presenting:

Ceramic to Metal Sealing Product: Including the metalized ceramics, AMB, DPC, and DBC substrates which are widely used for electrical packaging processes, high-power semiconductor packaging, semiconductor cooling, and UPS uninterruptible power supply, photovoltaics, high-speed railway, new energy vehicle, high voltage network, and communication.

Boron Nitride components: essential for various high-tech applications, including electrode insulation for vacuum high-temperature equipment, PVD/CVD vacuum coating equipment insulation accessories, ion coating machines, sputtering coating, semiconductor MOCVD equipment for insulation and heat dissipation, ion implanter insulation accessories, PBN VGF crucibles, LEC crucibles, MBE crucibles, and PBN ceramic boats. These BN ceramics offer significant advantages such as high-temperature resistance up to 2000℃, thermal shock resistance, high electrical breakdown strength (3-4 times that of alumina), and superior carbon atmosphere corrosion resistance compared to alumina. Additionally, they exhibit large resistance, high-temperature resistance, high electrical breakdown resistance, no pollution, corrosion resistance, and machinability, making them ideal for demanding industrial environments.

High Purity Alumina Ceramic Part: Such as alumina polishing plates and turn tables which are polished surfaces and high precision flatness, high rigidity, high chemical durability, and ultra-large size are some of our advantages.

INNOVACERA ATTEND THE SEMICON SEA 2024 EXHIBITION

Engineered technical ceramics are widely used in the semiconductor manufacturing process due to their high-temperature stability, electrical insulation, corrosion resistance, and excellent mechanical properties. INNOVACERA ultra-pure ceramics are used in the whole-cycle semiconductor manufacturing process including wafer manufacturing, device manufacturing, and packaging.

As the semiconductor industry continues to evolve rapidly, the exhibition provides an essential chance for industry stakeholders to stay ahead of technological advancements and market trends. Whether you’re an industry veteran or a newcomer, the event offers unparalleled opportunities to gain insights, network with peers, and explore the future of the semiconductor landscape. This event is essential for driving the growth and development of the semiconductor ecosystem.

For more information about Innovacera products and exhibitions arranged, welcome to contact us at sales@innovacera.com.

Boron Nitride Ceramic Revolutionizing PVD Coating Technology

Boron Nitride ceramic (BN) with various applications, stands out as a versatile and high-performance compound in advanced materials. From its low thermal expansion excellent heat resistance outstanding electrical insulation and high wet resistance to molten metals, boron nitride has found its way into various industries, including electronics, high-temperature furnace construction, ceramic manufacturing, semiconductor industry, aerospace, and now the realm of Physical Vapor Deposition (PVD) coating technology.

PVD coating is a process used to produce thin films or coatings on various substrates by evaporating and condensing a material in a vacuum environment. This technique is widely employed in automotive and optics industries, where thin films of metals, ceramics, or other materials are deposited onto surfaces to enhance their properties such as wear resistance, corrosion resistance, or aesthetic appeal.

Boron Nitride Ceramic has emerged as a game-changer in the realm of PVD coating, offering several advantages over traditional coating materials:
High Thermal Stability
Chemical Inertness
Excellent Lubricating Properties
Uniform Coating Deposition

Enhanced Safety and Environmental Sustainability: Unlike some traditional coating materials that may pose health or environmental risks, BN ceramic is non-toxic and environmentally friendly. Its use in PVD coating machines contributes to safer working environments for operators and reduces the environmental impact of coating processes. Furthermore, the durability and longevity of BN ceramic components reduce the frequency of maintenance and replacement, further enhancing the sustainability of PVD coating operations.

Boron Nitride Ceramic represents a significant advancement in the field of PVD coating technology, offering unparalleled thermal stability, chemical inertness, lubricating properties, and coating uniformity. By using boron nitride ceramic components in PVD coating machines, manufacturers can enhance operational efficiency, improve coating quality, and ensure the safety and sustainability of their processes. As demand for high-performance thin films continues to grow across various industries, boron nitride ceramic is poised to play a pivotal role in shaping the future of PVD coating technology.

Metalized Terminal Bushing Ceramics

By applying Mo/Mn metallization on high-quality ceramic insulators, and doing the plating process, after applying metallization, Tin coating will be applied on the surface, it provides the more wettable ability for easy adhesion to a metal component by brazing or soldering.

This metalized terminal bushing can be widely used in ceramic to metal joining processes on the applications:

High-voltage vacuum devices

Semiconductor manufacturing devices

Electric power devices

Medical analysis devices

Space and nuclear power devices

Hermetically Sealed Terminal bushing or customized metalized ceramic, can be applied on ceramic-to-metal sealing along with brazing or soldering.

In most electric and electronic devices, high-frequency electromagnetic noise will be generated unavoidably, it degrades the quality of signal and power transmissions in critical operations. So EMI filter has been developed to mitigate the effect of electromagnetic noise on power and signal lines.

What are the EMI filters?

EMI filters are high-quality microwave frequency filters used in electronic devices. They aim to reduce electromagnetic interference (EMI) generated by any flux-inducing equipment or any other rational- sources including mobile phones, Wi-Fi routers or base stations, and other radio equipment. Its purpose is to prevent these noise signals from entering any device, preventing any damages caused by interference with sensitive circuitry inside the product. At the same time, it’s also helpful in protecting high-voltage equipment.

What’s the function of the terminal bushing?

The ceramic terminal bushing has good radiation resistance, high-frequency resistance, high voltage resistance, insulation, and other excellent electrical properties, this makes it an optimized material for High voltage applications. The metal layer will be applied on the ceramic surface to seal it with an EMI filter, so it can be adhesive to the metal.

INNOVACERA provides a series of terminal bushings and custom metalized shapes, we provide our customer solutions to ceramic-to-metal solutions by applying metallization and via brazing/soldering operation.

Boron Nitride Ceramic Nozzle Metal atomization powder nozzle for 3D printing

In recent years, the rapid development of powder metallurgy (MIM) and 3D printing (AM) has gained more and more applications in producing complex parts. The raw material of metal 3D printing technology is a metal powder with high sphericity and narrow particle size distribution. This powder production method melts the metal alloy and leaks it through the boron nitride nozzle. At the nozzle outlet, high-pressure airflow is used to atomize the metal liquid, while cooling it into spherical particles.

The difference between 3D printing and injection molding is that 3D printing doesn’t require molds and is more conducive to the production of complex parts. At the same time, due to the lack of restrictions and auxiliary functions of molds, the production process relies more on the performance of printing equipment and powder raw materials. The bn nozzle is a key component that determines the quality of the finished product. Compared with traditional brass nozzles, boron nitride’s high-temperature resistance, thermal shock resistance, finishing ability and resistance to metal liquid corrosion enable it to withstand high thermal gradients and promote rapid solidification of metal. In addition, composite boron nitride ceramics with different formulas can provide various properties such as high-temperature durability, impact resistance, conductivity, and resistance, providing customers with customized solutions.

In summary, Boron Nitride’s stability, high-temperature resistance, and precision machining capabilities make it ideal for producing high-quality metal powders and achieving precise printing.

What’s the breakthrough on technology of Ceramic to Metal

The Molybdenum/Manganese metallization developed the technology on Ceramic-to-metal brazed assembly, it provides high mechanical strength and good electrical insulation. At the very beginning, it’s used in vacuum electronic devices, gradually applied to semiconductors, integrated circuits, electric light sources, high-energy physics, aerospace, chemical industry, metallurgy, instrumentation and machinery manufacturing and other industrial fields.

So how to choose a material become more and more critical for a good vacuum brazing. Here we’re mainly discussing about 3 different types of materials that will be used for ceramic-to-metal.

Ceramic

Al2O3
BeO
BN
AlN

Metala

Kovar alloy
OFC
Stainless steel
Mild steel

Solder

Ag
Ag-Cu
Cu
AU-Cu
Au-Ni

The Ceramic materials are required to be high-temperature stabilized and good thermal expansion of coefficient, INNOVACERA apply mostly the Al2O3. Since ceramics will not be directly wetted, which impedes the adherence of molten metal layers and adhesives, added that the different coefficients of thermal expansion (CTE) between Ceramic and Metal. Breakthrough on such difficulties is with a soldering or brazing process.

Metal layer applied on ceramic components via Mo/Mn metallization and Plating or Active brazing, after that, the ceramic and metal components are joined by the melting and subsequent solidification of a filler metal-Solder, with different solders for different applications in different working temperatures.

What’s the advantages of Ceramic-to-Metal?

Advanced ceramic materials has the excellent properties of high melting point, high temperature resistance, corrosion resistance, abrasion resistance and other special properties, but also has radiation resistance, high frequency resistance, high voltage resistance, insulation and other excellent electrical properties, with the rapid development of science and technology, the application of the field of engineering structures often need to combine advanced ceramic materials with metal materials, so that the advantages of the two materials complement each other, giving the best performance of ceramics. By realizing the combination of ceramic and metal brazing, improve the performance of its welded joints, can make it work in higher temperatures and harsh environments, to achieve a wider range of application prospects!

What are the applications of boron nitride in the field of electronic engineering?

High-temperature electronic packaging

Boron nitride has excellent thermal conductivity and electrical insulation properties, and can work stably in high temperature environments, so it is widely used in the field of high temperature electronic packaging. Boron nitride can be used as encapsulation material for ceramic substrate, chip carrier, heat sink and other devices, which improves the reliability and stability of electronic devices.

Power electronics heat dissipation

In the field of power electronics, high power density power electronic devices generate a large amount of heat, requiring effective heat dissipation solutions to ensure the reliability of the device. Boron nitride has high thermal conductivity and excellent thermal stability, is used as a power electronic device heat dissipation materials, can effectively transfer and disseminate heat, improve the reliability and life of the device.

Microwave dielectric ceramics：

Boron nitride ceramic has excellent dielectric properties and high temperature stability, can be used as microwave dielectric ceramic materials. This material can be used to manufacture high-frequency microwave devices, such as filters, resonators, antennas, etc., which have a wide range of applications in the fields of communications, radar and navigation.

Lightweight composite materials

Boron nitride parts has a lightweight, high strength and excellent corrosion resistance, can be compounded with other materials to make lightweight composite materials. This material can be used in the manufacture of aerospace, automotive, marine and other fields of structural and functional parts, with excellent mechanical properties and lightweight effect.

Insulating material in electronic equipment

Boron nitride has high electrical insulation properties and stable chemical properties, and can be used as an insulating material in electronic equipment. For example, it can be used in the manufacture of high-voltage capacitors, insulators, wires and cables and other products to improve the electrical performance and reliability of the equipment.

High-energy ray detectors

Boron nitride has a high density of energy absorption and good detection performance, can be used for high-energy ray detector manufacturing. This detector can be used in nuclear physics experiments, medical imaging diagnostics and other fields, providing high precision and high sensitivity measurements.

Semiconductor manufacturing

In the field of semiconductor manufacturing, boron nitride ceramic can be used as an etchant and a raw material for thin film deposition. In the semiconductor device manufacturing process, boron nitride can play the role of a protective layer to prevent damage or contamination of the device. In addition, boron nitride can be used as an electron beam evaporation source material for the preparation of various thin film materials.

Nanoelectronics

In the field of nanoelectronics, boron nitride has good nanoscale processing performance and stable physicochemical properties, which can be used to fabricate various nanoelectronic devices. For example, boron nitride can be used as the channel material of field effect transistors and the interconnect line material of nano integrated circuits to improve the performance and reliability of devices.

Magnesium Stabilized Zirconia Ceramics (MSZ)

-Unique Advantages in Modern Technology

As an advanced ceramic material, magnesium-stabilized zirconia ceramic (MSZ) has the characteristics of high melting point, high hardness, excellent wear resistance, high toughness, good thermal stability, corrosion resistance and high strength. It has wide application prospects in the fields of aerospace, energy, medical equipment, and electronics, providing new possibilities for the development of modern science and technology.

Basic characteristics of zirconia ceramics

Zirconia ceramic is a ceramic material with high melting point, high hardness, and excellent wear resistance. It has the following basic characteristics:

1) High melting point: The melting point of zirconia ceramic is as high as 2700°C, giving it excellent stability in high temperature environments.

2) High hardness: Zirconia ceramic has extremely high hardness and can resist scratches and wear, maintaining its long-term stability.

3) Excellent wear resistance: Zirconia ceramic has excellent wear resistance, allowing it to perform well in various harsh environments.

Advantages of Magnesium Stabilized Zirconia Ceramics (MSZ)

Magnesium-stabilized zirconia ceramics (MSZ) are based on zirconia ceramics, and their performance is further improved by adding an appropriate amount of magnesium stabilizer. Magnesium stabilized zirconia ceramics (MSZ) have the following advantages:

High toughness
Good thermal stability
Excellent corrosion resistance
High strength

Application of magnesium-stabilized zirconia ceramics (MSZ) in the field of modern science and technology

The following are the applications of magnesium stabilized zirconia ceramics (MSZ) in different fields:

1) Aerospace

2) Energy

3) Medical devices

4) Electronics

Materials Propertiesof magnesium-stabilized zirconia ceramics (MSZ)

Item	Properties	Unit	Value
	Color		Ivory / Gray-White
Mechanical Properties	Density	g/cm3	5.70-5.75
	Vickers hardness	Gpa	11-12
	Three point bending strength	Mpa	500
	Fracture toughness KIC	Mpa•m1/2	6-10
Thermal properties	Thermal conductivity	W/mK	2-3
	Thermal expansion coefficient	1×106/℃	10
	Thermal shock temperature	℃	350
	Maximum operating temperature	℃	1000

Machinable Aluminum Nitride BAN

BAN combines Aluminum Nitride with Boron Nitride, a hybrid machinable Aluminum Nitride ceramic with excellent thermal conductivity, high strength, and resistance to thermal shock. Innovacera provides BAN, and it has very similar properties to SHAPAL material. SHAPAL is a trademark of Tokuyama Corporation.

These ceramics are used in various industries, including electronics, semiconductor manufacturing, aerospace, automotive and medical. BAN ceramics have properties that make them suitable for applications such as heat sinks, heater substrates, semiconductor processing components, and optical equipment.

Material Advantages:

High mechanical strength.
High thermal conductivity.
Low thermal expansion.
Low dielectric loss.
Excellent electrical insulation.
High corrosion resistance–non-wetted by molten metals.
Excellent Machinabilit–BAN can be machined to high-precision complex shapes.
It has excellent sealing ability to vacuum and hasn’t given off much gas.
High-frequency wave properties, allow visible infra-red light to pass through easily.

Material Properties:

Properties	Units	BAN
Main Composition	/	BN+ALN
Color	/	Greyish- Green
Density	g/cm3	2.8~2.9
Three-Point Bending Strength	MPa	90
Compressive Strength	MPa	220
Thermal Conductivity	W/m·k	85
Thermal Expansion Coefficient (20-1000℃)	10-6/K	2.8
Max Using Temperature	In Atmosphere ℃	900
	In Inactive Gas ℃	1750
	In High Vacuum ℃	1750

Applications

Heat sinks
Vacuum components
Components where low dielectric constant and dissipation factor are required
Parts and components where a low coefficient of thermal expansion is required
Electronic components where electrical insulation and heat dissipation are required
Electric propulsion discharge channels for Hall Effect Thrusters

INNOVACERA provides a series of Boron Nitride composites, we provide our customers with a lot of solutions. If you’re looking for a high thermal conductivity and high strength solution for your application, please get in touch with us to learn more about our full range of products and how we can help you meet your thermal management needs.

An Introduction to Through Ceramic Via (TCV) interconnection technology

The Through Ceramic Via (TCV) interconnection technology is an innovative approach for high-density three-dimensional packaging. Traditional ceramic substrate metallization schemes often encounter challenges such as residual liquid inside the holes, poor adhesion, and incomplete copper filling. TCV technology, however, employs a copper paste filling method for ceramic vias, offering a simple process, complete filling, strong adhesion, and low cost.

Innovacera utilizes a sintered copper paste composed of micro-nano composites, ensuring excellent electrical conductivity and reliability. By incorporating high-temperature binders and special fillers, it’s possible to further adjust the thermal expansion coefficients of the copper via and interface, thereby achieving high-reliability copper via connections.

The TCV process flow chart

Process Characteristics:

– Wide range of depth-to-diameter ratios, with excellent flowability of the paste resulting in complete adhesion to the hole walls.

– Dry process, eliminating the residue of chemicals from copper plating.

– High process efficiency, as all holes can be completely filled by printing alone.

– High reliability, with adjustable thermal expansion coefficients.

– High efficiency, high quality, and low cost of vacuum filling process.

– Achieving effective conduction of high current with electrical resistivity close to pure copper.

– High reliability achieved through hole copper with low thermal expansion coefficient and interface layer.

Process Advantages:

1. Small dielectric constant, excellent high-frequency characteristics, reducing signal delay time.

2. Thermal expansion coefficient closer to silicon, as inorganic substrate materials generally have lower coefficients than organic ones.

3. Strong heat resistance, with inorganic substrate materials having higher glass transition temperatures than organic ones, making them less prone to damage during thermal shock and cycling.

4. High thermal conductivity, enabling efficient dissipation of heat generated by high-density packaging.

5. High mechanical strength and good dimensional stability, ensuring high component installation precision.

6. Strong chemical stability, resistant to corrosion from acids, alkalis, and organic solvents during processing, without experiencing discoloration, swelling, or other characteristic changes.

7. Excellent insulation performance, ensuring high reliability.

Processing Capabilities:

Substrate	Aluminum Oxide	Aluminum Nitride
Thermal Expansion Coefficient	6.8 ppm/K	4.7 ppm/K
Thermal Conductivity	23 W/m·K	170 W/m·K
Dimensions	<182 x 182 mm	<120 x 120 mm
Thickness	0.25 – 1 mm	0.15 – 0.63 mm
Hole Diameter	>60 μm	>60 μm
Depth-to-Diameter Ratio	<10:1	<10:1
Hole Spacing	>0.1 mm	>0.1 mm

Application:

– High-power electrical power electronic modules, solar panel components for high-frequency switching power supplies, solid-state relays.

– Automotive electronics, lasers, CMOS image sensors.

– High-power LED lighting products.

– Communication antennas, automotive ignition systems.

If you’re interested in the aforementioned materials technology, feel free to reach out to us at +86-592 5589730 or via email at sales@innovacera.com for further discussion and communication. We look forward to hearing from you!

Why is Machining Aluminum Nitride Ceramics Challenging?

Aluminum nitride ceramics, composed mainly of aluminum nitride, possess remarkable properties such as high thermal conductivity, excellent insulation, and low dielectric constant. The crystal structure of aluminum nitride consists of tetrahedral units forming a covalent-bonded compound, exhibiting a spinel-type structure within the hexagonal crystal system. With a chemical composition of 65.81% aluminum and 34.19% nitrogen, and a density of 3.261g/cm3, aluminum nitride ceramics appear white or gray-white, with single crystals being transparent and colorless. These ceramics boast a sublimation decomposition temperature of 2450°C under standard pressure, making them ideal for high-temperature applications. Additionally, their coefficient of thermal expansion ranges from 4.0 to 6.0 * 10^-6/°C, and their polycrystalline form exhibits a thermal conductivity of up to 260W/(m·K), surpassing that of aluminum oxide by 5-8 times, thus demonstrating excellent resistance to thermal shock up to 2200°C. Furthermore, aluminum nitride showcases resistance to corrosion from molten aluminum and other metals, particularly demonstrating outstanding resistance against molten aluminum corrosion.

Despite the various machining methods available for aluminum nitride ceramics, precision machining often necessitates the use of CNC equipment. However, the formidable hardness of aluminum nitride, exceeding 11 GPa, renders conventional metal machining techniques ineffective.

Firstly, machining aluminum nitride ceramics requires specialized tools and techniques distinct from those used for metals. Common tool materials such as tungsten steel should be avoided to prevent rapid deterioration of tool life. Instead, polycrystalline diamond (PCD) tools are preferred for grinding operations due to their diamond composition, enabling effective machining of aluminum nitride materials.

Equally crucial is the establishment of rational machining paths, which significantly influence machining outcomes. During CNC machining of aluminum nitride ceramics, issues like edge collapse after piercing frequently arise. Implementing appropriate machining paths can preempt such occurrences, thereby enhancing the quality of aluminum nitride ceramic products.

Secondly, equipment selection plays a pivotal role due to the hardness of aluminum nitride ceramics. Conventional CNC machine tools often lack the requisite rigidity to effectively machine these materials. Given the extreme hardness of aluminum nitride, machining inevitably induces greater vibrations than other materials. Insufficient rigidity may lead to tool chatter and jeopardize spindle accuracy. For optimal machining of aluminum nitride ceramics, dedicated ceramic machining centers with enhanced rigidity are recommended. These specialized machines mitigate vibration during machining, thereby safeguarding spindle integrity and offering superior protection against abrasive ceramic powders.

It’s worth noting that not only aluminum nitride ceramics but also other advanced ceramics share similar challenges owing to their high hardness and brittle nature. Machining ceramic materials demands not only exceptional craftsmanship but also specialized equipment.

In conclusion, the machining of aluminum nitride ceramics presents unique challenges due to their exceptional hardness and specific properties. Overcoming these challenges requires precision tools, rational machining strategies, and specialized equipment. For precision machining of ceramics, Innovacera offers tailored solutions and expertise in ceramic component manufacturing.