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Aluminum Nitride – High Thermal Conductivity Material

Aluminum Nitride combines high thermal conductivity with strong electrical resistance. They are an excellent solution for many electronic applications— allowing electrical systems to dissipate heat quickly for maximum efficiency.

Thermal conductivity measures how well a material spreads heat within itself. Cooking pans have high thermal conductivity allowing evenly distributed heat to pass quickly into the food. On the other hand, insulative gloves are used to handle hot objects because their low thermal conductivity prevents heat from transmitting to sensitive hands. Technical ceramics are extraordinarily versatile, exhibiting a wide range of thermal conductivity.

Aluminum Nitride – High Thermal Conductivity Material

Ceramic thermal conductivity compare

Below is our Aluminum Nitride Ceramic material data sheet.

Aluminium Nitride Material Properties
Properties		Value
Bulk Density(g/cm³)		>=3.3
Water Absorption		0.00
Flexural Strength(MPa)		>300
Vickers Hardness (Gpa)		11.00
Modulus Of Elasticity (Gpa)		>200
Dielectric Constant(1MHz)		8.80
Coefficient Linear Thermal Expansion	/℃，5℃/min, 20-300℃	4.6*10^-6
Thermal Conductivity	30 degree Celsius	>=170
Volume Resistivity(Ω.cm)	20 degree Celsius	>10¹⁴
	300 degree Celsius	10⁹
	500 degree Celsius	10⁷
Dielectric Strength(KV/mm)		15-20
Remark: The value is just for review, different using conditions will have a little difference.

Infineon has officially launched the new EasyDUAL™ CoolSiC™ power module, which uses aluminum nitride ceramics and has a half-bridge structure. It is suitable for 1200V high-power application scenarios, including solar uninterruptible power systems, auxiliary inverters, energy storage systems, and electric vehicle chargers. The CoolSiC module technology equipped with aluminum nitride ceramics can reduce the thermal resistance of the heat sink by up to 40%, which can increase the output power or reduce the operating temperature and improve the service life of the system.

We will work with you to find the optimal material for your application.

What are the uses of Boron Nitride Ceramics?

Nitride Boron can be used in the manufacture of crucibles for smelting semiconductors and metallurgical high-temperature vessels, amorphous strip nozzles, semiconductor heat dissipation insulation parts, high-temperature bearings, thermocouple bushing, and glass forming molds.

Usually produced Boron Nitride is a graphite-type structure, commonly known as white graphite. The other is diamond type. Similar to the principle of transforming graphite into diamond, graphite-type boron nitride can be transformed into diamond-type boron nitride under high temperature (1800℃) and high pressure (800Mpa).

The B-N bond length (156pm) of this boron nitride is similar to the C-C bond length (154pm) of a diamond, and the density is similar to the diamond. The hardness of this boron nitride is similar to diamond, but the heat resistance is better than diamond. It is a new type of superhard material with high-temperature resistance, which is used to make drill bits, grinding tools, and cutting tools.

What are the uses of Boron Nitride Ceramics

Boron Nitride Material Properties-SU0012

Properties	Units	UHB	HB	BC	BMS	BMA	BSC	BMZ	BAN
Main Composition	BN>99.7%	BN>99%	BN>97.5%	BN+AL+SI	BN+ZR+AL	BN+SIC	BN+ZRO2	BN+ALN
Color	White	White	White	White Graphite	White Graphite	Greyish Green	White Graphite	Greyish Green
Density	g/cm3	1.6	2	2.0-2.1	2.2-2.3	2.25-2.35	2.4-2.5	2.8-2.9	2.8-2.9
Three-Point Bending Strength	MPA	18	35	35.00	65	65	80.00	90	90.00
Compressive Strength	MPA	45	85	70.00	145	145	175.00	220	220.00
Thermal Conductivity	W/m·k	35	40	32.00	35	35	45.00	30	85.00
Thermal Expansion Coefficient (20-1000℃）	10-6/K	1.5	1.8	1.60	2	2	2.80	3.5	2.80
Max Using TemperatureIn Atmosphere In Inactive Gas In High Vacuum (Long Time)	(℃）	900 2100 1800	900 2100 1800	900 2100 1900	900 1750 1750	900 1750 1750	900 1800 1800	900 1800 1800	900 1750 1750
Room Temperature Electric Resistivity	Ω·cm	>1014	>1014	>1013	>1013	>1013	>1012	>1012	>1013
Typical Application:	Nitrides Sintering	High Temperature Furance	High Temperature Furance	Powder Metallurgy	Powder Metallurgy	Powder Metallurgy	Metal Casting	Powder Metallurgy
High Temperature Electrical Furnace Components (High Temperature Insulator Sleeve Tube etc)	√	√	√	√	√	√	√
Metal Vaporize Crucible	√	√	√
The Container Of Metal or Glass Melting	√	√	√	√	√	√	√	√
The Casting Mould Components Of The Precious Metal And Special Alloy.	√	√	√
High -Temperature Support Part	√	√	√
Nozzle And Transport Tube Of The Melting Metal	√	√	√	√	√	√	√
Nitrides Sintering	√

Remark: The value is just for review, different using conditions will have a little difference

Application fields and precautions of silicon nitride ceramic igniters

Silicon nitride ceramics have the characteristics of high strength, high-temperature resistance, thermal shock resistance, oxidation resistance, wear resistance, and corrosion resistance, and are the first candidate materials for ceramics used in thermal engine parts.

Application-fields-and-precautions-of-silicon-nitride-ceramic-igniters

The silicon nitride ceramic igniters can heat up to 800~1000°C within ten seconds, and ignite the fuel through direct heat transfer or blast heat transfer. A temperature buffer area is set on the ignition rod to protect the terminals from damage. The wire joints are insulated and encapsulated, which can effectively prevent short circuits caused by conductive ash. With proper installation and ignition procedures, silicon nitride ceramic igniters can be used safely for years.

Application fields:

Biomass boiler igniter, straw incinerator igniter
Gas and oil igniters (such as natural gas)
Automobile exhaust and industrial waste gas treatment
Gas heating (air, working gas)
Pyrotechnic generator
Brazing equipment
Corrosive environment heater
Customization of laboratory special heating elements and heating systems

Precautions:

It is necessary to use reasonable installation methods and ignition procedures to ensure the working life of the igniter.
It is necessary to determine the appropriate gas flow rate according to the selected igniter model. If the flow rate is too small, the load on the igniter will be too large, and the surface temperature will exceed the rated value. When designing the airflow channel, it should be ensured that the airflow is fully in contact with the igniter and that the heat dissipation around the igniter is sufficient.
Do not place any part of the igniter in the combustion chamber.
A model with a larger hot zone or a combination of multiple igniters can provide a faster ignition speed.
The package end of the igniter should have good heat dissipation, and the igniter should be turned off in time after the ignition is successful.

Innovacera produces silicon nitride igniters. In addition to the existing regular products of silicon nitride ceramic heaters, we can also provide customized services according to customer requirements or drawings.

If you are interested, welcome to contact us when you feel free. Any inquiries or questions will get our response quickly.

Why Polish Ceramic Substrates?

Alumina Oxide is one of the most cost-effective and widely used substrate materials in microelectronic applications. While many customers will be satisfied with an as-fired surface for their applications, there are four major benefits of ceramic substrate polishing:

Finer Line Patterns

After the fine grinding and polishing process, the ceramic substrate can get finer pattern lines, which is beneficial to the denser circuit design ability and is conducive to fine-pitch, high-density interconnection circuits.

An as-fired surface finish is generally adequate for lines as thin as 1 mil in thin-film applications and 5 mils in thick-film applications. Forming finer lines than these on as-fired surfaces will exhibit poor pattern definition resulting in increased conductor resistance, which inhibits current flow and reduces circuit performance. Poor pattern definition can also contribute to performance anomalies in RF and microwave circuits, so we will polish it.

Better Top and Bottom Surface Parallelism

Grinding and polishing the substrate can improves the parallelism between the top and bottom surfaces. The benefit is that the capacitance and inductance of the substrate can be more tightly controlled when the substrate is metalized and patterned. Since capacitance and inductance are the main factors determining impedance, increased parallelism can improve the predictability and performance of RF and microwave circuits.

99.6% Alumina Polishing Ceramic Substrates

Why Polish Ceramic Substrates

Thinner Metallization Layers

Polishing reduces the amplitude of peaks and valleys on the substrate surface enabling the use of significantly thinner metalization layers. Thinner resistive layers increase the sheet resistance of the material, which allows for higher resistance values when using thin-film technology—especially when using serpentine patterns.

Better Optical Performance

The very nature of fabricated optical devices demands surface smoothness and flatness beyond that typically required by microelectronics. Generally, light must be precisely moved around, bent reflected, split, sent through fibers, and used in ways that were not intended by nature. All of this has to be accomplished with as little loss of light as possible. In most cases, the colors can’t be altered or shifted within the spectrum. Polishing and super polishing are the only means that can achieve highly reflective or transmissive surfaces. The surface must be polished and flattened to a small fraction of a wavelength for optimum performance.

What Are The Advantages Of Metallized Ceramic Substrates In LED Packaging?

The ceramic-based metalized substrate has good thermal and electrical properties. It is an excellent material for power LED packaging, purple light, and ultraviolet light. It is especially suitable for multi-chip packaging (MCM) and substrate direct bonding chip (COB), etc. package structures.

Classification：

① HTCC and LTCC

HTCC and LTCC belong to earlier developed technologies, but due to the high sintering temperature, the selection of electrode materials is limited, and the production cost is relatively expensive. These factors promote the development of LTCC. Although LTCC reduces the co-firing temperature to about 850°C, however, it has the disadvantages of difficult control such as dimensional accuracy and product strength.

② DBC and DPC

Direct copper coating (DBC) technology is a ceramic surface metallization technology developed mainly based on Al2O3 ceramic substrates and later applied to AlN ceramics. It has been successfully applied in the fields of high-power power semiconductor modules, solar panel components, automotive electronics, aerospace and military electronic components, and intelligent power components.

Advantages:

Good thermal expansion

The ceramic metalized substrate can effectively solve the problem of heat dissipation, thereby alleviating the problem of thermal expansion and contraction of different materials of the components on the ceramic substrate, and improving the durability and reliability of the whole machine and electronic equipment.

Dimensional stability
Good heat dissipation

The ceramic material itself has properties such as high thermal conductivity, good heat resistance, high insulation, high strength, and matching with chip materials. It is very suitable as a power device LED packaging ceramic substrate and has been widely used in semiconductor lighting, laser and optical communication, aerospace, automotive electronics, and other fields

If you have more interesting, pls consult with us.

What Are The Advantages Of Metallized Ceramic Substrates In LED Packaging

Zirconia Ceramic Block for Dental

In recent years, the continuous advancement of dental technology has enabled patients to enjoy safer, more efficient, and more comfortable treatment experiences. Among them, a material called zirconia ceramic is becoming the new favorite in the field of dentistry.

Zirconia ceramic is a high-strength, wear-resistant, and highly transparent ceramic material that can be used to produce various types of dental restorations, such as all-ceramic crowns, bridges, and porcelain veneers. Compared with traditional metal-ceramic restorations, zirconia ceramics not only have better biocompatibility but also are closer to the color and transparency of natural teeth, providing patients with a more natural and aesthetically pleasing effect.

In addition, the production process of zirconia ceramics is also very advanced. Through technologies such as computer-aided design and digital processing, high-precision customization can be achieved, greatly improving the adaptability and precision of the restorations. At the same time, zirconia ceramics have high hardness and can effectively resist the impact of biting force, with a long service life.

Currently, zirconia ceramics have become one of the popular materials in the field of dentistry, receiving extensive application and promotion. With the continuous advancement and expansion of technology applications, it is believed that zirconia ceramics will play an increasingly important role in the field of dental restorations, bringing better oral health and aesthetic effects to patients.

Properties	Units	Value
ZrO2+HfO2+Y2O3	%	≥99
Y2O3	%	4.5-6.0
HfO2	%	≤0.5
Al2O3	%	≤0.5
Other Oxides	%	≤0.5
Flexural Strength (3 point)	MPa	1200±100
Translucency	%	43
Vickers-hardness HV10	–	1300±50
Density	g/cm³	＞3.00
Sintered Density	g/cm³	＞6.02
Chemical Solubility	μg/cm²	＜50
Radioactivity	Bq·g-1	＜0.1
Fracture toughness	Mpa.m1/2	＞5.5
CTE	K-1	（ 10.5±0.5） *10-6

Zirconia Ceramic Block for Dental

What is ENIG Plating

ENIG (Electroless Nickel Immersion Gold) is a surface plating that is applied over the copper pads on a Printed Circuit Board to protect them from corrosion and other abnormalities. Initially, the copper pad is covered by a Nickel (Ni) layer followed by a thin immersion Gold (Au) layer. ENIG provides good oxidation resistance, and excellent surface planarity and allows for easy soldering which results in excellent electrical performance of the PCB board.

What is ENIG Plating PCB Substrates

ENIG is one of the most used PCB surface finishes. And it is more complex and expensive when compared to other PCB plating processes like HASL.

ENIG is a two-layer metallic coating – Nickle is the barrier to the copper pad and is also the material to which components are soldered. Gold on the other hand protects the Nickle during storage and also provides low contact resistance. Typical Nickle thickness varies from 4 – 7 µm and Gold thickness varies from 0.05 – 0 23 µm. ENIG requires a processing temperature of around 80 °C.

What is ENIG Plating PCB Substrates

Advantages of ENIG Surface Finishes:

It provides impressive wettability, surface planarity, coplanarity, and long shelf life (up to 12 months) to the PCB board since immersion gold has strong chemical properties.
In ENIG, the nickel layer acts as a barrier and stops the interfusion between gold and copper. It also produces an intermetallic compound (IMC) Ni3Sn4 to provide good solderability after reacting with Tin.
It has low contact resistance, high strength, reduces oxidation, and provides anti-friction. Overall, it enhances circuit conductivity requirements.
It provides good plating over the copper pads and via holes.
Its excellent surface planarity allows the components to be soldered flat onto the pad, making it ideal for BGA pads and other fine-pitch components.

Limitations of ENIG Surface Finishes:

ENIG is an expensive surface finish technology
It has undesirable magnetic properties
Not good for rework and makes PCB repair very difficult

The metallized ceramic is used in critical assemblies brazed. Innovacera as a metallized ceramics supplier, provides you with custom services for metallized ceramic parts.

Welcome to contact us if you are interested.

PCB Substrate

INNOVACERA will attend The ACE 2023

In the 2023 year, Innovacera will attend 2 foreign exhibitions which are The ACE 2023 and SEMICON Europa 2023. If you happen to have attended or visit them, too, welcome to come to meet us at the exhibition.

ACE 2023     (13^th International Advanced Ceramics Exhibition）
Date:  7/5/2023 – 7/7/2023
Address: Goyang-si KINTEX Exhibition Hall 1
Scale: – 350 companies, 600 booths (total)- Audience: 10,000 people from 40 countries
Organizer: Nano Technology Research Association
Products: Metallized Ceramics, Ceramic Heater, Ceramic Substrate, Ceramic Base, Ceramic Shell, Ceramic Reflector Cavity, Laser Ceramic Head, Reflector Mirrors.           Material: Alumina Ceramic, Zirconia Ceramic, Aluminum Nitride, Boron Nitride Ceramic, Porous Ceramic, Silicon Nitride Ceramics, Beryllia Ceramics, Machinable Glass Ceramic, Silicon Carbide Ceramics.
Exhibition Web:  http://aceramic.or.kr/ Innovacera Booth No.: Will come soon.

INNOVACERA will attend The ACE 2023

Korea’s only high-tech ceramic exhibition

ACE 2023 is Korea’s only high-tech ceramic exhibition where you can trade, exchange, and cooperate with advanced ceramic technology, materials/parts, and the latest equipment.

ACE 2023, which celebrates its 13th anniversary this year, is continuously growing as a specialized exhibition representing the Korean advanced ceramic industry by concentrating on the core capabilities of the advanced ceramic industry, academia, research institute, and government.

The International Advanced Ceramic Exhibition is an exhibition with strong synergistic effects due to technological convergence. In addition to cutting-edge ceramics, 5 exhibitions are being held at the same time, covering cutting-edge fields such as nanotechnology, laser technology, smart sensors, and adhesive coating films. Please meet buyers from various industries through the Advanced Ceramics Exhibition and experience the synergy effect of technological convergence.

The main visitors of the Advanced Ceramics Exhibition are final and intermediate decision-makers who wish to introduce new businesses and product innovations, plan and implement national R&D projects, and discover new partners through the introduction of the latest technologies and solutions. 85% of the total visitors are composed of buyers, and more than 50% of them are more than final and intermediate decision-makers, which corresponds to the nature of professional business.

INNOVACERA Will Attend The SEMICON Europa 2023

Mostly Every year Innovacera attends an international trade show for technical ceramic solutions and electronics, optical, and semiconductor manufacturing industry. Due to the COVID-19 pandemic, Innovacera long time didn’t take a part in the international trade show, so this 2023 year, we are delighted to announce our participation as an exhibitor in Semicon Europa 2023 and ACE 2023. Welcome to join us at booth #B2-664 in Semicon Europa 2023.

Visit our booth B2-664 and learn more about the innovative technical ceramic components and technical ceramic solutions from Innovacera for semiconductor Industry applications.

From the product of Metallized Ceramics, Ceramic Carrier Plates, Ceramic Separation Ring, Ceramic Robotic Arm End Effectors, Ceramic Heaters, Ceramic Substrates, Ceramic Bases, Ceramic Shells, Ceramic Reflector Cavities, AMB Silicon Nitride Substrate, DBC, DPC, ceramic welding parts and material of Boron Nitride Ceramic, Pyrolytic boron nitride, Aluminum Nitride, Alumina Ceramic, Zirconia Ceramic, Porous Ceramic, Silicon Nitride Ceramics, Beryllia Ceramics, Machinable Glass Ceramic, Silicon Carbide Ceramics. We offer you a wide range of advanced ceramic components for semiconductor manufacturing.

Innovacera SEMICON Europa 2023

SEMICON Europa 2023 co-located with productronica 2023

Date: Nov 14–17, 2023

Innovacera Booth No.: B2664

Address: Neue Messe München, Munich, Germany

Scale: more than 130 exhibitors and attracted over 3,500 attendees from 54 countries.

Organizer: SEMICON Europa, Semi

Exhibition Web: https://www.semiconeuropa.org/

About the SEMICON tradeshows:

SEMICON Europa is an international trade fair for the semiconductor industry that is scheduled to take place in November 2023 in Munich, Germany. The event provides an opportunity for companies in the semiconductor industry to showcase their products and services, as well as network with other industry professionals and attend informative seminars and workshops.

SEMICON Europa 2023 is the strongest single event for electronics manufacturing in Europe and is constantly broadening the range of attendees across the electronics chain.

The convention attracts a highly influential audience from every segment and sector of the European microelectronics industries including semiconductors, LEDs, MEMS, printed/ organic/ flexible, and other adjacent markets. Exhibitors and attendees meet to enact change and address industry-shaping trends.

SEMICON Europa 2023

How To Detect The Abnormal Operation Of Zirconium Dioxide Oxygen Sensor?

The detection method of zirconium dioxide oxygen sensor is as follows:

01 Decoder detection

The abnormal operation of the oxygen sensor will store the fault code in the ECU. Therefore, through a dedicated decoder or a general decoder, the fault code 00525 of the oxygen sensor can be found-there is no signal from the oxygen sensor G39, G130, or the oxygen sensor G39, G130 is short-circuited to the positive electrode, and the oxygen can also be judged by reading the data stream. If the oxygen sensor reading stays at a constant value or changes slowly for a long time, it means that the oxygen sensor is faulty.

02 Detect the resistance of the heating element

At room temperature, it can be tested with a multimeter. When testing, unplug the oxygen sensor harness plug and test the resistance between terminals T4C/1 and T4C/2 on the plug. The resistance should be 1~5Ω at room temperature. If the resistance value is ∞ at normal temperature, it means that the heating element is open and the oxygen sensor should be replaced.

03 Detect the power supply voltage of the heating element of the oxygen sensor.

The voltage of the heating element of the oxygen sensor is the battery voltage. When the ignition switch is turned on and the contact of the fuel pump relay is turned on, the power of the heating element is turned on. When detecting the voltage of the heating element, unplug the oxygen sensor, start the engine, and detect the voltage between the terminals T4C/1 and T4C/2 on the connector socket. The voltage value should not be lower than 11V. If the voltage value is zero, it means that the fuse S5 (10A) is open or the contact of the fuel pump relay is not in good contact, and it can be repaired separately.

04 Detect the signal voltage of the sensor

When the operating temperature of the oxygen sensor is lower than 300°C, the oxygen sensor does not reach the normal operating temperature and there is no signal output. Therefore, the output voltage of the zirconium dioxide oxygen sensor should be measured when it is in the working state of 300°C or higher. The specific method to check the zirconium dioxide oxygen sensor with the auto multimeter pressure measurement method: run the engine speed at 2500r/min for about the 90s, connect the plug to the socket, and connect the digital multimeter to the oxygen sensor terminals T4C/3 and T4C/4 The signal voltage should be 0.7~1.0V when the engine is supplied with rich air (accelerator pedal is suddenly stepped on); when the engine is supplied with lean air (unplug the vacuum tube between the airflow sensor and the engine), the signal The voltage should be 0.1~0.3V; otherwise, the oxygen sensor is damaged and should be replaced.

How To Detect The Abnormal Operation Of Zirconium Dioxide Oxygen Sensor-thimble oxygen sensor

05 Detect the signal change frequency of the oxygen sensor

A light-emitting diode and a 300Ω resistor can be connected in series between the wires connected to the T4C/3 and T4C/4 terminals of the sensor for detection. The anode of the diode is connected to the 3# terminal, and the cathode of the diode is connected to the 4# terminal of the connector via a 300Ω resistor. When the engine is idling or running at part load, the LED should flash. The flashing frequency should not be less than 10 times per minute. If the diode does not flash or the flashing frequency is too low, it means that the oxygen sensor is damaged and the sensor should be replaced.

06 Oscilloscope detection

Using an oscilloscope to detect the signal waveform output by the oxygen sensor can intuitively determine whether the oxygen sensor is good. Test method: start the engine and warm up the sensor to over 300℃. When the engine is in closed-loop operation, connect the probe to the signal terminals T4C/2 and T4C/3 of the sensor connector, and the engine will increase its speed from idling. Observe the output signal waveform of the oxygen sensor and compare it with the standard waveform to judge the quality of the sensor.