News | INNOVACERA

Category Archives: News

Ceramic Metalized Thin Film Pads: The Perfect Solution for High-Performance Applications

As demand for high-performance electronics continues to grow, the need for reliable and efficient thermal management solutions has never been greater. That’s why we’re excited to introduce our new line of Ceramic Metalized Thin Film Pads, the perfect solution for a wide range of demanding applications.

Our Ceramic Metalized Thin Film Pads are made from high-quality ceramic materials that offer superior thermal conductivity, excellent mechanical strength, and outstanding electrical insulation properties. These materials are combined with a layer of metal that provides excellent thermal dissipation and electrical grounding capabilities, making them ideal for use in high-performance electronic devices.

With our Ceramic Metalized Thin Film Pads, you can enjoy a number of key benefits, including:
1. Excellent Thermal Conductivity: Our pads are designed to provide excellent thermal conductivity, ensuring that heat is efficiently dissipated away from critical components.
2. Superior Mechanical Strength: Thanks to their high-quality ceramic materials, our pads offer superior mechanical strength, making them resistant to damage from impact and vibration.
3. Outstanding Electrical Insulation: The ceramic materials used in our pads provide excellent electrical insulation, helping to protect your electronic devices from damage caused by electrical interference.
4. Versatile Applications: Our Ceramic Metalized Thin Film Pads are suitable for a wide range of applications, from consumer electronics to industrial machinery and beyond.

If you’re looking for a reliable and efficient thermal management solution for your high-performance electronic devices, look no further than our Ceramic Metalized Thin Film Pads. Contact us today to learn more about our full range of products and how we can help you meet your thermal management needs.

Silicon Nitride Ceramic Feature And Application

There are many types of special ceramics and structural ceramics, silicon nitride ceramic is known as the “King of Structural Ceramics” due to its balanced performance in all aspects. It is suitable for applications with large mechanical vibration, large thermal shock, high current impact, and require high reliability and stability. The purity, particle size, and crystal form of silicon nitride ceramic powder have a significant impact on the substrate molding process, sintering process, and final product performance. Therefore, the preparation process of silicon nitride powder is particularly important.

Silicon nitride ceramic components have excellent mechanical properties, thermal properties, electrical properties and chemical properties, and is widely used in various fields. Such as Si3N4 ceramics is an excellent material for preparing ceramic substrates in various applications. Here are some common application for reference:

1. Refractory material: Silicon nitride has the characteristics of high melting point, high hardness, low expansion coefficient, etc., and is an excellent refractory material. It can be used to make refractory bricks, refractory castables, refractory coatings, etc., and is used in high-temperature kilns and equipment in steel, nonferrous metals, glass and other industries.

2. Electronic materials: Silicon nitride can be used to manufacture packaging materials, heat sinks, insulating materials, etc. for semiconductor chips, as well as microwave communication devices, optoelectronic devices, etc.

3. Abrasive part: Silicon nitride can be used to make abrasives part, such as grinding wheels, grinding heads, grinding discs, etc., for grinding hard materials such as steel, non-ferrous metals, glass, etc.

4. Bicycle industry: Excellent high-temperature mechanical properties, wear resistance and corrosion resistance feature let SI3N4 parts can be used to manufacture ceramic engine parts, ceramic cutting tools, ceramic bearings, ceramic molds, etc. High-end bicycle accessories products use silicon nitride bearings and rear derailleur guide systems using mold injection carbon fiber technology.

5. Aerospace materials: Silicon nitride has excellent mechanical properties and corrosion resistance. It can be used to manufacture engine parts, wings, fuselages, etc. of aerospace vehicles, as well as solar panels, antennas, etc. for satellites.

6. Automobile industry: Silicon nitride can be used to manufacture automobile engine parts, brake pads, clutch plates, etc., as well as automobile tires, wheel hubs, etc.

In short, silicon nitride is an inorganic non-metallic material with widely application. With the continuous development of science and technology, its application fields will continue to expand.

Finally, we would like to thank all Innovacera customers to support our ceramic products. We are honored to be your supplier and hope to continue working together in the future to help to develop the advanced ceramics industry.

The Special Characteristics of Hot Pressed Aluminum Nitride

Common Sintering Methods for Aluminum Nitride Ceramics

To prepare AlN ceramics with high thermal conductivity, two problems must be solved in the sintering process: the first one is to improve the densification of the material, and the second one is to try to avoid the lattice of oxygen atoms dissolved in the high-temperature sintering. Common sintering methods are as follows:
1. atmospheric pressure sintering
2. hot pressure sintering
3. high pressure sintering
4. atmosphere sintering
5. discharge ion sintering
6. microwave sintering

This Time, We Focus on Hot-pressing Aluminum Nitride:

In order to reduce the sintering temperature of aluminum nitride ceramics and promote the densification of ceramics, aluminum nitride ceramics can be prepared by using hot-pressure sintering, which is one of the main process methods for the preparation of high-thermal conductivity densified AlN ceramics. The so-called hot pressure sintering, i.e., sintering ceramics under a certain pressure, can make the heating sintering and pressurized molding at the same time. The AlN ceramic sintered body with a density of 3.26 g/cm3 and a thermal conductivity of 200 W/(m.K) was produced by sintering at a high pressure of 25 MPa and 1700°C for 4 h. The AlN lattice oxygen content was 0.49 wt%, which is more than 60% lower than that of the AlN sintered body obtained by sintering at 1800°C for 8 h (1.25 wt%), and the thermal conductivity was improved.

Xiamen Innovacera Advanced Materials Co., Ltd.

Has advanced production lines for aluminum nitride ceramic materials and high precision machining capabilities. We are currently able to produce Aluminum Nitride ceramic wafer in different sizes from 6-12 inches, as well as large Aluminum Nitride ceramic plates with a diameter of up to 320mm and a thickness of over 26mm. These large size ALN ceramic wafers can be used to produce high thermal conductivity aluminum nitride heating pads.

Table of Properties of Hot Pressed Aluminum Nitride:

Hot Pressed Aluminium Nitride Material Properties – SU0023
Properties		Units	Value
Color		–	Black
Bulk Density		g/cm3	–
Compressive Strength		MPa	3416
Flexural Strength		MPa	337
Modulus of Elasticity		GPa	331
Fracture Toughness		MPa·m1/2	4.93
Coefficient Linear Thermal Expansion	RT-500℃	10-6/k	5.0732
	RT-800℃		5.3463
Volume Resistivity		Ω.cm	7.0×1012
Remark: The value is just for review, different using conditions will have a little difference.

New 3D Printer Hot End – Ceramic Heating Core

What is the Difference Between the New Hot End and the Traditional Hot End?

1. The new hot end consists of the nozzle, heating element, cold end (other parts of the extruder), and integrates the heater and thermistor. This design effectively solves the problems of traditional hot ends that cannot accurately control temperature and have low thermal efficiency.

2. Due to the ability to quickly replace the nozzle, when the nozzle is clogged or stuck, just replace it with a new nozzle. Each nozzle change reconnects with the filament, so printing can be resumed in minimal time. And since the nozzle and throat are integrated into one unit, there’s also no chance of material leakage.

3. The weight and volume are reduced, so the print head takes up less space, thereby improving printing accuracy and speed.

4. Use a new heater. The heating element is smaller and faster than traditional heating blocks, and has a positive temperature coefficient (PTC) that reduces power as heat increases, preventing overheating and burning, which can cause fires.

What is a Ceramic Heating Core? What is the Difference From Traditional Heating Tubes?

Let’s first introduce the traditional hot end.

A traditional hot end consists of a nozzle screwed into an aluminum heating block that is heated by an inserted cylindrical single-head heating tube. The module also houses a removable thermistor for temperature measurement. Finally, a separate throat thermally isolates the hot end from the wire feed path, preventing it from melting on its way to the hot end. This method of heating is very inefficient and has many problems.

First, the traditional hot end is large and heavy, which affects printing accuracy and speed. If it is a direct extrusion system, the frequency of motor vibration will also be increased, further reducing accuracy and speed.

Second, there is an air gap between the heater block and the thermistor and heating tube, so effective heat transfer and accurate temperature control are not possible. This leads to the problem of being unable to print at different speeds and extrusion volumes without being able to quickly change the nozzle temperature to accommodate changing filament feed rates. This is something that all consumer printers have not yet solved.

What about the ceramic heating core?

First of all, the application of ceramic heating core makes the hot end half lighter and smaller than traditional models. In other words, the ceramic heating core replaces the traditional heating tube, allowing the hot end to be designed to be lighter and more compact than the traditional one, thereby improving printing accuracy and speed.

Secondly, the ceramic heating core has a positive temperature coefficient (PTC), specifically, it reduces power when the temperature rises, thereby reducing the risk associated with temperature runaway when the maximum temperature is reached. At the same time, because the ceramic heating core can be integrated with the thermistor, precise temperature control can be achieved.

Finally, the ceramic heating core has more uniform heating performance and thermal efficiency. To achieve the same heating performance as traditional heating tubes, ceramic heating cores may only require lower power.

What is a Ceramic Heating Core?

Ceramic heating core is a tubular ceramic heating element. It is a heating element made of alumina ceramics and metal heating resistor slurry sintered together.

Main process: Print a circuit made of metal heating paste on an alumina ceramic green body with a composition of 92-96%. After hot pressing and lamination, it is jointly sintered in a reducing atmosphere at 1500-1600°C, so it is also called alumina ceramics. fever. Heating resistor slurry is made of tungsten and some precious metals, and its composition ratio affects the heating rate.

Features of ceramic heating:

1. Heating speed is fast. Several types of heating resistor slurries developed by our company can meet the requirements of heating up to 800°C in the fastest 10 seconds.

2. The heating temperature is high, and long-term use below 450°C does not affect the service life.

3. The heat is uniform and consistent, and the temperature difference at different locations in the heating area is small.

4. Thermal efficiency is high. On the premise of ensuring the heating speed, the power can be reduced to achieve the purpose of low energy consumption.

5. The surface insulation is uncharged and can be in direct contact with water.

6. The power density is high, so the volume can be reduced to less than 1cm³ without affecting the heating performance.

7. Safe and reliable, does not contain harmful heavy metals, and has passed RoHS, CE, FDA, ISO9001 and other qualification standards.

Applications of Aluminum Nitride Ceramic Substrates for Integrated Circuits and Semiconductor Chip Mounts

Aluminum nitride is a non-natural existence of man-made crystals, with a hexagonal crystal system of fibrous zincite crystal structure, for the covalent bond is very strong compounds, lightweight, high strength, high heat resistance, corrosion resistance, has been used as a crucible for melting aluminum, but also an excellent performance of electronic ceramic materials.

Aluminum nitride ceramics with high thermal conductivity, low coefficient of expansion, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, low dielectric loss, is the ideal large-scale integrated circuit heat dissipation substrate and packaging materials, the main raw material for the manufacture of high thermal conductivity aluminum nitride ceramic substrate.

Aluminum Nitride Ceramic Substrate Advantages:

1. Excellent thermal conductivity
2. Low dielectric constant
3. Low dielectric loss
4. Reliable insulation properties
5. Excellent mechanical properties non-toxic
6. High temperature resistance and chemical corrosion resistance;

Due to the above performance, with the rapid development of microelectronic devices, high thermal conductivity aluminum nitride substrate, can be widely used in communication devices, high brightness LED, power electronics.

The thermal conductivity of aluminum nitride single crystal is about 250W, theoretically speaking, the thermal conductivity of aluminum nitride single crystal at room temperature can reach 320W, so the aluminum nitride material is very suitable for the manufacture of high heat dissipation substrate. Aluminum nitride ceramic substrate is a new type to solve the problem of high heat dissipation density, the most suitable for high integration, high heat dissipation hybrid integrated circuits with ceramic substrate and semiconductor chip mounting ceramic substrate.

Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact.

The pads are made by ceramic material such as alumina ceramic and aluminum nitride, which help in providing enhanced thermal conductivity and excellent insulation performance.

Applications of Aluminum Nitride Ceramic Substrates:

Power Devices
MOSFET Transistor
Heat Sink Interface
Integrated Circuit (IC) Chip
Packaging Heat Conduction
LED Board Thermal Interface Material (TIM)
MOS Transistor
Chip ON Film (COF) Heat Conduction
IGBT Transistor Heat Sink

Classification and Characteristics of Ceramic Substrates Commonly Used in Electronic Packaging

There are many kinds of electronic packaging substrates, and the commonly used substrates are mainly divided into plastic packaging substrates, metal packaging substrates and ceramic packaging substrates. Plastic packaging materials usually have low thermal conductivity, poor reliability, and are not suitable for high requirements. Metal packaging materials have a high thermal conductivity, but the general thermal expansion coefficient does not match, and the price is expensive.

Ceramic substrates are commonly used for electronic packaging. Compared with plastic and metal substrates, ceramic substrates have the following advantages:

1. Good insulation performance, high reliability;
2. Low dielectric coefficient, high frequency performance;
3. Low expansion coefficient, high thermal conductivity;
4. Good air tightness, stable chemical properties, and a strong protective effect on electronic systems.

Therefore, it is suitable for aviation, aerospace and other high reliability, high frequency, high temperature resistance, good air tightness product packaging. Ultra-small chip electronic components are widely used in mobile communications, computers, household appliances, automotive electronics and other fields, and their carrier materials are usually packaged with ceramic substrates.

At present, the commonly used ceramic substrate materials for electronic packaging are alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), silicon carbide (SiC), boron nitride (BN).

The Following are the Application Areas of Various Material Substrates:

1. Alumina Ceramic Substrate

Although the Al2O3 ceramic substrate has a large output and a wide range of applications, its thermal conductivity is higher than that of silicon single crystals, which limits its application in high-frequency, high-power and ultra-large scale integrated circuits.

2. Aluminum Nitride Ceramic Substrate

The preparation process of AlN powder, the core raw material of AlN ceramics, is complicated, has high energy consumption, long cycle and high price. The high cost limits the wide application of AlN ceramics, so AlN ceramic substrates are mainly used in high-end industries.

3. Silicon Nitride Ceramic Substrate

The dielectric properties of Si3N4 ceramics are poor (dielectric constant is 8.3, dielectric loss is 0.001 ~ 0.1), and the production cost is high, which limits its application as an electronic packaging ceramic substrate.

4. Silicon Carbide Ceramic Substrate

The dielectric constant of SiC is too high, 4 times that of AlN, and its compressive strength is low, which is only suitable for low-density packaging, but not for high-density packaging. In addition to integrated circuit components, array components, laser diodes, etc., it is also used for conductive structural components.

6. Boron Nitride Ceramic Substrate

BN has the advantages of high thermal conductivity, thermal conductivity almost does not change with temperature, small dielectric constant, good insulation performance, etc., and is widely used in radar window, high-power transistor tube base, tube shell, heat sink and microwave output window and other fields.

Performance of Ceramic Substrates of Various Materials:

Performance	Performance	Unit	ALN	AI2O3		SiC	BN	Si3N4
	Content	%	95	96.0	99.5	/	99-997	/
	Density	g/cm3	≥3.32	3.72	3.90	≥3.03	1.6-2.0	3.26±0.05
Thermal Performance	Maximum service temperature	℃	800	1700	1750	1300	900-2100	/
	Thermal conductivity	（W/m·K）20℃	/	24.70	30.00	90-110	35-85	/
	Thermal conductivity	（W/m·K）100℃	170	/	/	/	/	/
	Thermal Expansion	×10-6℃(25~400℃)	4.4	/	/	4.0	0.7~7.5	3.0-3.2
		×10-6℃(25~800℃)	/	8.2	8.2	/	/	/
		×10-6℃(20~100℃)	/	/	/	/	1.5-2.8	/
Electrical performance	Electrical resistivity(Ω*cm)	Ω·cm (25℃)	＞1014	＞1015	>1015	/	＞1014-＞1013	>1018
	Electrical resistivity(Ω*cm)	Ω·cm (300℃)	/	/	/	/	/	/
	Dielectric constant	1MHz(10±0.5)GHz	8.9	8.3	8.7	40	4.0	9.4
	Dielectric loss	(×10-4)(1Hz)	3~10	0.0002	0.0001	/	/	/
	Withstand voltage	(kV*mm-1)	15	10	10	0.07	300～400	100
Mechanical property	Hardness(HV)	MPa	1000	25		91-93(HRA)	/	160-1800
	Bending strength	MPa	≥410	300～350		≥350	40～80	700-800
	Elastic modulus	GPa	320	370		350	/	320
Toxicity	/	（W/m·K）20℃	No	No		No	No	No

Characteristics and Applications of Aluminum Nitride Ceramics

Aluminum nitride ceramics have excellent thermal conductivity, reliable electrical insulation, low dielectric constant and dielectric loss, non-toxic and matched with the coefficient of thermal expansion of silicon, a new generation of highly integrated semiconductor substrate and the ideal packaging material for electronic devices, but also can be used for heat exchangers, piezoelectric ceramics and thin films, thermally conductive filler.

AlN ceramics are used as copper-clad substrates, electronic packaging materials, ultra-high-temperature device packaging materials, high-power device platform materials, high-frequency device materials, thin-film materials for sensors, materials for optical electronics, coatings and functional enhancement materials.

Application:

1. Heat dissipation substrate and electronic device packaging

Ideal for packaging hybrid power switches and microwave vacuum tube housings, as well as substrates for large-scale integrated circuits.

2. Structural Ceramics

AIN ceramics are heat and erosion resistant and can be used to make crucibles, Al evaporation dishes, semiconductor electrostatic chucks, and other high temperature corrosion resistant parts.

3. Functional Materials

Aluminum nitride can be used to make high-frequency, high-power devices that can be used at high temperatures or in the presence of radiation, such as high-power electronics and high-density solid-state memory.
High-purity AlN ceramics are transparent and have excellent optical properties, which, combined with their electrical properties, can be used to create functional devices such as infrared deflectors and sensors.

4. Inert heat-resistant materials

AlN as a heat-resistant material can be used as crucibles, protective tubes, casting molds and so on. Aluminum nitride can be in 2000 ℃ non-oxygenated atmosphere, still has a stable performance, is an excellent high-temperature refractory materials, resistance to molten metal erosion ability.

5. Heat exchanger parts

Aluminum nitride ceramics with high thermal conductivity, low coefficient of thermal expansion, excellent thermal conductivity and thermal shock resistance can be used as ideal heat-resistant impulse and heat exchanger materials, for example, aluminum nitride ceramics can be used as heat exchanger materials for marine gas turbines and heat-resistant parts for internal combustion engines.

6. Filler material

Aluminum nitride has excellent electrical insulation, high thermal conductivity, good dielectric properties, good compatibility with polymer materials, is an excellent additive for polymer materials for electronic products, can be used for TIM filler, FCCL thermal conductivity dielectric layer filler, widely used in electronic devices, heat transfer medium, and thus improve efficiency, such as the CPU and the heatsink to fill in the gap, the high-power transistor and silicon components and the substrate in contact with the slit place Thermally Conductive Fillers.

Advantages of Machinable Glass Ceramic

The most prominent feature of machinable ceramics is its good machinability. It can be turned, milled, planed, sawed, ground, cut, tapped, etc. using general-purpose metal processing equipment into a variety of parts with complex shapes, and can achieve a fairly high degree of machining accuracy. No special tools and equipment are required.

Machinable Glass Ceramic Ceramic Roller For Vacuum Environment Application

Machinable Glass Ceramic have excellent electrical insulation properties, high mechanical strength, resistance to rapid cooling and heating (widely used in welding fixtures, optical glass molding dies, etc.). Its corrosion resistance is also superior to ordinary ceramics, relative to PTFE, it is more resistant to corrosion, not aging, long service life so that it is used in various types of chemical equipment.

Machinable ceramics have high volume resistivity and high dielectric strength, making it an excellent electrical insulation material. It has excellent insulation and dimensional stability, and it is completely non-porous, non-absorbent, and does not outgas at 1000℃, so it can be applied in the vacuum field; good corrosion resistance, it can be used as heat-resistant parts in corrosive environments and parts in three-waste treatment devices; machinable ceramics have good thermal shock resistance, ultra-high vacuum stability, resistance to high and low temperatures, dimensional stability, and a specific gravity that is lighter than luminum, etc., which makes it It has become a universal material in the field of astronautics.

Machinable Glass Ceramic not only has the nature of ceramic materials, but also has the characteristics of metal materials, the combination of the two together, so that can be processed ceramics have many excellent features at the same time, but also has no ceramic materials, high toughness, general industrial ceramics because of the low strength, so in the application of structural materials has great limitations, and can be processed ceramics is not too big a concern, so in many cases, can be processed ceramics ceramics can be used in place of other industrial ceramics, and the use of the effect is not a big difference.

Machinable Glass Ceramic Material Properties – SU0005:

Properties:	Units:	Remark:
Density	g/cm3	2.6
Hardness	Mohs	4~5
Color	–	White
Coefficient of Thermal Expansion -50°C~200°C (Average value)	°C	7.2×10-7
Thermal Conductivity	W/m.k (25°C)	1.71
Continuous Operating Temperature	°C	800
Flexural Strength	MPa	>108
Compressive Strength	MPa	>508
Impact Toughness	KJ/m2	>2.56
Elasticity Modulus	GPa	65
Dielectric Loss	(1~4)×10-3	RT
Dielectric Constant		6~7
Dielectric Strength (The thickness of sample: 1mm)	KV/mm	>40
Volume Resistivity	Ω.cm (25°C)	1.08×1016
1.5×1012Ω.cm	°C	200
1.1×109Ω.cm	°C	500
The Normal Temperature Outgassing Rate (Vacuum sophisticated 8 hrs)	ml/s. cm2	8.8×10-9
Helium Through Rate (After firing at 500°C, cooling to room temperature)	ml/s	1×10-10
5% HC1 (95°C, 24 hours)	mg/cm2	0.26
5% HF	mg/cm2	83
50% Na2CO3	mg/cm2	0.012
5%NaOH	mg/cm2	0.85

Machinable Glass Ceramic Related Products:

Machinable Glass Ceramic Structural Parts:

Machinable Glass Ceramic Ceramic Blocks:

Machinable Glass Ceramic Ceramic Pads:

Machinable Glass Ceramic Rings:

Machinable Glass Ceramic Tubes:

Innovacera Invite You To Visit Us At Ceramitec 2024 Exhibition On A6.145

In the 2024 year, Innovacera will attend 4 foreign exhibitions including the Ceramitec 2024. If you happen to have attended or visit them, too, welcome to come to meet us at the exhibition. Below is more information about Ceramitec 2024.

Exhibition Name: Ceramitec 2024
Date: Apr. 9-12, 2024
Location: Trade Fair Center Messe München; Am Messeturm, 81829 Munich
Ceramitec 2024 Scale: -30,000 M²
Audience: 10,000 people from 34 countries
Organizer: Messe München
Innovacera Advance Ceramic Material will show: Alumina Ceramic, Zirconia Ceramic, Aluminum Nitride, Boron Nitride Ceramic, Porous Ceramic, Silicon Nitride Ceramics, Machinable Glass Ceramic, Silicon Carbide Ceramics.
Exhibition Web: https://ceramitec.com
Innovacera Booth No.: A6 Hall 145

Innovacera will exhibit all kinds of technical ceramic components such as Metallized Ceramics, Ceramic Carrier Plates, Ceramic Separation Rings, Ceramic Robotic Arm End Effectors, Ceramic Heaters, Ceramic Substrates, Ceramic Bases, Ceramic Shells, Ceramic Reflector Cavities, AMB Silicon Nitride Substrate, DBC, DPC, ceramic welding parts and so on.

Ceramitec 2024 stands as the pinnacle event for the ceramics industry, providing a platform to explore the latest trends and innovations. Visitors will delve into the impact of technologies such as additive manufacturing, Industry 4.0, and sustainability on the ceramics sector. The event is a unique opportunity to immerse oneself in the future of ceramics and gather invaluable insights to shape and enhance business strategies.

The trade fair encompasses the entire ceramics industry, uniting producers, users, and scientists. Attendees can explore a comprehensive range of machinery, devices, processes, and raw materials. From classic ceramics to industrial ceramics, technical ceramics, powder metallurgy, and the latest in 3D printing and additive manufacturing, ceramitec 2024 covers every facet of this dynamic industry.

Innovacera cordially invites all old customers, industry professionals, partners, and enthusiasts to visit booth A6 145 at Ceramitec 2024. Innovacera Vissio is: To be the most reliable supplier of advanced materials components and Mission is Winning with our customers and employees.

What Are The Differences Between Thermally Conductive Silicone Sheets And Ceramic Heat Sinks

From the aspects of temperature resistance range, material hardness, insulation performance, thermal conductivity, bonding performance, etc., the specific distinctions are as follows.

Thermal Conductive Silicone Sheet Performance and Characteristics

1. Thermal Conductive Silicone Sheet Temperature Resistance Range:

The high temperature working range of high thermal conductivity silicone sheets is 200℃, but ceramic heat sinks can be used normally in high temperature environments above 1700℃.

2. Material Hardness of Thermally Conductive Silicone Sheet:

Thermal conductive silica gel sheet is an elastic silica gel material with good compressibility, while ceramic heat sink is a high-hard ceramic material. In terms of hardness, ceramic heat sink fin is much higher than thermal conductive silica gel sheet.

3. Insulating Properties of Thermally Conductive Silicone Sheets:

The breakdown voltage of the thermally conductive silicone sheet is 4.5KV/mm, while the breakdown voltage of the ceramic heat sink is 15KV/mm, and the volume resistance of the ceramic heat sink is also as high as 1012Ω·m.

Ceramic Heat Sink Performance and Characteristics

1. Thermal Conductivity of Ceramic Heat Sink:

The thermal conductivity of thermal silica gel sheets is far inferior to that of thermally conductive ceramic sheets doped with a large amount of alumina and aluminum nitride. The thermal conductivity of alumina ceramic heat sinks is more than 5 times that of high thermal conductivity silica gel sheets.

2. Fitting Performance of Ceramic Heat Sink:

The good insulation and soft tape properties of the thermally conductive silicone sheet make it extremely superior in conformability, and also make it widely used in heat conduction and heat dissipation on the chips of various electronic products. However, the heat transfer of the thermally conductive ceramic sheet requires a certain amount of thermal conductivity. Silicone grease increases its conformability, which is one of the main reasons why thermally conductive ceramic sheets are not widely used in electronic products for heat conduction and heat dissipation.

The Following is A Summary:

Thermal conductive material	Thermal conductive silicone sheet	Ceramic heat sink
Temperature resistance range	200℃	1700℃
Hardness	Low	High
Insulating (breakdown voltage)	4.5KV/mm	15KV/mm
Thermal conductivity	Low	5 times
Fitting performance	Good	Not very good

Conclusion

Because each thermal conductive material has electronic thermal conductivity and heat dissipation application scenarios that are adapted to its characteristics, customers need to choose the required heat dissipation material according to their needs.